Thermoplastics polyphenylene sulfide

PESA can be blended with various thermoplastics to alter or enhance their basic characteristics. Depending on the nature of thermoplastic, whether it is compatible with the polyamide block or with the soft ether or ester segments, the product is hard, nontacky or sticky, soft, and flexible. A small amount of PESA can be blended to engineering thermoplastics, e.g., polyethylene terepthalate (PET), polybutylene terepthalate (PBT), polypropylene oxide (PPO), polyphenylene sulfide (PPS), or poly-ether amide (PEI) for impact modification of the thermoplastic, whereas small amount of thermoplastic, e.g., nylon or PBT, can increase the hardness and flex modulus of PESA or PEE A [247]. 

Graphite/ Thermo- plastic AS4/PPS Phillips Petroleum Phillips Petroleum Polyphenylene sulfide, semicrystalline thermoplastic... 

Mat and continuous glass fibre reinforcements theoretically all the thermoplastics are usable in these forms, but up to now developments have concentrated on polypropylenes (PP), polyamides (PA) and thermoplastic polyesters (PET) fibre-reinforced PEEK, polyetherimide (PEI) and polyphenylene sulfide (PPS) are used for high-performance applications. They are presented in a range of forms from stampable sheets to pellets, prepregs, ribbons, impregnated or coated continuous fibre rods. More rarely (as in the case of PA 12, for example), the thermoplastic is provided in liquid form. 

The primary resin of interest is epoxy. Carbon-fiber-epoxy composites represent about 90% of CFRP production. The attractions of epoxy resins are that they polymerize without the generation of condensation products that can cause porosity, they exhibit little volumetric shrinkage during cure which reduces internal stresses, and they are resistant to most chemical environments. Other matrix resins of interest for carbon fibers include the thermosetting phenolics, polyimides, and polybismaleimides, as well as high-temperature thermoplastics such as polyether ether ketone (PEEK), polyethersulfone (PES), and polyphenylene sulfide. 

Matrix materials for commercial composites are mainly liquid thermosetting resins such as polyesters, vinyl esters, epoxy resins, and bismaleimide resins. Thermoplastic composites are made from polyamides, polyether ether ketone (PEEK), polyphenylene sulfide (PPS), polysulfone, polyetherim-ide (PEI), and polyamide-imide (PAI). 

Several other types of encapsulants have been evaluated for use by the semiconductor industry. Polyphenylene sulfide, a thermoplastic, has the advantage of good thermal characteristics and a low viscosity for device encapsulation. In addition, since it is a thermoplastic, the molded runners can be reused. This improves the material utilization and reduces cost. Unfortunately, this material also contains a significant amount of impurities that caused device reliability problems and efforts to remove them have met with mixed success. 

Very few CPs are produced in bulk quantities. Polyphenylene sulfide, a member of the third generation of polymers, was produced in bulk quantities many years before CPs were established and its dopability was elucidated. Polyethylenedioxythiophene is commercially available as a water-based colloidal dispersion (Baytron P water dispersion), and presumably as dispersible powders. The powders with a conductivity of 5-10 S/cm can be dispersed in thermoplastic polymers and in organic solvents such as xylene. Polyaniline doped with dodecylbenzene sulfonic acid and complexed with zinc dodecylbenzene sulfonate is commercially available as a powder, which can be dispersed in polyolefins. The same polymer doped with p-toluenesulfonic acid is also available as a dispersible powder, Ormecon, and in a predispersed form for solution processing in polar and nonpolar media. Based on Ormecon PANi, there are many commercial products marketed for many different applications. 

Includes acetal, granular fluoropolymers, polyamide-imide, polycarbonate, thermoplastic polyester, polyimide, modified polyphenylene oxide, polyphenylene sulfide, polysulfone, polyetherimide and liquid crystal polymers. 

Fortunately, the deficiencies of both the classic thermosets and general purpose thermoplastics have been overcome by the commercialization of a series of engineering plastics including polyacetals, polyamides, polycarbonate, polyphenylene oxide, polyaryl esters, polyaryl sulfones, polyphenylene sulfide, polyether ether ketones and polylmides. Many improvements in performance and processing of these new polymers may be anticipated through copolymerization, blending and the use of reinforcements. 

Includes polyacetal, polycarbonate, polyphenylene sulfide, thermoplastic polyester, polysulfone, modified polyphenylene oxide, polyimide, polyamide-imide and fluoropolymers Includes acrylics (532 MM lbs.), cellulosics (114 MM lbs.), PVC copolymers (178 MM lbs.). 

Craston . [Ciba-Geigy GmbH] Polyphenylene sulfide engineering thermoplastic. 

Polyphenylene Sulfide Sulfone - Thermoplastic with good thermal stability, chemical resistance, and dielectric properties, and low flammability and creep. Processed by injection molding. Used in electrical components. Also called polyphenylene sulfide sulfone. 

Nonolefinic thermoplastic polymers that in principle may be blended with polyolefins include polyamides (nylons) such as polyamide 6, polyamide 66, polyphenylene sulfide (PPS), polyphenylene ether (PPF), and polyphenylene oxide (PPO) polyesters such as polyethylene terephthalate (PET), polybutylene terephtha-late (PBT), polyethylene naphthalate (PEN), polytrimethylene terephthalate (PTT), polycarbonates, polyethers, and polyurethanes vinyl polymers such as polystyrene (PS), polyvinyl chloride (PVC), polymethylmethacrylate (PMMA), and ethylene... 

Reinforced plastics are composites in which a resin is combined with a reinforcing agent to improve one or more properties of the resin matrix. The resin may be either thermosetting or thermoplastic. Typical thermosetting resins used in RPs include unsaturated polyester, epoxy, phenolic, melamine, silicone, alkyd, and diallyl phthalate. In the field of reinforced thermoplastics (RTFs), virtually every type of thermoplastic material can be, and has been, reinforced and commercially molded. The more popular grades include nylon, polystyrene, polycarbonate, polyporpylene, polyethylene, acetal, PVC, ABS, styrene-acrylonitrile, polysulfone, polyphenylene sulfide, and thermoplastic polyesters. 

The range of Noryl blends available comprises a broad spectrum of materials superior in many respects, particularly heat deformation resistance, to the general purpose thermoplastics but at a lower price than the more heat resistant materials such as polycarbonates, polyphenylene sulfides, and polysulfones (discussed later). The materials that come close to them in properties are the... 

More recently, thermoplastics such as polyphenylene sulfide (PPS), polyether sulfone, and polyether ether ketone (PEEK) have entered the primary structures market in competition with thermosets. 

The term HT-thermoplastics is used for polymers, which in the absence of fillers, have a continuous-use temperature above approx. 200 °C. In contrast, standard plastics, such as PVC, polyethylene or polystyrene, have continuous-use temperatures of the order of 100 °C. In addition to their high temperature stability, HT-thermoplastics, in general, possess good resistance to chemicals and usually also low flammability. Among the most important HT-thermoplastics are polyphenylene sulfides (PPS), polysul-fones (PSU), polyether sulfones (PES), polyether imides (PEI), polyetherether ketones (PEEK) and polyarylates (PAR). 

Thermoplastic matrices, is particularly attractive for automotive applications PP, for example, is economical, it can be processed quickly and can provide much better mechanical properties such as impact resistance, (i.e., bumpers, body panels [11]). PA are successfully applied in both under hood (i.e., inlet manifolds, radiator fans) and interiors (instrument panels, doors, front-end structures). For better temperature performance and mechanical properties, in some special application areas (motor racing sector, gearbox parts), polyether ether ketone and polyphenylene sulfide ( high performance thermoplastics ) are also used as matrices. 

The major applications of LCP films in electronics are multilayer boards and multichip modules, and flexible printed circuits. Current materials used in the.se applications include polyimide film, high performance thermoplastic film such as polyphenylene sulfide and polyetherether ketone, and fiber reinforced composites such as quartz fiber-polyimide. The price of these materials for electronic packaging is in the range of. 50 to. l(K)/lb, so LCPs can compete very effectively at their current prices. Based on a two to three times increase in price... 

Polyphenylene Sulfide High-performance engineering thermoplastic has good chemical, water, fire, and radiation resistance, dimensional stability, and dielectric properties, but decreased impact strength and poor processability. Processed by injection, compression, and transfer molding and extrusion. Used in hydraulic components, bearings, electronic parts, appliances, and auto parts. Also called PPS. 

Polyphenylene-Sulfide (PPS) Developed in 1968, PPS was commercially introduced in 1973 (Ryton). This is a prominent engineering polymer, of the HT family, withstanding very high temperatures (arovmd 280 C). It is considered borderline between thermoplastic and thermosetting. Its basic stmcture consists of an aromatic core bonded to sulfur in the para-position. 

Polyphenylene sulfide is used in the manufacture of thermoplastic resins, which are marked by high long-term temperature stability (260 °C) and good chemical resistance (Phillips Petroleum, USA Kureha, Japan). 

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