Material removal mechanisms

The CMP process is regarded as a combination of chemical effect, mechanical effect, and hydrodynamic effect [110-116]. Based on contact mechanics, hydrodynamics theories and abrasive wear mechanisms, a great deal of models on material removal mechanisms in CMP have been proposed [110,111,117-121]. Although there is still a lack of a model that is able to describe the entire available CMP process, during which erosion and abrasive wear are agreed to be two basic effects. 

Moon, Y, "Mechanical Aspect of the Material Removal Mechanism in Chemical Mechanical Polishing," Ph.D. The-... 

Luo J, Dornfeld D. Material removal mechanism in chemical mechanical polishing theory and modeling. IEEE Trans Semicond Manuf 2001 14 112-133. 

CO2, then the erosion rate might depend on the formation and/or removal rates of these species. A kinetic barrier to the removal of CO and CO2 from the surface would then impede erosion, with the erosion rate being inversely related to the barrier height. If the rate of product removal from the surface is slower than the rate of formation of these products, then the material removal mechanisms, not the reaction mechanisms, could dominate the erosion yield of a polymer. The possibility of collision-induced release of CO or CO2 from an oxidized surface has been investigated in our laboratory, and the results are summarized in this section. 

In processes with relatively high power density, the material only within the spot is heated up to a high temperature, and the material is removed by melting and evaporation. The ratio between them depends on the power density and the relationship of evaporation increases with the power density. Figure 3 shows the material removal mechanisms of different power densities of the electron beam. In the case of a low power density, the temperature at the center of beam on the surface is nearly at the melting point of the workpiece material, and the melt pool enlarges due to the heat conduction. When the power density is increased, vaporization of the... 

Laser ablation describes a material removal mechanism in which material is removed in gaseous state directly from a solid state by irradiating it with high optical intensities. 

Ploughing (in Grinding), Fig. 6 Material removal mechanism by ploughing, work hardening and reploughing from (Kragelski 1971) after (Martin and Yegenoglu 1992)... 

Ultraprecision Grinding, Fig. 1 Material removal mechanism in grinding of glass... 

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