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Tensile thermal stress

A recent analysis by Kastritseas etal. (2004c) suggested that in both cases the magnitude of the thermal shock-induced stresses was overestimated as the anisotropic character of the materials was not taken into account. If material anisotropy is accounted for, then both (15.36) and (15.37) cannot predict A Tc accurately even for the largest possible value of the thermal shock-induced stresses (corresponding to a maximum value of the stress reduction factor, A = 0.66). To explain the discrepancy, it was proposed that the interfacial properties may be affected by the shock due to the biaxial nature of the induced stress field, which dictates that a tensile thermal stress component that acts perpendicular to the fibre-matrix interface is present for the duration of the shock. [Pg.427]

To balance the tensile thermal stresses, the plies will go into compression in the longitudinal direction. Thus, the thermal strain in the longitudinal (/) direction of the longitudinal (J) plies ( ) is given by... [Pg.354]

Provided that Pb and then for < oCp, or pb > 0 and then for > oCp (see Eqs. (4)-(7)), the spherical particle or the cubic cell matrix are acted by the tensile thermal stresses, or the tensile radial thermal stress and the compressive tangential thermal stresses, respectively, and consequently, as a consequence of releasing of the elastic energy of the thermal stresses, equal circular cracks are assumed to be equivalently formed in the planes X1X2,... [Pg.159]

Division 1. Below the creep range, design stresses are based on one-fourth of the tensile strength or two-thkds of the yield, or 0.2% proof stress. Design procedures are given for typical vessel components under both internal pressure and external pressure. No specific requkements are given for the assessment of fatigue and thermal stresses. [Pg.95]

Division 2. With the advent of higher design pressures the ASME recognized the need for alternative rules permitting thinner walls with adequate safety factors. Division 2 provides for these alternative rules it is more restrictive in both materials and methods of analysis, but it makes use of higher allowable stresses than does Division 1. The maximum allowable stresses were increased from one-fourth to one-third of the ultimate tensile stress or two-thkds of the yield stress, whichever is least for materials at any temperature. Division 2 requkes an analysis of combined stress, stress concentration factors, fatigue stresses, and thermal stress. The same type of materials are covered as in Division 1. [Pg.95]

Contours of maximum principal stress in the first slice (near the gas inlets) and the sixth slice (near the gas outlet) are shown in Figures 5.11 and 5.12 respectively. It can be seen that the stack is partially under compression and partially under tension due to the mismatch in the thermal expansion coefficient of the materials and non-uniform temperature. In each cross-section, the stresses are higher near the top of the stack than near the bottom. Also, the stresses are higher near the gas outlet than near the gas inlets. Maximum tensile and compressive stresses in all the slices are found to be 60 MPa and 57.2 MPa respectively which are in the electrolyte layer of the last slice. The maximum stresses in all the layers are found to be well within the failure limits of their respective materials and hence thermal stress failure is not predicted for this stack. [Pg.151]

Niihara [1] considered the improved toughness was mainly attributed to the residual stress that results from differential thermal expansion coefficients of two phases. In Al203/SiC systems, the tensile hoop stress, thought to be over 1000 MPa around the nanoparticles within the matrix grains, was generated from the large thermal expansion mismatch. Thus, the material may be... [Pg.244]

For most metal-reinforced nanocomposites the thermal expansion coefficient of the metal phase will be larger than that of the matrix, reversing the expected stress fields compared to SiC-reinforced alumina. Thus while the tensile radial stresses surrounding occluded particles may induce transgranular cracking, the compressive hoop stresses may inhibit crack propagation if the particles are located at grain boundaries. Macrostresses in sub-micron Ni... [Pg.299]


See other pages where Tensile thermal stress is mentioned: [Pg.112]    [Pg.353]    [Pg.526]    [Pg.1236]    [Pg.10]    [Pg.11]    [Pg.10]    [Pg.26]    [Pg.180]    [Pg.185]    [Pg.220]    [Pg.112]    [Pg.353]    [Pg.526]    [Pg.1236]    [Pg.10]    [Pg.11]    [Pg.10]    [Pg.26]    [Pg.180]    [Pg.185]    [Pg.220]    [Pg.34]    [Pg.365]    [Pg.298]    [Pg.84]    [Pg.85]    [Pg.85]    [Pg.326]    [Pg.53]    [Pg.265]    [Pg.64]    [Pg.246]    [Pg.85]    [Pg.227]    [Pg.298]    [Pg.312]    [Pg.315]    [Pg.316]    [Pg.298]    [Pg.36]    [Pg.265]    [Pg.357]    [Pg.378]    [Pg.378]    [Pg.28]    [Pg.104]    [Pg.105]    [Pg.113]    [Pg.181]    [Pg.299]    [Pg.359]    [Pg.369]   
See also in sourсe #XX -- [ Pg.220 ]




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