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Molding areas

Mold Coolers for Plastic Injection Molding. Heat pipes are used for local temperature control in the injection molding of plastics (see Polymerprocessing). A heat pipe is often used to force local cooling within a mold to speed operation, control viscosity, retention of material in a difficult mold area, or to reduce thermal stresses on cooling. [Pg.515]

Fig. 8-73 A 2-D molding area diagram (MAD) that plots injection pressure (ram pressure) vs. mold temperature. Fig. 8-73 A 2-D molding area diagram (MAD) that plots injection pressure (ram pressure) vs. mold temperature.
K Kunststoffe (plastic in German) MAD molding area diagram... [Pg.652]

Figure 7.76 Schematic illustration of molding area for a given polymer/mold combination. From Z. Tadmor and C. G. Gogos, Principles of Polymer Processing. Copyright 1979 by John Wiley Sons, Inc. This material is used by permission of John Wiley Sons, Inc. Figure 7.76 Schematic illustration of molding area for a given polymer/mold combination. From Z. Tadmor and C. G. Gogos, Principles of Polymer Processing. Copyright 1979 by John Wiley Sons, Inc. This material is used by permission of John Wiley Sons, Inc.
Fig. 13.6 Schematic molding area or molding window diagram that can be determined for a given polymer and mold cavity. Fig. 13.6 Schematic molding area or molding window diagram that can be determined for a given polymer and mold cavity.
The Molding Area in Injection Molding (a) Discuss the dependence of each of the curves making up the molding area in Fig. 13.6 on polymer parameters such as Tg, Tm, m(T), n, k, m(P), and Tm(P), and thermal degradation, (b) Apply the preceding ideas to three polymers—PVC, nylon, and HDPE—whose properties appear in Appendix A. [Pg.822]

Figure 4.7 Molding area diagram processing window concept... Figure 4.7 Molding area diagram processing window concept...
Figure 15. Original fender of an automobile showing insufficient molded areas. Figure 15. Original fender of an automobile showing insufficient molded areas.
Molding areas should be equipped with positive pressure to keep out dust and airborne contaminants. Parts intended for the semiconductor industry are preferably molded in cleanrooms. Dust, oil, and particles of an organic nature must be prevented from contaminating the resin because during sintering they will carbonize into dark specks. [Pg.162]

When working with TS resins, hot water, soap, and an eyewash system should always be available. Styrene vapor is heavier than air, so ventilation or extraction equipment should take off vapor from the lowest part of the mold, or the lowest level of the molding area. Air bubbles in a laminate reduce strength and may impair corrosion resistance. To minimize air bubbles, the following are recommended ... [Pg.300]

Manufacturers Alliance molding area diagram machine direction... [Pg.1098]

Vo = Surge tank volume, including piping to vacuum control valve Fin = Mold area volume Vi = Vo + V ... [Pg.221]

See other pages where Molding areas is mentioned: [Pg.12]    [Pg.144]    [Pg.144]    [Pg.469]    [Pg.761]    [Pg.94]    [Pg.177]    [Pg.193]    [Pg.194]    [Pg.204]    [Pg.1069]    [Pg.19]    [Pg.325]    [Pg.66]    [Pg.148]    [Pg.168]    [Pg.205]    [Pg.266]    [Pg.371]    [Pg.373]    [Pg.441]    [Pg.442]    [Pg.443]    [Pg.403]    [Pg.127]    [Pg.127]    [Pg.34]    [Pg.245]   
See also in sourсe #XX -- [ Pg.162 ]



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