Packaging electronic

The fact that this composite material can be cofired at temperatures of approximately 950°C represents a favorable characteristic. Hence, highly conductive metals such as copper and silver can be used to increase the conductivity compared with molybdenum. 

The composite material also demonstrates an additional improvement with regard to its properties. Its dielectric constant has been decreased to 5. This dielectric constant is favorably lower than the 9.4 demonstrated by AI2O3. 

Based on the developments by Budd (1993) and Partridge et al. (1989), cordierite glass-ceramics have been produced as advanced microwave 

Properties of Cordierite Giass-Ceramic/Copper Substrates According to Himmaia (1991) for IBM System 390/ES9000 in  

Properties IBM System 390/ES9000 with glass-ceramic/copper IBM System 3090 with alumina-molybdenum 

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Plastic bags Plastic beads Plastic bearing materials Plastic cements Plastic drums Plastic electronic package Plastic encapsulant... 

A numerical study of the effect of area ratio on the flow distribution in parallel flow manifolds used in a Hquid cooling module for electronic packaging demonstrate the useflilness of such a computational fluid dynamic code. The manifolds have rectangular headers and channels divided with thin baffles, as shown in Figure 12. Because the flow is laminar in small heat exchangers designed for electronic packaging or biochemical process, the inlet Reynolds numbers of 5, 50, and 250 were used for three different area ratio cases, ie, AR = 4, 8, and 16. 

Fig. 12. Schematic diagram of a Hquid-cooling module manifold for electronic packaging.

Electronic-Grade MMCs. Metal-matrix composites can be tailored to have optimal thermal and physical properties to meet requirements of electronic packaging systems, eg, cotes, substrates, carriers, and housings. A controUed thermal expansion space tmss, ie, one having a high precision dimensional tolerance in space environment, was developed from a carbon fiber (pitch-based)/Al composite. Continuous boron fiber-reinforced aluminum composites made by diffusion bonding have been used as heat sinks in chip carrier multilayer boards. 

Fig. 1. The different levels of electronic packaging (0) chip (1) chip carrier (2) printed circuit board (electronic card assembly) (3) rack and (4) system (2).

M. Pecht, Handbook of Electronic Package Design, Marcel Dekker, Inc., New York, 1991. 

D. Seraphim, R. Ladky, and C-Y. Li, Principles of Electronic Packaging, McGraw Hill Book Co., Inc. New York, 1989. 

R. Miller in Proceedings of the National Electronic Packaging and Production Conference (NEPCON) West, Des Plaines, lU., 1986, pp. 867—870. 

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