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Thermal stressing

The stress gradient also means that the occurrence of thermal softening failures is delayed. At any particular frequency of stressing, thermal softening failures will not occur until higher stresses if the stress system is bending rather than uniaxial. [Pg.145]

For the tensile blob, thermal blob, and concentration blob we find that the coil accommodates external stress (thermal, concentration, or force) through a scaling transition that leads to two regimes of chain scaling. This directly impacts the free energy of the chain, the mechanical response, and the coil size. [Pg.132]

Thermal Fit and Residual Stresses. Thermal expansion measurements arc typically carried out on dilaiumeiric equipment consisting of a fused quartz pusher rod inside a tube of the same material. [Pg.561]

For the calculation of the thermally induced stress, thermally induced strain is additionally considered. The total strain vector e is written using the elastic strain vector eel and thermally induced strain vector eth as... [Pg.337]

MeV H, and 0.8 MeV He3 formed by the D-D reactions in advanced fuel reactors. The energy spectrum of the central plasma can be expected to be Maxwellian at the Tokamak operating temperature ( 10 keV). There is little or no information on the interaction between blistering and externally induced stress. Thermal and mechanically induced stress will influence diffusion and this will have a direct effect on blistering. [Pg.80]

Hekman et al. [31] linked elevated moisture content to the formation of aggregates for a conjugated IgG lyophilized with maltose and citrate buffer. The increase in molecular size was a function of both the moisture content in the vial and the amount of time for which the sample was stressed thermally. The data suggest that the increase in molecular size as a function of thermal stress is due to attachment of maltase, which is a glucose disaccharide present in the lyophile as an excipient. This degradation pathway was only observed in the lyophile. [Pg.205]

By choosing a small representative molecular dynamics sample of the shocked material, application of the Euler equations requires that macroscopic stress, thermal, and density gradients in the actual shock wave are negligible on the length scale of the molecular dynamics computational cell size. While the thermal energy is assumed to be evenly spatially distributed throughout the sample by the shock, thermal equilibrium within the internal degrees of freedom computational cell is not required. [Pg.302]

It has been applied to optimize welding conditions and as input to the predichon of microstructure, properties, distorhon, and residual stress. Thermal modeling is also closely coupled to the metal flow (section 10.3, Metal Flow ). [Pg.189]

Capillary SFC-MS Development and Applications. The initial applications of SFC have stressed thermally labile and higher molecular weight mixtures not amenable to GC. Many of the early applications of capillary SFC have utilized carbon dioxide as the mobile phase, but the extension to alternative fluids is being actively pursued. [Pg.273]

Key Words Training Material, Metal Imperfections, Metal Defects, Properties of Metals, Thermal Stress, Thermal Shock, Brittle Fracture, Heat-Up, Cool-Down, Characteristics of... [Pg.3]

Stresses occur in any material that is subject to a load or any applied force. There are many types of stresses, but they can all be generally classified in one of six categories residual stresses, structural stresses, pressure stresses, flow stresses, thermal stresses, and fatigue stresses. [Pg.54]

Proteetion from high vibration, G-foree stresses, thermal shocks, and moist or abrasive atmospheres is mandated, along with adhesion, strain relief, and overall stronger eomponent attaehment. Consumer produets, from eomputers to appliances, are moving from safe offiee and home areas to more demanding environments as well. [Pg.782]

The stress optical law is maintained during relaxation of a deformed rubber (Figure 6.17) (Balasubramanian et al., 2005) moreover, the same proportionality to An is maintained for the normal components of the stress. And since orientation of rubber also affects heat conduction (Hands, 1980), there is a corresponding proportionality, known as the stress-thermal rule, between sttess and the anisotropy of the thermal conductivity (Venerus et al., 1999) ... [Pg.309]


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See also in sourсe #XX -- [ Pg.421 , Pg.428 ]




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Stresses thermal stress

Thermal stress

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