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Annealing Processes

The rapid transfer of heat and the mechanics of blowiag the bottie creates both thermal and mechanically iaduced stresses ia the newly formed bottie. To reheve the stresses, the newly formed botties ate put through an annealing process. [Pg.451]

Fusion-cast refractories are formed by first melting the material in an electric arc. The Uquid is poured into a mold and allowed to cool. Various annealing processes and refining techniques ensure a uniform and stmcturaUy sound shape. The case form is then cut or ground to size. [Pg.31]

The contact between the aluminium layers and the ceramic substrate requires a joining material which will wet both metal and ceramic, and solders such as the conventional Pb-Sn alloy have been used which are molten during the annealing process. The contact between the solder and the aluminium layer is frequently unsatisfactoty because of the intervention of the AI2O3 layer, and a practical solution appears to be to place drree layers of metal clrromium in contact widr the aluminium, copper in contact with the clrromium, and gold between the copper layer and the solder. [Pg.220]

The influence of the annealing process at a higher temperature was also studied, and important changes in the properties of a sample annealed at 55°C during 5 days (PTEB-CR sample) were observed [33]. The PTEB-CR specimens were stretched at 1 and 10 cm/min, but the behavior was similar in both cases. Typical stress-strain plots are shown in Fig. 14 for samples stretched at 23°C... [Pg.391]

To avoid the slight oxidation of the steel surface during the bright-annealing process that precedes tinning. The harmful, so called pickle-lag layer so produced is detected by its resistance to 10 N HCl. [Pg.506]

Figure 24. P-C isotherms of Mm(Ni-Co-AI -Mn)47f> alloys prepared through a rapid quenching and/or annealing process. Figure 24. P-C isotherms of Mm(Ni-Co-AI -Mn)47f> alloys prepared through a rapid quenching and/or annealing process.
Symons12 also found that in the case of irradiated (CD3)2SO at 77 K during the annealing process the hfs is changed from the value of the adduct (2.95 G) to that of the free CD3 radicals (3.5 G). [Pg.892]

Naimpally, A., A Study of the Annealing Processes for Doped Glasses Deposited by the Chemical Vapor Deposition Process, Y4MPE J., pp. 24-5 (Sept/Oct 1988)... [Pg.322]

In a more general application, thermoluminescence is used to study mechanisms of defect annealing in crystals. Electron holes and traps, crystal defects, and color-centers are generated in crystals by isotope or X-ray irradiation at low temperatures. Thermoluminescent emission during the warmup can be interpreted in terms of the microenvironments around the various radiation induced defects and the dynamics of the annealing process (117-118). ... [Pg.16]

If the miscibility gap of Pri+xl2 is temperature dependent (which they usually are), then Prl2 could be a line phase at, say, ambient temperature, i.e., x = 0. Hence, on quenching or when the annealing process progresses, the metastable i+xh phase must release praseodymium metal. This surplus praseodymium metal can be released from both the 3 a (heavily under-occupied) and 3 b (fully occupied) positions combined with site changes from 3 b to 3 a, or not. These... [Pg.56]

Fig. 3.1. The cooling schedule during a simulated annealing run of 106 MC steps with goal curvature c0 = 10 in a box of unit edge length. The temperature program corresponds to a = 3. The adaptive changes in 6

Fig. 3.1. The cooling schedule during a simulated annealing run of 106 MC steps with goal curvature c0 = 10 in a box of unit edge length. The temperature program corresponds to a = 3. The adaptive changes in 6<p and 8 during the Monte Carlo process permits the acceptance ratio to be maintained in the vicinity of 30 and 50%. The variance s of the distribution of curvature is monitored along the annealing process...
Dried product resistance normally increases with increasing solute concentration and frequently decreases as the temperature of the frozen product approaches the eutectic temperature or T., . Production of larger ice crystals by a lower degree of water supercooling and/or an annealing process during freezing may also decrease the resistance. [Pg.627]

Moreover, the solvent-annealing process is rather complex and the underlying delicate balances of enthalpic and entropic contributions to the free energy are not yet understood in detail. Besides the solvent type, the sol-... [Pg.160]

However, recent theoretical studies [90] indicate that systems exhibiting attractive interactions of the A and D blocks generally should favour an -ABCDABCD- sequence leading to a non-centrosymmetric lamellar phase. As the theoretical phase diagram (Fig. 28) predicts that the annealing process goes through a mixed centrosymmetric phase (MCS BC) before the fully separated centrosymetric one (CS) is reached, the prediction may not be at... [Pg.171]


See other pages where Annealing Processes is mentioned: [Pg.350]    [Pg.432]    [Pg.392]    [Pg.393]    [Pg.71]    [Pg.82]    [Pg.83]    [Pg.528]    [Pg.373]    [Pg.395]    [Pg.32]    [Pg.526]    [Pg.545]    [Pg.126]    [Pg.329]    [Pg.337]    [Pg.193]    [Pg.458]    [Pg.459]    [Pg.460]    [Pg.188]    [Pg.57]    [Pg.407]    [Pg.53]    [Pg.147]    [Pg.892]    [Pg.60]    [Pg.61]    [Pg.151]    [Pg.369]    [Pg.258]    [Pg.84]    [Pg.395]    [Pg.174]    [Pg.302]   
See also in sourсe #XX -- [ Pg.391 ]

See also in sourсe #XX -- [ Pg.7 ]




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Annealing process control

Bistability annealing process

Implant annealing process schedule

Laser-annealing processes

Post-annealing process

Process Anneal

Process cold-drawing-annealing

Rubbing and annealing process

Silane Overpressure Annealing Process

Simulated annealing process

The process of annealing

Thermal processing annealing and evaporation

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