Chemical mechanism/ materialism

A TWO-STEP CHEMICAL MECHANICAL MATERIAL REMOVAL MODEL... 

High demands are placed on the substrate material of disk-shaped optical data storage devices regarding the optical, physical, chemical, mechanical, and thermal properties. In addition to these physical parameters, they have to meet special requirements regarding optical purity of the material, processing characteristics, and especially in mass production, economic characteristics (costs, processing). The question of recyclabiUty must also be tackled. 

Moisture can significantly affect loose materials, particularly their flowability. Low temperatures, particle bridging, and caking can alter interparticle void fractions and cause dramatic changes in bulk density. Moisture becomes bound to solids because of mechanical, physicochemical, and chemical mechanisms. Moisture retained... 

Chemically active These filters are similar in design to the non-active depth units but the filtering media used are so chosen that contaminants adhere by chemical attraction. Thus there is a dual action, mechanical and chemical. The materials used include various activated clays. Fuller s earth, charcoal and chemically treated paper. Their cleansing action is much more thorough than that of the purely mechanical devices, for they are capable of removing matter actually in solution in the oil. 

All aspects of the material s chemical, mechanical and physical properties which are included in the specification should be capable of measurement and certification. For critical duties all material supplied should be fully tested and certified by competent approved, independent test laboratories. All items of plant should be purchased with material certification. Additional certification is required in cases where the fabricator, in manufacturing an item of plant, used techniques such as welding or heat treatment which may affect the corrosion behavior of the construction materials. 

Plastics have found numerous uses in specialty areas such as hypersonic atmospheric flight and chemical propulsion exhaust systems. The particular plastic employed in these applications is based on the inherent properties of the plastics or the ability to combine it with another component material to obtain a balance of properties uncommon to either component. Some of the compositions and important properties of plastics are given in Tables 2-9 and 2-10 that have been developed over the years for use in flight vehicles and propulsion systems that are dependent upon chemical, mechanical, electrical, nuclear, and solar means for accelerating the working fluid by high temperatures. 

Rubacams is a computer aided materials selection routine for elastomeric materials. Covering 99 generic types of rubber, each material is cross referenced with over 190 chemical agents and materials property data including physical, chemical mechanical and process related properties. Search results... 

Luminescence yields data that often cannot be provided by any other methodology. This book is a compilation of a wide variety of original research contributions. Substantial information is given on the use of luminescence techniques to understand specific cell responses and the chemical mechanisms of cell action. An examination of natural environments is presented in the form of specific studies that characterize materials in both solid and liquid form and give information on the respective reactions of these materials in soil and water systems. Advanced research on standardization and standards developed for luminescence studies, as well as both active and passive use of luminescence, is included. 

Luo and Domfeld [110] introduced a fitting parameter H , a d5mamical" hardness value of the wafer surface to show the chemical effect and mechanical effect on the interface in their model. It reflects the influences of chemicals on the mechanical material removal. It is found that the nonlinear down pressure dependence of material removal rate is related to a probability density function of the abrasive size and the elastic deformation of the pad. 

Oliver, M. R., Chemical-Mechanical Planarization of Semiconductor Materials, Berlin Springer Series in Material Science, 2004. 

Zhou, C. H., Shan, L., and Hight, R., "Influence of Colloidal Abrasive Size on Material Removal Rate and Surface Finish in Si02 Chemical Mechanical Polishing, Tribol. Trans., Vol. 45,2002, pp. 232-230. 

Luo, J. and Dorfeld, D. A., Material Removal Regions in Chemical Mechanical Planarization for Sub-micron Integrated Circuit Fabrication Coupling Effects of Slurry Chemicals, Abrasive Size Distribution and Wafer-Pad Contact Area, IEEE Trans. Semicond. Manuf, Vol. 16, No. 1, 2003, pp. 45-56. 

Steigerwald, J., Zirpoli, R., Myrarka, S., et al., Metal Dishing and Erosion in the Chemical-Mechanical Polishing of Copper Used for Patten Delineation, Materials Research Society Symposium Proceedings, ULSI-X, 1995, pp. 55-59. 

Steigerward, J. M., Muraka, S. R, and Gutmann, R. J., Chemical Mechanical Planarization of Microelectronic Materials, New York WUey, 1997. 

Moon, Y, "Mechanical Aspect of the Material Removal Mechanism in Chemical Mechanical Polishing," Ph.D. The-... 

MOSFETT s, and silicon oxide is deposited. The source/drain positions where electrical contact is to be made to the MOSFETs are defined, using the oxide-removal mask and an etch process. For shallow trench isolation, anisotropic silicon etch, thermal oxidation, oxide fill and chemical mechanical leveling are the processes employed. For shallow source/drains formation, ion implantation techniques are still be used. For raised source/drains (as shown in the above diagram) cobalt silicide is being used instead of Ti/TLN silicides. Cobalt metal is deposited and reacted by a rapid thermal treatment to form the silicide. Capacitors were made in 1997 from various oxides and nitrides. The use of tantalmn pentoxide in 1999 has proven superior. Platinum is used as the plate material. 

Begun in 1944 with DDT and in 1947 with parathion, the present report includes analytical data secured from certain chemical, mechanical, and solvent actions on apples, pears, lemons, and oranges. In the absence of established tolerances for these two insecticidal materials, it is hardly possible to interpret the significance of many of these data with respect to consumer hazard. 

In this chapter, we will see how polymers are manufactured from monomers. We will explore the chemical mechanisms that create polymers as well as how polymerization methods affect the final molecular structure of the polymer. We will look at the effect of the chemical structure of monomers, catalysts, radicals, and solvents on polymeric materials. Finally, we will apply our molecular understanding to the real world problem of producing polymers on a commercial scale. 

The underlying physical and/or chemical mechanisms responsible for the differences observed between the radon progeny and the thoron progeny as related to different materials are not clearly understood. Finally, it should be pointed out that the main thrust in this paper was to determine differences in surface a-activity measured on different materials with the same geometrical characteristics exposed to identical radioactive atmospheres. The calculation of deposition velocities and attachment rates, although it follows from surface a-activity measurements, was not the intent of this paper. This topic is dealt with elsewhere (Bigu, 1985). 

Other inorganic and organic compounds are brought into solution by the decomposition of their parent materials. Rocks and minerals will be decomposed by physical, biological, and chemical mechanisms. Enzymes released into the soil solution by microorganisms will decompose insoluble organic... 

The reader should refer to the original tables for the reference material on which the thermochemical data are based. The reference state used in Chapter 1 was chosen as 298 K consequently, the thermochemical values at this temperature are identified from this listing. The logarithm of the equilibrium constant is to the base 10. The unit notation (J/K/mol) is equivalent to (JK mol ). Supplemental thermochemical data for species included in the reaction listing of Appendix C, and not given in Table A2, are listed in Table A3. These data, in combination with those of Table A2, may be used to calculate heats of reaction and reverse reaction rate constants as described in Chapter 2. References for the thermochemical data cited in Table A3 may be found in the respective references for the chemical mechanisms of Appendix C. 

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