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Material characterization

Fourier transform infrared (FT-IR) spectroscopic anatyses of the structures of ALG, CS, CS- f-AlXi, and AlXi-CS mixed beads were carried out using a Fourier transform infrared spectrophotometer. [Pg.389]

Anatysis of ALXl, ALG-PBQ, CS, CS- f-AlXI, and ALG-CS mixed beads by thermal gravimetric analysis (TGA) was carried out using thermal gravimetric anal3 er. [Pg.389]


Ultrasonic Tomographic Non-Destructive Techniques for Materials Characterization. [Pg.247]

Special software (HILLGUS) was also developed for material characterizations such as the determination of the modulus of elasticity for building materials. [Pg.859]

The pulser/receiver HILL-SCAN 30XX boards satisfy DIN 25450. Typical applications are ultrasonie imaging systems for nuclear power stations and for aircraft, material characterization, transducer qualification, replacement of portable flaw detectors (inspections of welded joints), inspection of new materials, measurement systems with air eoupling. ... [Pg.861]

Traditional vs regression approach to automatic material characterization The traditional approach to automatic material characterization is based on physical reasoning where a. set of features of the signals that we assume to be the most relevant for solving the characterization problem is. selected. However, in situations with a complicated relation between the measurements and the material property to be characterized, this approach is not always applicable due to limited understanding of the underlying physical relations. [Pg.887]

In a regression approach to material characterization, a statistical model which describes the relation between measurements and the material property is formulated and unknown model parameters are estimated from experimental data. This approach is attractive because it does not require a detailed physical model, and because it automatically extracts and optimally combines important features. Moreover, it can exploit the large amounts of data available. [Pg.887]

Wiberg, U Material Characterization and Defect Detection in Concrete by Quantitative Ultrasonics. Doctoral Thesis, KTH Stockholm. TRITA-BKN. Bulletin 7, 1993... [Pg.1005]

J. P. Thomas and A. Cachard, eds.. Material Characterization Using Ion Beams, Plenum, New York, 1976. [Pg.319]

Plastics testing encompasses the entire range of polymeric material characterizations, from chemical stmcture to material response to environmental effects. Whether the analysis or property testing is for quaUty control of a specific lot of plastic or for the determination of the material s response to long-term stress, a variety of test techniques is available for the researcher. [Pg.148]

Materials characterization techniques, ie, atomic and molecular identification and analysis, ate discussed ia articles the tides of which, for the most part, are descriptive of the analytical method. For example, both iaftared (it) and near iaftared analysis (nira) are described ia Infrared and raman SPECTROSCOPY. Nucleai magaetic resoaance (nmr) and electron spia resonance (esr) are discussed ia Magnetic spin resonance. Ultraviolet (uv) and visible (vis), absorption and emission, as well as Raman spectroscopy, circular dichroism (cd), etc are discussed ia Spectroscopy (see also Chemiluminescence Electho-analytical techniques It unoassay Mass specthot thy Microscopy Microwave technology Plasma technology and X-ray technology). [Pg.393]

Identification of unknown compounds in solutions, liquids, and crystalline materials characterization of structural order, and phase transitions... [Pg.33]

Traditionally, the first instrument that would come to mind for small scale materials characterization would be the optical microscope. The optical microscope offered the scientist a first look at most samples and could be used to routinely document the progress of an investigation. As the sophistication of investigations increased, the optical microscope often has been replaced by instrumentation having superior spatial resolution or depth of focus. However, its use has continued because of the ubiquitous availability of the tool. [Pg.70]

For the purpose of a detailed materials characterization, the optical microscope has been supplanted by two more potent instruments the Transmission Electron Microscope (TEM) and the Scanning Electron Microscope (SEM). Because of its reasonable cost and the wide range of information that it provides in a timely manner, the SEM often replaces the optical microscope as the preferred starting tool for materials studies. [Pg.70]

We have already discussed a number of applications of the SEM to materials characterization topographical (SE) imaging, Energy-Dispersive X-Ray analysis (EDS) and the use of backscattering measurements to determine the composition of binary alloy systems. We now shall briefly discuss applications that are, in part, spe-... [Pg.80]

Among the most important parameters for materials characterization are the compositions of binary Gej Sij ) alloys, ternary Ai B C (e.g.,... [Pg.392]

SIMS is one of the most powerful surface and microanalytical techniques for materials characterization. It is primarily used in the analysis of semiconductors, as well as for metallurgical, and geological materials. The advent of a growing number of standards for SIMS has gready enhanced the quantitative accuracy and reliability of the technique in these areas. Future development is expected in the area of small spot analysis, implementation of post-sputtering ionization to SIMS (see the articles on SALI and SNMS), and newer areas of application, such as ceramics, polymers, and biological and pharmaceutical materials. [Pg.548]

ICP-OES is one of the most successful multielement analysis techniques for materials characterization. While precision and interference effects are generally best when solutions are analyzed, a number of techniques allow the direct analysis of solids. The strengths of ICP-OES include speed, relatively small interference effects, low detection limits, and applicability to a wide variety of materials. Improvements are expected in sample-introduction techniques, spectrometers that detect simultaneously the entire ultraviolet—visible spectrum with high resolution, and in the development of intelligent instruments to further improve analysis reliability. ICPMS vigorously competes with ICP-OES, particularly when low detection limits are required. [Pg.643]

Sandia Systems Inc., Albuquerque, NM, and TMATechnologies, Inc., Bozeman, MT. Sandia systems specializes in systems for characterizing microelectronics and magnetic disk materials TMA emphasizes optical materials characterization. [Pg.722]

This Materials Characterization Series attempts to address the needs of the practical materials user, with an emphasis on the newer areas of surface, interface, and thin film microcharacteri2ation. The Series is composed of the leading volume. Encyclopedia of Materials Characterization, and a set of about 10 subsequent volumes concentrating on characterization of individual materials classes. [Pg.763]

This volume contains 50 articles describing analytical techniques for the characterization of solid materials, with emphasis on surfaces, interfaces, thin films, and microanalytical approaches. It is part of the Materials Characterization Series, copublished by Butterworth-Heinemann and Manning. This volume can serve as a stand-alone reference as well as a companion to the other volumes in the Series which deal with individual materials classes. Though authored by professional characterization experts the articles are written to be easily accessible to the materials user, the process engineer, the manager, the student—in short to all those who are not (and probably don t intend to be) experts but who need to understand the potential applications of the techniques to materials problems. Too often, technique descriptions are written for the technique specialist. [Pg.764]

In electron-optical instruments, e.g. the scanning electron microscope (SEM), the electron-probe microanalyzer (EPMA), and the transmission electron microscope there is always a wealth of signals, caused by the interaction between the primary electrons and the target, which can be used for materials characterization via imaging, diffraction, and chemical analysis. The different interaction processes for an electron-transparent crystalline specimen inside a TEM are sketched in Eig. 2.31. [Pg.51]

Rutherford back-scattering spectroscopy (RBS) is one of the most frequently used techniques for quantitative analysis of composition, thickness, and depth profiles of thin solid films or solid samples near the surface region. It has been in use since the nineteen-sixties and has since evolved into a major materials-characterization technique. The number and range of applications are enormous. Because of its quantitative feature, RBS often serves as a standard for other techniques. [Pg.141]

A large group of journals covers various aspects of characterization, including electron microscopy. Micron and Ultramicroscopy are two of these, Materials Characterization (published in association with the International Metallographic Society) is another. [Pg.517]

Stnjcturai Design Guide for Advanced Composite Applications, Vol. 1, Material Characterization, 2nd edition. Advanced Composites Division, Air Force Materials Laboratory, January 1971. [Pg.53]

Temperature-Programmed Reduction for Solid Materials Characterization, Alan Jones and Brian McNichol... [Pg.674]

In calculation the authors of the model assume that the cube material possesses the complex modulus EX and mechanical loss tangent tg dA which are functions of temperature T. The layer of thickness d is composed of material characterized by a complex modulus Eg = f(T + AT) and tg <5B = f(T + AT). The temperature dependences of Eg and tg SB are similar to those of EX and tg <5A, but are shifted towards higher or lower temperatures by a preset value AT which is equivalent to the change of the glass transition point. By prescibing the structural parameters a and d one simulates the dimensions of the inclusions and the interlayers, and by varying AT one can imitate the relationship between their respective mechanical parameters. [Pg.15]


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