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Thermal stresses Stress determination

The outputs from finite element analysis will tell the chemist many of the important predictive characteristics of the part. The effects of load (stress, strain, and deflection) are measured. Material selection based on strength and part dimensions and tolerances are determined and easily adjusted. The effects of heat (heat transfer and thermal stresses) are determined as well as material selection based on conduction and insulation. Special applications such as bending and vibration characteristics, crashworthiness, fatigue, and noise can be determined. The design requirements, such as expected loads, load cycle cost, mass targets, and budget targets, can be predicted and met with proper application of the FEA tool. [Pg.52]

Chemical Properties. LLDPE is chemically stable. Very few analyses and tests related to its chemical properties are carried out routinely. Resistance to thermal stress-cracking is determined by exposing film wrapped on a metal mandrel to hot (100°C) air for 48, 96, and 168 hours (ASTM D2951-71). [Pg.404]

When de.signiiig a current-carrying system it is the r.m..s. value of the fault current, l c- relevant to determine the thermal stresses ( c ) during a fault, to ehoose the eorreet material... [Pg.360]

The mechanical threshold stress determines the applied stress necessary for substantial thermal activation. The quantity = 7.0 eV for OFE... [Pg.233]

ISO 7933 EN ii515i Thermal stress evaluation in hot cnviron-iTicnts. Analytical method Elor environments Analytical determination and interpretation of thermal stress ussny oalculatio.n of required sweat... [Pg.375]

Thermal Stress Determination. The method selected to determine the thermal stress developed at the epoxy-aluminum interface was the bending beam technique utilized by Dannenberg (9), Shimbo, et al. (10) and others (12-13,17). The exact apparatus configuration is that of Dannenberg s except that thicker coatings were applied to the beam. [Pg.223]

To determine the effect of the curing schedule upon the thermal stress development, a 0% excess MDA sample was made by first B-stage curing (2 hrs at 80°C) the sample, cutting it into the beam dimensions and then placing it in the apparatus. The deflection of the beam was measured during the remainder of the curing schedule (2 hrs at 150°C and 2 hrs at 180°C). [Pg.224]

One must be aware of the limits of this technique. Since the assessment of Z depends on frequency shifts of two modes, any minimal shift leads to errors due to substantial mechanical or thermal stresses. It is not necessary to mention that under such circumstances the Z match technique, too, leads to similar errors. Nevertheless, the automatic Z value determination of the Z match technique is somewhat more reliable regarding occurrence of errors because the amplitude distribution of the (102) mode is asymmetric over the active crystal surface and that of the (100) mode is symmetric. [Pg.129]

Another parameter that must be taken into account when operating devices in pulsed-power applications is the action, defined as l t, where t is the width of the current pulse. The life (N) of the switch is the number of times the device will deliver power to the load before failure and is also an important parameter used to determine the reliability of the pulse-power system. Switch failure is usually related to mechanical factures caused by thermal stresses due to power dissipation in the device at turn-on. Life is predicted using the empirical formula... [Pg.93]

But specifically this area is the waste heat of the cycle, not the energy dissipated. It is difficult to determine an exact expression for energy dissipated because thermal stresses are left behind in the material, even after the shock pressure has been relieved. Therefore, a precise calculation of the true energy dissipation in a decaying shock must account for hard-to-evaluate effects of thermally induced after-flow in the material. In practice we settle for the waste heat approximation ... [Pg.184]

The mode of injection in GC-based methods can affect the recoveries of diazinon. In a study of the determination of organophosphorus pesticides in milk and butterfat, it was found that the recoveries of diazinon from butterfat, calculated relative to organic solutions of standard compounds, were 125% and 84% for splitless and hot on-column injections, respectively (Emey et al. 1993). Recoveries from milk were not dependent on the mode of injection. It was concluded that the sample matrix served to increase diazinon transfer to the GC column by reducing thermal stress imposed on the analytes and by blocking active sites within the injector. Therefore, on-column injection should be used in order to prevent bias when organic solutions of standard compounds are used for quantitation if this is not possible, the matrix must be present at low concentrations or the calibration standards must be prepared in residue-free samples to avoid unknown bias. [Pg.174]

I. Spectroscopic Determinations. Gas-phase infrared spectra provide a useful adjunct to vapor pressure measurements in the identification of volatile materials. The cell illustrated in Fig. 9.15 allows the sample to be quantitatively returned to the vacuum line after the spectrum has been obtained, so the process is completely nondestructive. The primary problem with a gas cell is to obtain a vacuum-tight seal between the window material and the cell body this may be accomplished with Glyptal paint or with wax- If the latter is used, it is necessary to warm and cool the alkali halide windows slowly to avoid cracking them due to thermal stress. For this purpose an infrared lamp is handy. The most satisfactory method of attaching windows is O-rings because this allows the easy removal of the windows for cleaning and polishing. [Pg.98]

Kinetic information on the chemical changes of excipient compatibility samples is a direct outcome of most formulation compatibility studies. Because accelerated conditions of thermal and thermal humidity stress are employed, degradation will often occur at these conditions. A brief kinetic evaluation of the data can address the behavior and extent of decay such that degradation data can effectively be utilized to determine levels and conditions of compatibility (96). It is not the aim of this section to recommend full kinetic treatment of decay rather it is to describe simple concepts and exercises that will help the excipient compatibility formulator utilize their data most effectively. Several experimental factors can be included in the initial experimental design of excipient compatibility studies to make kinetic analysis more powerful, and even with small studies having a limited amount of samples for analysis, a brief kinetic treatment of the data is recommended. [Pg.446]

The next section describes the processing and microstructural development of particulate composites, and is followed by a section on thermal residual stresses. These stresses are often the most obvious consequence of adding second-phase particles to a matrix and can have a profound effect on properties. Factors determining the toughness, strength and wear resistance of particulate composites are then considered in turn, and the chapter concludes with an assessment of possible future developments in this area. [Pg.100]

The two examples, deliberately chosen for their simplicity, show that computational fluid dynamics facilitate a more in-depth examination of the local flow behavior of twin screw extruders. Local peaks in the mechanical and thermal stresses can be easily identified. By changing the geometry, stresses can be reduced and the quality of the polymer can thereby be optimized. Another application focus is the rapid determination of the dimensionless axis intercepts for the pressure build-up A, and A2 and for the power requirement B, and B2. The significance of these parameters has already been discussed in detail in the two previous chapters. [Pg.156]

Thermal stress appears to be one of the most critical factors determining the long term stability of nc-DSCs and is strongly related to the chemical composition and purity of electrolyte solvents and additives [7]. Continuous (1000 h at 85°C) and periodic (—40 to 85°C, 200 cycles) thermal tests according to IEC norms appear promising since no leakage of electrolyte solvent was observed, but with 30-40% loss in efficiency still critical. [Pg.287]

Using an analogy [18] with the thermal stress, liquid flow stress can be determined from a replacement of... [Pg.714]


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