Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Bonds reliable

There are direct measurements of the dissociation enthalpy for cleaving the first bond in trimethylarsine, -stibine and -bismuthine, and triethyl-stibine and convincing evidence that these R—ER2 bounds have significantly different dissociation enthalpies from the subsequent RE—R and R—E bonds. Reliable measurement of the enthalpy of formation of the various McjE species and the E—E bond enthalpies in the... [Pg.165]

MATERIALS ENGINEERING RESEARCH LABORATORY LTD. Tamworth Road, Hertford SGI 3 7DG UK, +44 (0)1992 500120. Conducting a joint industry project called Rubber/Metal Bonding—Reliability for Future Needs to develop understanding of the durability of these bonds in automotive, aerospace and civil engineering applications. Associated with RAPRA (see below). [Pg.42]

So far, we have encountered the spin density as a variable both in the description of electronic structures of open-shell character and in the analysis of local quantities such as local spins or bond orders. For an accurate treatment of open-shell molecules, spin-spin interactions and chemical bonding, reliable spin densities are thus mandatory. However, the determination of rehable spin density distributions can be a difficult task in quantum chemistry [199, 200]. Examples of such difficult cases are iron nitrosyl complexes containing salen or porphyrin ligands for which DFT spin densities considerably depend on the approximate exchange-correlation functional [87,199]. [Pg.243]

Epoxies are preferable to other resin systems in that they can be formulated to bond to moist hardened concrete and yet be able to cure within the wet environment of the fresh concrete. Polyesters do not generally bond reliably under wet conditions. The system must also be selected with due regard to the temperature of application. Resins claimed to have good bonding performance at 20 C may give rather poor bond strengths at the lower cure temperatures prevalent on UK construction sites during much of the year. [Pg.216]

Let us consider some of the most common problems in an adhesively bonded joint. Bonding problems in a three-layer step-lap joint, for example, are illustrated in Fig. 1. Ultrasonic techniques to find voids, weak cohesive properties, and delaminations are available and are quite reliable. The weak interface or kissing bond detection situation, on the other hand, has a limited number of solutions useful only in special situations. No generalized technique is yet available to depict a weak interface or kissing bond reliably, although a number of promising techniques have emeiged. [Pg.699]

George Harman, Wire Bond Reliability and Yield, ISHM Monograph, 1989. [Pg.285]

TD. Hund, P.V. Plunkett, Improved thermosonic gold ball bond reliability. Transactions of lEEE/CHMT 8 (4) (1986) 446. [Pg.471]

Effects of grain refiners in gold deposits on aluminum wire-bond reliability, S. Wakabayashi, A. Murata, and N. Wakobauashi, Plat. Surf. Finish., 1982, 69(8), 63. [Pg.274]

Comparison in Wire Bond Reliability between 2N-Au, 3N-Au, and 4N-Au Stored at 175°C... [Pg.292]

Fligh-tech ceramics withstand great mechanical stresses even thin structures and sharp edges are feasible with high reliability. This allows connecting the HT cables reliably to the ceramic part of the tubes directly. Many available resin systems bond easily to ceramics. [Pg.534]

Therefore, the establishment of the Non-Destructive Inspection technique to understand the presence of the defect on the bonding interface by the ultrasonic wave etc. accurately is demanded. And, the reliability of the product improves further by feeding back accurate ultrasonic wave information obtained here to the manufacturing process. [Pg.848]

On the other hand, the reliability of the product improves, too, if each state of the plasticity deformation, the creep deformation, and the diffusion joint in the solid phase diffusion bonding as the bonding process, is accurately understood, and the bonding process is controlled properly. [Pg.849]

Clearly, the HF method, independent of basis, systematically underestimates the bond lengdis over a broad percentage range. The CISD method is neither systematic nor narrowly distributed in its errors, but the MP2 and MP4 (but not MP3) methods are reasonably accurate and have narrow error distributions if valence TZ or QZ bases are used. The CCSD(T), but not the CCSD, method can be quite reliable if valence TZ or QZ bases are used. [Pg.2191]

Naohtigall P, Jordan K D, Smith A and J0nsson FI 1996 Investigation of the reliability of density funotional methods reaotion and aotivation energies for Si-Si bond oleavage and FI2 elimination from silanes J. Chem. Phys. 104 148-58... [Pg.2194]

But the methods have not really changed. The Verlet algorithm to solve Newton s equations, introduced by Verlet in 1967 [7], and it s variants are still the most popular algorithms today, possibly because they are time-reversible and symplectic, but surely because they are simple. The force field description was then, and still is, a combination of Lennard-Jones and Coulombic terms, with (mostly) harmonic bonds and periodic dihedrals. Modern extensions have added many more parameters but only modestly more reliability. The now almost universal use of constraints for bonds (and sometimes bond angles) was already introduced in 1977 [8]. That polarisability would be necessary was realized then [9], but it is still not routinely implemented today. Long-range interactions are still troublesome, but the methods that now become popular date back to Ewald in 1921 [10] and Hockney and Eastwood in 1981 [11]. [Pg.4]

The similarity of the retrieved protons to those of the query structure, and the distribution of chemical shifts among protons with the same HOSE codes, can be used as measures of prediction reliability. When common substructures cannot be found for a given proton (within a predefined number of bond spheres) interpolations are applied to obtain a prediction proprietary methods are often used in commercial programs. [Pg.522]

In general, we know bond lengths to within an uncertainty of 0.00.5 A — 0.5 pm. Bond angles are reliably known only to one or twx) degrees, and there arc many instances of more serious angle enxirs. Tn addition to experimental uncertainties and inaccuracies due to the model (lack of coincidence between model and molecule), some models present special problems unique to their geometry. For example, some force fields calculate the ammonia molecule. Nlln to be planar when there is abundant ex p er i m en ta I evidence th at N H is a 11 i g o n a I pyramid. [Pg.113]

The technique most often used (i.e., for an atom transfer) is to hrst plot the energy curve due to stretching a bond that is to be broken (without the new bond present) and then plot the energy curve due to stretching a bond that is to be formed (without the old bond present). The transition structure is next dehned as the point at which these two curves cross. Since most molecular mechanics methods were not designed to describe bond breaking and other reaction mechanisms, these methods are most reliable when a class of reactions has been tested against experimental data to determine its applicability and perhaps a suitable correction factor. [Pg.149]


See other pages where Bonds reliable is mentioned: [Pg.433]    [Pg.656]    [Pg.287]    [Pg.291]    [Pg.291]    [Pg.292]    [Pg.433]    [Pg.656]    [Pg.287]    [Pg.291]    [Pg.291]    [Pg.292]    [Pg.833]    [Pg.834]    [Pg.848]    [Pg.849]    [Pg.998]    [Pg.518]    [Pg.172]    [Pg.349]    [Pg.591]    [Pg.89]    [Pg.520]    [Pg.24]    [Pg.32]    [Pg.53]    [Pg.154]    [Pg.33]    [Pg.133]    [Pg.98]    [Pg.151]    [Pg.7]   
See also in sourсe #XX -- [ Pg.208 ]




SEARCH



Adhesives bond reliability

Bonding Agent Reliability

Empirical valence bond reliability

High bond reliability wire

Reliability of adhesive bonds

Wire bonding high bond reliability type

© 2024 chempedia.info