Flame retardant epoxy resins

Interpenetrating polymer network varnishes are composed of the phenolic resin, an epoxy resin, flame retardants, for example brominated epoxies or acrylates, and triphenylphosphate, polymerization initiators for radical polymerization of the acrylates and curing accelerators to catalyze the reaction between epor groups and phenolic groups. 

Meath, A. R. Chemistry, Properties, and Applications of Epoxy Novolac, Flexible Epoxy, and Flame Retardant Epoxy Resins, Chapter 3 in Epoxy Resin Technology, P. F. Bruins, ed., Interscience Publishers, New York, 1968, p. 34. 

Meath, Chemistry, Properties, and Applications of Epoxy Novolac, Flexible Epoxy, and Flame Retardant Epoxy Resins, p. 38. 

Use Intermediate in manufacture of epoxy, polycarbonate, phenoxy, polysulfone, and certain polyester resins flame retardants, rubber chemicals, fungicide. 

Phenol, 4,4 -isopropylidenedi- Pluracol 245 Propane, 2,2-bis(p-hydroxyphenyi)- Rikabanol Uoar bisphenol A Ucar bisphenol HP. intermediate in manufacture of epoxy, polycarbonate, phenoxy, polysulfone, polyester resins, flame retardant, rubber chemicals fungicide. Solid mp = 147.9° bpio 250° Am = 226, 248, 277 nm 15000,25900,1310, MeOH) insoluble in H2O soluble in organic solvents LD50 (rat orl) = 3250 mg/kg. Aristech Mitsui Petroleum Mitsui Toatsu Shell. 

Uses Reactive flame retardant for epoxy, phenolic, and polyester resins flame retardant intermediate... 

Uses intermediate in the manufacture of polymers, epoxy resins, acrylic resins, polycarbonates, fungicides, antioxidants, dyes, phenoxy, polysulfone and certain polyester resins, flame retardants and rubber chemicals component in semisynthetic waxes polycarbonate resins (60%), epoxy resins, (30%), polysulfone, polyetherimide and polyacrylate resins (10%) flame retardants (mainly tetrabromobisphenol-A), unsaturated polyester... 

Uses Antifoam in paper coatings, aq. adhesives, inks, casein sol ns., textile sizes, and detergent sol ns. plasticizer, solvent for NC, cellulose acetate, chlorinated rubber, and vinyls solvent for natural gums and syn. resins flame retardant for cellulosics, epoxies, PS, PVAc, PVC component in extraction of rare earth metal salts... 

The LOI behavior of phosphorus-containing siliconized epoxy followed the same trend as that of siliconized epoxy system. Epoxy and siliconized epoxy materials cured with the phosphorus diamine curative exhibited the maximum LOI value of 42, which maybe due to the consequence of the char enrichment of phosphorus and the char protecting effect of silicone to exhibit the synergistic effect of both silicone and phosphorus on LOI enhancement [50-54]. Thus simultaneously incorporating silicone and phosphorus into epoxy resin would render these epoxies as flame-retardant polymers and can be rated as the best flame retardant material. 

TetrabromobisphenolA. TBBPA is the largest volume reactive flame retardant. Its primary use is in epoxy resins (see Epoxyresins) where it is reacted with the bis-glycidyl ether of bisphenol A to produce an epoxy resin having 20—25% bromine. This brominated resin is typically sold as a 80% solution in a solvent. TBBPA is also used in the production of epoxy oligomers which are used as additive flame retardants. 

Nickel dialkyldithiocarbamates stabili2e vulcani2ates of epichlorhydrinethylene oxide against heat aging (178). Nickel dibutyldithiocarbamate [56377-13-0] is used as an oxidation inhibitor in synthetic elastomers. Nickel chelates of substituted acetylacetonates are flame retardants for epoxy resins (179). Nickel dicycloalkyldithiophosphinates have been proposed as flame-retardant additives for polystyrene (180—182) (see Flame retardants Heat stabilizers). 

The binder system of a plastic encapsulant consists of an epoxy resin, a hardener or curing agent, and an accelerating catalyst system. The conversion of epoxies from the Hquid (thermoplastic) state to tough, hard, thermoset soHds is accompHshed by the addition of chemically active compounds known as curing agents. Flame retardants (qv), usually in the form of halogens, are added to the epoxy resin backbone because epoxy resins are inherently flammable. 

The preparation of flame-retardant epoxy resins is accompanied by inclusion of tetrabromobisphenol A [79-94-7] in the advancement process (see Flame retardants). Products containing ca 20 wt % Br are extensively employed in the printed circuit board industry. 

Electrical Laminates. A significant use for epoxy resins is in the manufacture of copper-clad epoxy-glass printed circuit boards. Systems are available that meet the National Electrical Manufacturers Association (NEMA), GIO, Gil, FR3, FR4, FR5 specifications. Currently the majority of boards are manufactured to the fiame-retardant FR4 specification. The flame retardance is achieved by the use of a soHd epoxy resin based on... 

Antimonious acid H3Sb03 and its salts are less well characterized but a few meta-antimonites and polyantimonites are known, e.g. NaSb02, NaSb305.H20 and Na2Sb407. The oxide itself finds extensive use as a flame retardant in fabrics, paper, paints, plastics, epoxy resins, adhesives and rubbers. The scale of industrial use can be gauged from the US statistics which indicate an annual consumption of Sb203 of some 10000 tonnes in that country. 

Paints are complex formulations of polymeric binders with additives including anti-corrosion pigments, colors, plasticizers, ultraviolet absorbers, flame-retardant chemicals, etc. Almost all binders are organic materials such as resins based on epoxy, polyurethanes, alkyds, esters, chlorinated rubber and acrylics. The common inorganic binder is the silicate used in inorganic zinc silicate primer for steel. Specific formulations are available for application to aluminum and for galvanized steel substrates. 

Most circuit boards are FR-4 boards that meet standards for fire safety by the use of brominated epoxy resins in which the reactive flame-retardant tetrabromobisphenol A (TBBPA) forms part of the polymeric backbone of the resin. Alternative flame-retardant materials are used in only 3-5 per cent of the FR-4 boards, but additional alternative flame-retardant materials are also imder development. Little information exists concerning the potential environmental and human health impacts of the materials which are being developed as alternatives to those used today that are based on brominated epoxy resins. 

Principles and Characteristics Combustion analysis is used primarily to determine C, H, N, O, S, P, and halogens in a variety of organic and inorganic materials (gas, liquid or solid) at trace to per cent level, e.g. for the determination of organic-bound halogens in epoxy moulding resins, halogenated hydrocarbons, brominated resins, phosphorous in flame-retardant materials, etc. Sample quantities are dependent upon the concentration level of the analyte. A precise assay can usually be obtained with a few mg of material. Combustions are performed under controlled conditions, usually in the presence of catalysts. Oxidative combustions are most common. The element of interest is converted into a reaction product, which is then determined by techniques such as GC, IC, ion-selective electrode, titrime-try, or colorimetric measurement. Various combustion techniques are commonly used. 

Three industries were suspected to cause the BDE-209 contamination along the Vero River the first one, a textile industry which produced polyester fibers treated with flame retardants, the second one produced epoxy resins, and the third one is focused on the polyamide polymerization. Moreover, the effluent of the industrial park at the discharge site to the Vero River was also analyzed. Analysis of industrial effluents of each industry revealed that industry focused on the polyamide polymerization is the main responsible of the BDE-209 contamination, with concentration levels around 2,600 ng/L (Table 5). Nevertheless, the two other industries also contribute in some way to the total contamination. 

Bisphenol A Production of resins (polycarbonate and epoxy resins). Component in flame retardant production Antioxidant, preservative - River water mean values 0.016 pg L 1 (Europe) and 0.5 pg L"1 (US) [66]. -SW <0.001-1 pg U1 [9] - WW effluents mean values 1.5 pg L-1 [67] Not persistent in surface water. Rapidly biodegraded in aquatic environments [68] and removed in WWTP. Half-life 1-4 days [69] in water. Accumulated in anoxic sediments [9]... 

Bromide analysis, of water, 26 41 Bromide ions, in development solution, 79 205-206 Bromides, 4 319-330 thorium, 24 763 titanium, 25 54 tungsten, 25 379 uranium, 25 439 Bromimide, 4 299, 319 Brominated additive flame retardants, 77 461-468, 471-473t Brominated Anthanthrone Orange, pigment for plastics, 7 367t Brominated aromatic compounds, 7 7 459 Brominated bisphenol A-based epoxy resins, 70 366... 

Phosphorus flame retardants, 77 484-510 additive organic, 77 488-489 commercial, 77 487-499 economic aspects of, 11 503 in epoxy resins, 77 499-501 health, safety, and environmental factors related to, 77 501-503 interaction with other flame retardants, 77 486... 

PEN applications in the wire and cable market include printer cable and insulated wire wraps. PEN has a higher Tg and melting point, as well as higher flame resistance than PET. PEN him coated with a dispersion consisting of epoxy resin and Al(OH3) gave a semi-cured insulating him. When applied on copper wire, wound, and heated, a coil with good flame retardance and adhesion between the wire and the him was obtained [65],... 

TBBA, a brominated flame retardant, is used in the epoxy resin laminate in printed circuit boards in most manufacturers products. In 1997, a phosphorus-based alternative to TBBA was developed by the German engineering giant, Siemens,... 

In 2000, NEC developed an epoxy resin with what it describes as a fire-retardant structure that avoids the need for either TBBA or phosphorus-based flame retardants in circuit boards. The new resin contains a metal hydroxide retardant. The company claims the new board is almost totally free of pollutants, and is easy to process and thermally recycle. By also integrating flame retardant properties within the board, use of the metal hydroxide is minimised, while offering good electrical properties, higher heat resistance and improved processing characteristics. ... 

Uses/Sources. As an intermediate in the production of flame retardants, flavors, fragrances, and vinyl cyclohexene dioxide (which itself is used in the manufacture of epoxy resins) found in gases discharged during the process of curing ruhher in tire manufacturing. 

The major uses of BPA are in the production of polycarbonate resins (63%) and epoxy resins (27%). Polycarbonates have major outlets in automotive parts, compact discs, eyeglasses, and sheet and glazing applications, and have caused bisphenol A consumption to more than double during the past decade. Epoxy resins are two-component adhesives for very strong bonding. Miscellaneous uses include flame retardants (mostly tetrabromobisphenol A) and other polymer manufacture. Polycarbonate grade bisphenol A is >99% p,p isomer. The epoxy grade is 95% p,p. The p,p and o,p isomers can be separated by a combination of distillation and crystallization. 

This paper reports the results of a molecular-level investigation of the effects of flame retardant additives on the thermal dedompositlon of thermoset molding compounds used for encapsulation of IC devices, and their implications to the reliability of devices in molded plastic packages. In particular, semiconductor grade novolac epoxy and silicone-epoxy based resins and an electrical grade novolac epoxy formulation are compared. This work is an extension of a previous study of an epoxy encapsulant to flame retarded and non-flame retarded sample pairs of novolac epoxy and silicone-epoxy compounds. The results of this work are correlated with separate studies on device aglng2>3, where appropriate. 

---