Encapsulation of Devices

A broad variety of structural polymers is nowadays available that are suitable for applications as different as carbon fiber reinforced materials, encapsulation of electronic devices or adhesive bonding. Each of these polymers belongs to one of two classes thermosets or thermoplastics. 

Similarly to the above-mentioned entrapment of proteins by biomimetic routes, the sol-gel procedure is a useful method for the encapsulation of enzymes and other biological material due to the mild conditions required for the preparation of the silica networks [54,55]. The confinement of the enzyme in the pores of the silica matrix preserves its catalytic activity, since it prevents irreversible structural deformations in the biomolecule. The silica matrix may exert a protective effect against enzyme denaturation even under harsh conditions, as recently reported by Frenkel-Mullerad and Avnir [56] for physically trapped phosphatase enzymes within silica matrices (Figure 1.3). A wide number of organoalkoxy- and alkoxy-silanes have been employed for this purpose, as extensively reviewed by Gill and Ballesteros [57], and the resulting materials have been applied in the construction of optical and electrochemical biosensor devices. Optimization of the sol-gel process is required to prevent denaturation of encapsulated enzymes. Alcohol released during the... 

The interaction in an interface of device/tissue is limited by two factors. There is the corrosive environment, such as biological fluid, which contains salts and proteins among other cellular structures in which the sensor device must survive [47, 48], Second, there is the encapsulation material which may induce a toxic reaction due to poor biocompatibility and hemocompatibility [49, 50], It is crucial to use a biomaterial that can overcome both limiting factors to maintain the lifetime of the sensor device and protect the body [51, 52],... 

Some non-silica sol-gel materials have also been developed to immobilize bioactive molecules for the construction of biosensors and to synthesize new catalysts for the functional devices. Liu et al. [33] proved that alumina sol-gel was a suitable matrix to improve the immobilization of tyrosinase for detection of trace phenols. Titania is another kind of non-silica material easily obtained from the sol-gel process [34, 35], Luckarift et al. [36] introduced a new method for enzyme immobilization in a bio-mimetic silica support. In this biosilicification process precipitation was catalyzed by the R5 peptide, the repeat unit of the silaffin, which was identified from the diatom Cylindrotheca fusiformis. During the enzyme immobilization in biosilicification the reaction mixture consisted of silicic acid (hydrolyzed tetramethyl orthosilicate) and R5 peptide and enzyme. In the process of precipitation the reaction enzyme was entrapped and nm-sized biosilica-immobilized spheres were formed. Carturan et al. [11] developed a biosil method for the encapsulation of plant and animal cells. 

Figure 1.20 Encapsulation of microdroplets of liquid crystals in ORMOSIL matrices results in materials with better transparency and thermal stability than polymer-dispersed liquid crystals. Gel-glass dispersed liquid crystal device switched between the OFF and ON state (thickness 10 pm, 4 x 2 cm, Fp p = 90V). (Reproduced from ref. 45, with permission.)...

Encapsulation of Light-Emitting Polymer Semiconductor Devices.577... 

ENCAPSULATION OF LIGHT-EMITTING POLYMER SEMICONDUCTOR DEVICES... 

The protection of microelectronics from the effects of humidity and corrosive environments presents especially demanding requirements on protective coatings and encapsulants. Silicone polymers, epoxies, and imide resins are among the materials that have been used for the encapsulation of microelectronics. The physiological environment to which implanted medical electronic devices are exposed poses an especially challenging protection problem. In this volume, Troyk et al. outline the demands placed on such systems in medical applications, and discuss the properties of a variety of silicone-based encapsulants. 

This paper reports the results of a molecular-level investigation of the effects of flame retardant additives on the thermal dedompositlon of thermoset molding compounds used for encapsulation of IC devices, and their implications to the reliability of devices in molded plastic packages. In particular, semiconductor grade novolac epoxy and silicone-epoxy based resins and an electrical grade novolac epoxy formulation are compared. This work is an extension of a previous study of an epoxy encapsulant to flame retarded and non-flame retarded sample pairs of novolac epoxy and silicone-epoxy compounds. The results of this work are correlated with separate studies on device aglng2>3, where appropriate. 

For any implanted device that is intended for long-term use, collagen encapsulation of the device will occur due to the immune response to the device.60 Collagen deposition typically begins at roughly 5-7 days postimplantation and takes up to a month to reach completion. In terms of calibration of the microdialysis probe, this layer of material will provide additional mass transport resistance and could be denoted as a trauma layer. 

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