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Stresses, thermal

Due to the substantial difference between the thermal expansion coefficient of CVD diamond (1 p.p.m. K ) and laser diode material (6p.p.m. K for GaAs), thermal [Pg.610]

When materials with different coefficients of linear thermal expansion (CLTE) are bolted, riveted, bonded, crimped, pressed, welded, or fastened together by any method that prevents relative movement between the products, there is the potential for thermal stress. Most plastics, such as the unfilled commodity TPs, may have ten times the expansion rates of many nonplastic materials. However there are plastics with practically no expansion. Details are reviewed in Chapter 2, THERMAL EXPANSION AND CONTRACTION. [Pg.174]

In many assemblies the clearances around fasteners, the degrees of failure or yield in adhesives, and warpage or creep will tend to relieve the thermal stress. As with metal-to-metal attachments having different CLTEs, proper design allows for such temperature changes, especially with large parts that might be subject to wide temperature variations. [Pg.174]

It can lead to delamination of the electrode and current collector and eventually to electrochemical cell failure. There are few reports of studies of thermal stress in battery-related literature. One reason could be its relatively low significance. [Pg.885]

It is worth mentioning that in the battery field the term thermal stress is sometimes used to mean temperature loading, which is quite different from the accepted meaning in mechanical engineering. [Pg.885]


Many authors have shown that residual stresses in glass articles can be formally considered as the thermal stresses due to a certain fictitious temperature field. In the general case... [Pg.135]

SiHcon nitride (see Nitrides) is a key material for stmctural ceramic appHcations in environments of high mechanical and thermal stress such as in vehicular propulsion engines. Properties which make this material uniquely suitable are high mechanical strength at room and elevated temperatures, good oxidation and creep resistance at high temperatures, high thermal shock resistance, exceUent abrasion and corrosion resistance, low density, and, consequently, a low moment of inertia. Additionally, siHcon nitride is made from abundant raw materials. [Pg.321]

Mold Coolers for Plastic Injection Molding. Heat pipes are used for local temperature control in the injection molding of plastics (see Polymerprocessing). A heat pipe is often used to force local cooling within a mold to speed operation, control viscosity, retention of material in a difficult mold area, or to reduce thermal stresses on cooling. [Pg.515]

Thermal Stresses. When the wak of a cylindrical pressure vessel is subjected to a temperature gradient, every part expands in accordance with the thermal coefficient of linear expansion of the steel. Those parts of the cylinder at a lower temperature resist the expansion of those parts at a higher temperature, so setting up thermal stresses. To estimate the transient thermal stresses which arise during start-up or shutdown of continuous processes or as a result of process intermptions, it is necessary to know the temperature across the wak thickness as a function of radius and time. Techniques for evaluating transient thermal stresses are available (59) but here only steady-state thermal stresses are considered. The steady-state thermal stresses in the radial, tangential, and axial directions at a point sufficiently far away from the ends of the cylinder for there to be no end effects are as fokows ... [Pg.85]

Division 1. Below the creep range, design stresses are based on one-fourth of the tensile strength or two-thkds of the yield, or 0.2% proof stress. Design procedures are given for typical vessel components under both internal pressure and external pressure. No specific requkements are given for the assessment of fatigue and thermal stresses. [Pg.95]

Division 2. With the advent of higher design pressures the ASME recognized the need for alternative rules permitting thinner walls with adequate safety factors. Division 2 provides for these alternative rules it is more restrictive in both materials and methods of analysis, but it makes use of higher allowable stresses than does Division 1. The maximum allowable stresses were increased from one-fourth to one-third of the ultimate tensile stress or two-thkds of the yield stress, whichever is least for materials at any temperature. Division 2 requkes an analysis of combined stress, stress concentration factors, fatigue stresses, and thermal stress. The same type of materials are covered as in Division 1. [Pg.95]

A series of events can take place in response to the thermal stresses (/) plastic deformation of the ductile metal matrix (sHp, twinning, cavitation, grain boundary sliding, and/or migration) (2) cracking and failure of the brittle fiber (5) an adverse reaction at the interface and (4) failure of the fiber—matrix interface (17—20). [Pg.200]

Thermal Stresses and Properties. In general, ceramic reinforcements (fibers, whiskers, or particles) have a coefficient of thermal expansion greater than that of most metallic matrices. This means that when the composite is subjected to a temperature change, thermal stresses are generated in both components. [Pg.201]

Chemical Properties. LLDPE is chemically stable. Very few analyses and tests related to its chemical properties are carried out routinely. Resistance to thermal stress-cracking is determined by exposing film wrapped on a metal mandrel to hot (100°C) air for 48, 96, and 168 hours (ASTM D2951-71). [Pg.404]

For piping systems operating within at least 150°C above or below ambient temperature, heat loss or gain, respectively, from the piping to the support system should be evaluated, as well as local thermal stresses due to temperature differences between the pipe and its support attachment. Clamp-type supports iasulated from the piping, and extended support connections with the support members covered with iasulation at the support junction and for a distance beyond frequently are used for such systems. [Pg.61]

PWRs operate differendy from BWRs. In PWRs, no boiling takes place in the primary heat-transfer loop. Instead, only heating of highly pressurized water occurs. In a separate heat-exchanger vessel, heat is transferred from the pressurized water circuit to a secondary water circuit that operates at a lower pressure and therefore enables boiling. Because of thermal transfer limitations, ultimate steam conditions in PWR power plants ate similar to those in BWR plants. For this reason, materials used in nuclear plant steam turbines and piping must be more resistant to erosion and thermal stresses than those used in conventional units. [Pg.10]

Extruded Rigid Foa.m. In addition to low temperature thermal insulation, foamed PSs are used for insulation against ambient temperatures in the form of perimeter insulation and insulation under floors and in walls and roofs. The upside-down roof system has been patented (256), in which foamed plastic such as Styrofoam (Dow) plastic foam is appHed above the tar-paper vapor seal, thereby protecting the tar paper from extreme thermal stresses that cause cracking. The foam is covered with gravel or some other wear-resistant topping (see Roofing materials). [Pg.527]

At very high and very low temperatures, material selection becomes an important design issue. At low temperatures, the material must have sufficient toughness to preclude transition of the tank material to a brittle state. At high temperatures, corrosion is accelerated, and thermal expansion and thermal stresses of the material occur. [Pg.309]


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37 Dynamic thermal stress

Annealing of Thermal Stresses

Chips thermal mismatch stresses

Compressive thermal stress

Contraction thermal, stress from

Creep and stress relaxations as thermally activated processes

Critical thermal stress, parameter

Damage thermal stress

Enzymes thermal stress

Example Maximum thermal stress in a bilayer

Flow stress thermally activated component

Green thermal stress

Irradiation thermal stress

Lowering Thermal Stress in Molding Compounds

Managing Thermal and Physical Stress in the Laboratory

Micro-residual thermal stress

Physiological thermal stress

Plasma thermal coating stress

Relaxation of thermal stresses by creep

Residual stress thermal mismatch

Residual thermal stress

Sealants thermal stresses

Stress Waves thermalization

Stress relaxation as thermally activated process

Stress relaxation thermal aging effects

Stress testing thermal/humidity

Stress thermal deformation

Stress, allowable thermal

Stress-cracking, thermal

Stress-strain relations thermal

Stresses thermal stress

Stresses thermal stress

Stressing, thermal

Temperature gradient thermal stresses

Tensile thermal stress

Thermal Expansion and Stresses

Thermal Shear Stress Sensors

Thermal Stress Preventing Measures

Thermal Stress and Compaction Stresses in Ceran Cooktop Panels

Thermal Stress in Ceran Cooktop Panels

Thermal Stresses and Strains

Thermal Stresses in Adhesive-Bonded Joints

Thermal and Mechanical Stress Analysis

Thermal aspects stress

Thermal comfort and heat stress

Thermal cycling stress-crack

Thermal expansion stress

Thermal mismatch adhesive shear stresses

Thermal stress analysis

Thermal stress coefficients

Thermal stress determination

Thermal stress during drying

Thermal stress in ceramics

Thermal stress ratcheting

Thermal stress removal

Thermal stress resistance, anode

Thermal stress solutions

Thermal stress, description

Thermal stress, physical

Thermal stress, polymers

Thermal stress, resistance

Thermal stresses Stress analysis models

Thermal stresses Stress determination

Thermal stresses Stress reduction methods

Thermal stresses glass

Thermal stresses modelling

Thermal stresses, analysis for

Thermal stresses, definition

Thermally and Pressure-Induced Stresses

Yeast thermal stress

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