Laminate manufacturing

The properties of standard grades of high pressure decorative laminates manufactured are shown in Table 1. Tables 2 and 3 show properties of industrial laminates (12,13). 

Post-forming type is an HPDL similar to the general-purpose type but is capable of being thermoformed under controlled temperature and pressure in accordance with the laminate manufacturer s recommendations. 

Laminates. Laminate manufacture involves the impregnation of a web with a Hquid phenoHc resin in a dip-coating operation. Solvent type, resin concentration, and viscosity determine the degree of fiber penetration. The treated web is dried in an oven and the resin cures, sometimes to the B-stage (semicured). Final resin content is between 30 and 70%. The dry sheet is cut and stacked, ready for lamination. In the curing step, multilayers of laminate are stacked or laid up in a press and cured at 150—175°C for several hours. The resins are generally low molecular weight resoles, which have been neutralized with the salt removed. Common carrier solvents for the varnish include acetone, alcohol, and toluene. Alkylated phenols such as cresols improve flexibiUty and moisture resistance in the fused products. 

EQUIPMENT IDENTIFICATION Mixer manufactured by (vendor), with an approximate volume of 20 Gallons Coater/Dryer/Laminator manufactured by (vendor), Slitter/Rewinder manufactured by (vendor) and, Pouching Machine (with Die Cutter) manufactured by (vendor). Equipment numbers are identified in the appropriate section of this document. 

Laminate manufacture involves impregnation of glass cloths with a liquid resin in a dip coating operation. The treated glass cloths are dried in an oven and the resin pre-cured. Even if most of the products are applied as aqueous solutions of the prepolymers, powdered materials are also available. The advantage of the powdered products is their better chemical stability compared to the aqueous solutions. The resin content of the final products lies between 30 and 70%. 

B4C and a-SiC powders with a grain size of 2-5 pm were used for laminate manufacturing. 

Electronics Materials Laminates Manufacturing Copper Foil Manufacturing Chemicals Manufacturing... 

Fig. 4.7 Scheme of easting, eoating and laminating manufacturing process [52]... 

Layer laminate manufacturing Layer laminate manufacturing (LLM) ... 

Layer Laminate Processes Layer laminate manufacturing (LLM) is not frequently used for Prototype and Indirect Tooling. It does not deliver good surface qualities. Fine details should be avoided, as they tend to break. The parts need extensive post-processing. The build process is fast if massive parts are made. 

In the present contribution, the synthesis and characterization of partially substituted kraft lignin phenol-formaldehyde (KLPF) impregnation resins containing different additives for use in decorative paper laminate manufacturing are discussed based on dynamic DSC experiments. 

Red phosphorus flame-retardants are effective in thermoset resin systems and also elastomers, often combined with ATH, or magnesium hydroxide in elastomers. A wide range of treated red phosphorus in dispersion or concentrate form, offered by Clariant, is easier to handle and safer to transport, compared with powder grades. Such phosphorus additives do not affect the electrical properties of the composite, and they have little impact on the physical properties of the laminates manufactured. 

Acoustic ceiling panels, floor tile and continuous flooring installation Ceramic tile installation Counter top lamination Manufacture of... 

Supported and unsupported film lamination Manufacture of sandwich panels (road signs, etc.)... 

There has been a significant migration of the PCB laminate manufacturing capacity to Asia (mainly Taiwan and China) in the late 1990s. In 2001, 70% of epoxy resins used in PCB laminates was consumed in the region and the trend is expected to continue in the near future. 

Laminate Manufacturing Process Considerations. Historically, some printed circuit manufacturers had the laminate manufacturer bake the laminate prior to shipment, or would bake it themselves prior to use. The intent was to relieve any stress that may be stored within the iaminate prior to use in the circuit manufacturing operation. Aithough this process may help, the added material handling and cycle time does not usually justify the process. Instead, many laminate manufacturers reduce the lamination pressure at a specified point in their lamination cycle to minimize the stress that becomes stored in the finished product. 

New laminate manufacturing techniques may also offer improved dimensional stability. The direct current and continuous manufacturing processes described in Chap. 6 result in consistent thermal profiles from laminate to laminate and can use low lamination pressures. Optimizing these parameters can lead to improved consistency in dimensional stabihty. 

A very critical point that must be emphasized with respect to these issues is that although laminate manufacturers can easily make improvements in one property, doing so often can adversely affect other important properties. For example, it is relatively easy to formulate a resin system with a very high time to delaminate in conventional T260 or T288 tests, or to engineer a resin system with a very high decomposition temperature. However, this is often... 

While laminate manufacturers can easily make improvements in one of these properties, it is not as easy to make improvements without affecting other properties, including properties important for ease of manufacturing in the PCB fabrication process. Achieving the optimal balance of properties that consider the requirements of each level of the supply chain—from OEM to EMS to PCB fabricator—is crucial for success in lead-free assembly applications. 

In almost all cases, the laminate manufacturer will provide a set of data for its specific materials. This datasheet is a good starting point and can certainly be used to evaluate laminates at an early state of a project. Often, though, it will be necessary to perform additional tests in the PCB facihty to verify or complement the manufacturer s data to ensure that the laminate materials meet the requirements of manufacturing and assembly processes. 

Some fabricators use bakes both before and after lamination. The bake before lamination is designed to ensure moisture removal from cores after the apphcation of the adhesion promotion chemistry follow the recommendations of the laminate manufacturer carefully. The bake is also needed if innerlayers are stored at high humidity prior to lamination, or as a standard process for hygroscopic materials such as some of the LFAC laminates or polyimide. Other fabricators use a bake after lamination to complete the cure, reduce warp, and relieve stress. Although a post bake will achieve these goals, it is usually unnecessary in a controlled lamination process. In the case of high-temperature materials such as polyimide, cyanate ester, and PPO, a post bake is a useful way to achieve a full cure in a process where the maximum press temperature is limited. 

Two basic types of tests are conducted thermal stress or solder float tests, and thermal cycling tests. Both of these tests are intended to be accelerated tests for the PTH, not for the laminate the thermal stress test, in particular, is expected to severely degrade the laminate. The delamination test is similar to a solder float test, but is conducted at a lower temperature specified by the laminate manufacturer typically, a different fluid is required. 

The majority of flexible circuit manufacturers start the process with copper-clad materials. The properties of these materials depend on the capabilities of laminate manufacturers, even though the same base films and copper foils are used. To choose the right materials, manufacturers must carefully consider the basic properties of each laminate material. 

The same process is repeated for double-sided copper-clad laminates. (Some laminate manufacturers, however, have developed simplified manufacturing processes that can make the double-sided laminate in one single process to reduce manufacturing cost.) A well-conditioned aging process is important to achieving reliable bond strength and flexible characteristics of the laminates as the raw material of flexible circuits. 

This type of fully aligned material represents the upper limit of what could be possible in a fibre-reinforced plastic as all the fibres are well aligned and the laminate manufactured under laboratory conditions. A lower level of properties would be obtained with less well aligned materials. 

Yokozeki, T., Iwahori, Y., Ishiwata, S. and Enomoto, K. (2007) Mechanical properties of CFRP laminates manufactured from unidirectional prepregs using CSCNT-dispersed... 

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