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Metallized filler

The metal fillers act as a reinforcing material that results in added strength and stiffness (126). They color the plastic gray for nickel, 2inc, stainless steel, and aluminum, and brown for copper. Metal additives are more expensive than carbon black or surface-active agents, but they get extensive use in EMI shielding appHcations. [Pg.296]

Carbon—graphite materials do not gall or weld even when mbbed under excessive load and speed. Early carbon materials contained metal fillers to provide strength and high thermal conductivity, but these desirable properties can now be obtained ia tme carboa—graphite materials that completely eliminate the galling teadeacy and other disadvantages of metals. [Pg.516]

The choice of filler depends on the end use. Metal fillers will improve machineability, hardness and thermal conductivity but may in some cases inhibit cure. [Pg.773]

Elastomers, plastics, fabrics, wood and metals can be joined with themselves and with each other using nitrile rubber/epoxy resin blends cured with amines and/or acidic agents. Ethylene-propylene vulcanizates can also be joined using blends of carboxylated nitrile rubber, epoxy resin and a reactive metal filler (copper, nickel, cobalt). However, one of the largest areas of use of nitrile rubber modified epoxy systems is in the printed circuit board area [12]. [Pg.660]

There is no guarantee that crack-free joints will automatically be obtained when fabricating weldable metals. This is a result of the fact that weldability is not a specific material property but a combination of the properties of the parent metals, filler metal (if used) and various other factors (Table 9.7) . The consequence of the average structural material possessing imperfect weldability is to produce a situation where defects may arise in the weld deposit or heat-affected zone (Table 9.8 and Fig. 9.27). [Pg.91]

Parent metal Filler metal Other factors... [Pg.92]

Deposited Metal filler metal after it becomes part of a weld or joint. [Pg.105]

For certain products, skill is required to estimate a product s performance under steady-state heat-flow conditions, especially those made of RPs (Fig. 7-19). The method and repeatability of the processing technique can have a significant effect. In general, thermal conductivity is low for plastics and the plastic s structure does not alter its value significantly. To increase it the usual approach is to add metallic fillers, glass fibers, or electrically insulating fillers such as alumina. Foaming can be used to decrease thermal conductivity. [Pg.397]

Future work in this area will involve the extension of these techniques to other temperatures in an effort to better characterize the overall reaction kinetics of these two processes. In addition, degree of cure obtained through isothermal DSC measurements will be compared with the fraction of acetylene consumed as measured by isothermal FTIR experiments for the same temperature and time. Also, the effect of the incorporation of metal fillers on the isomerization and crosslinking reactions will be addressed. [Pg.469]

Commercial coated samples were obtained. Coating thickness was nominal 2 mils for organic-metal filled coatings (approximately 50% metal filler). Zinc metal coatings were zinc arc spray and were thicker, 5 mils, but normal for that process. Test results for each fire parameter are given as follows ... [Pg.289]

Filler Metals. Filler metal shall conform to the requirements of ASME BPV Code Section II, Part C and Section IX, or to a proprietary specification agreed to between the employing contractor and owner. Filler metals may be in the form of welding wire (solid or cored) or consumable inserts. [Pg.41]

The composite as a unique material normally refers to hybrid or mixed materials between dispersed filler or reinforcemenf in fhe form of fiber, powder, flake, etc. and the continuous matrix. The composite applied to manufacture the plate mainly belongs to the type of nonmefallic composite with both nonmetallic filler and mafrix, alfhough research work on composite plates with metal filler has been carried ouf. This research will not be specifically introduced here because no promising results have been reported so far. The other sandwiched composite plate consists of layered metals and thermal expanded graphite and was developed by Russian scientists [11] however, no technical details were released. [Pg.316]

Conductive composites are obtained when powered metal fillers, metal flakes, or metal-plated fillers are added to resins. These composites have been used to produce forming tools for the aircraft industry and to overcome electromagnetic interference in office machines. [Pg.238]

Conductive additives Carbon black, carbon-graphite fibers, metals, metallized fillers/reinforcements... [Pg.636]

Rubber industries produce various types of complicated products like tyre, cable, belt, seal, bearings, engine mounts, etc. The products are composed of rubber, plastics, fibre, metal, fillers and many other additives like antioxidants, accelerators, etc. Reverse engineering is a technique by which a rubber technologist can reconstruct the composition of the products based on thermal analysis. Dormagen [178] and Baranwal [179] reconstructed the formulation of a tyre, based on analyses of FTIR, spectra, thermal analysis and high performance liquid chromatography. [Pg.113]

The most perspective on the technology, meeting the requirements of high heat conductivity, are methods of formation of porous matrix metal hydrides addition of the metal filler, cellular bodies or a preliminary incapsulation of a powder of an initial alloy. [Pg.390]

Nonconductive fillers are employed with electrical-grade epoxy adhesive formulations to provide assembled components with specific electrical properties. Metallic fillers generally degrade electrical resistance values, although they could be used to provide a degree of conductivity as discussed above. [Pg.174]

Metal fillers are often used to provide low electrical resistance between substrates. [Pg.283]

A commonly used adhesive in weldbonding applications is a modified epoxy, one- or two-component paste containing conductive metal filler. Other fillers commonly used in... [Pg.283]

Flexibilizers generally cannot be used to counteract internal stress in high temperature adhesive because of their relatively low glass transition temperature and thermal endurance properties. However, most high-temperature adhesive systems incorporate metallic fillers (generally aluminum powder) to reduce the coefficient of thermal expansion and degree of shrinkage. [Pg.303]

Metal fillers for high-temperature adhesives must be carefully selected because of their possible effect on oxidation, as indicated in the previous section. Carrier films, such as glass cloth, are generally used to facilitate the application of the adhesive, but they also provide a degree of reinforcement and lowering of the coefficient of thermal expansion. Thus, they reduce the degree of internal stress experienced at the joint s interface. [Pg.303]

Fig. 17 Schematic representation of the temperature gradient occurring during the exothermic curing reaction. Owing to the comparatively high thermal conductivity of the continuous metallic filler (e.g. wires consisting of copper), exothermic reaction heat Q is conducted away from the interface. By changing locally the thermal conditions of the curing reaction, the temperature gradient T(N) may influence the resulting network structure D (N) which in turn defines the elastic properties of the epoxy, e.g. its elastic modulus E(N). jw denotes the heat current density... Fig. 17 Schematic representation of the temperature gradient occurring during the exothermic curing reaction. Owing to the comparatively high thermal conductivity of the continuous metallic filler (e.g. wires consisting of copper), exothermic reaction heat Q is conducted away from the interface. By changing locally the thermal conditions of the curing reaction, the temperature gradient T(N) may influence the resulting network structure D (N) which in turn defines the elastic properties of the epoxy, e.g. its elastic modulus E(N). jw denotes the heat current density...
In all the examples discussed above the conductive fillers have been inorganic materials. As noted in the previous section, it is possible to make conductive composites with organic metal fillers. The organic charge transfer (CT) salts are ionic materials which contain linear arrays of conjugated ions with strong overlap of the -electrons of adjacent ions. If charge transfer is complete and... [Pg.285]

Calcium Carbonate, Calcium Silicate, Powdered Aluminium, Copper Alumina, Flint Powder, Carborundum, Silica, Molybdenum Disulphide Chopped Glass Mica, Silica, Powdered or flaked Glass Metallic Filler or Alumina Colloidal Silica, Bentonite Clay Improved Thermal Conductivity Improved Machinability Improved Abrasion Resistance Improved Impact Strength Improved Electrical Conductivity Improved Thixotropic Response... [Pg.39]

Epoxies are excellent electrical insulators. Electrical properties are reduced on increasing the polarity of the molecules. Addition of metallic fillers, metallic wools and carbon black convert the non-conductive epoxy formulation into an electrically conductive system. Non-conductive fillers increase the arc resistance and to some extent increase the dielectric constant. [Pg.63]

The electric properties of soft ferromagnetic nanoparticles in an insulating matrix strongly depend on the concentration of a metallic filler x and are varied between properties of the matrix and those of the filler. In binary nanocomposites a critical concentration (percolation threshold Xq) is reached when a continuous current-conducting cluster of the filler particles is formed through out the sample. [Pg.244]

In another similar example nanocomposite was formed in a polyurethane matrix. Solvent soluble polyurethane had pyridine groups attached which formed complexes with metal salts. Films were then formed and subjected to a reducing agent in order to produce particulate metal filler. In this case the distribution of the filler which was formed was not uniform because the filler had tendency to aggregate (even though it was chemically attached to the matrix prior to the reduction). The following were factors controlling size and shape of these metal particles ... [Pg.348]


See other pages where Metallized filler is mentioned: [Pg.9]    [Pg.160]    [Pg.585]    [Pg.595]    [Pg.1346]    [Pg.347]    [Pg.276]    [Pg.312]    [Pg.665]    [Pg.585]    [Pg.347]    [Pg.39]    [Pg.16]    [Pg.782]    [Pg.193]    [Pg.160]    [Pg.290]    [Pg.799]   
See also in sourсe #XX -- [ Pg.108 ]




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