Chemical vapor deposition films

The radio-frequency glow-discharge method [30-34] has been the most used method in the study of a-C H films. In this chapter, it is referred to as RFPECVD (radio frequency plasma enhanced chemical vapor deposition). Film deposition by RFPECVD is usually performed in a parallel-plate reactor, as shown in Figure 1. The plasma discharge is established between an RF-powered electrode and the other one, which is maintained at ground potential. The hydrocarbon gas or vapor is fed at a controlled flow to the reactor, which is previously evacuated to background pressures below lO"" Torr. The RF power is fed to the substrate electrode... 

Chemical vapor deposition films have been grown on an Ir/SrTiOs substrate of around 0.6 cm for a field effect transistor application achieving for the first time an RF output power for a device operating at frequencies of the order 10 Hz. Larger-size substrates will eventually allow the development of power diamond transistors at wafer scale. ... 

Gases Chemical vapor deposition Films, monoliths... 

Jensen K F and Kern W 1991 Thermal chemical vapor deposition Thin Film Processes II ed J L Vossen and W Kern (San Diego, CA Academic) chapter III-1, pp 283-368... 

Fluorination of tungsten and rhenium produces tungsten hexafluoride, WF, and rhenium hexafluoride [10049-17-9J, ReF, respectively. These volatile metal fluorides are used in the chemical vapor deposition industry to produce metal coatings and intricately shaped components (see Thin films,... 

Germanium difluoride can be prepared by reduction (2,4) of GeF by metallic germanium, by reaction (1) of stoichiometric amounts of Ge and HF in a sealed vessel at 225°C, by Ge powder and HgF2 (5), and by GeS and PbF2 (6). Gep2 has been used in plasma chemical vapor deposition of amorphous film (see Plasma TECHNOLOGY Thin films) (7). 

Molybdenum hexafluoride is used in the manufacture of thin films (qv) for large-scale integrated circuits (qv) commonly known as LSIC systems (3,4), in the manufacture of metallised ceramics (see MetaL-MATRIX COMPOSITES) (5), and chemical vapor deposition of molybdenum and molybdenum—tungsten alloys (see Molybdenumand molybdenum alloys) (6,7). The latter process involves the reduction of gaseous metal fluorides by hydrogen at elevated temperatures to produce metals or their alloys such as molybdenum—tungsten, molybdenum—tungsten—rhenium, or molybdenum—rhenium alloys. 

Rhenium hexafluoride is used for the deposition of rhenium metal films for electronic, semiconductor, laser parts (6—8), and in chemical vapor deposition (CVD) processes which involve the reduction of ReF by hydrogen at elevated (550—750°C) temperatures and reduced (<101.3 kPa (1 atm)) pressures (9,10). 

Deposition of Thin Films. Laser photochemical deposition has been extensively studied, especially with respect to fabrication of microelectronic stmctures (see Integrated circuits). This procedure could be used in integrated circuit fabrication for the direct generation of patterns. Laser-aided chemical vapor deposition, which can be used to deposit layers of semiconductors, metals, and insulators, could define the circuit features. The deposits can have dimensions in the micrometer regime and they can be produced in specific patterns. Laser chemical vapor deposition can use either of two approaches. 

Epitaxial crystal growth methods such as molecular beam epitaxy (MBE) and metalorganic chemical vapor deposition (MOCVD) have advanced to the point that active regions of essentially arbitrary thicknesses can be prepared (see Thin films, film deposition techniques). Most semiconductors used for lasers are cubic crystals where the lattice constant, the dimension of the cube, is equal to two atomic plane distances. When the thickness of this layer is reduced to dimensions on the order of 0.01 )J.m, between 20 and 30 atomic plane distances, quantum mechanics is needed for an accurate description of the confined carrier energies (11). Such layers are called quantum wells and the lasers containing such layers in their active regions are known as quantum well lasers (12). 

Chemical Vapor Deposition. In chemical vapor deposition (CVD), often referred to as vapor transport, the desired constituent(s) to be deposited are ia the form of a compound existing as a vapor at an appropriate temperature. This vapor decomposes with or without a reducing or oxidizing agent at the substrate— vapor interface for film growth. CVD has been used successfully for preparing garnet and ortho ferrite films (24,25). Laser-assisted CVD is also practiced. 

The epitaxy reactor is a specialized variant of the tubular reactor in which gas-phase precursors are produced and transported to a heated surface where thin crystalline films and gaseous by-products are produced by further reaction on the surface. Similar to this chemical vapor deposition (CVE)) are physical vapor depositions (PVE)) and molecular beam generated deposits. Reactor details are critical to assuring uniform, impurity-free deposits and numerous designs have evolved (Fig. 22) (89). 

Dielectric Deposition Systems. The most common techniques used for dielectric deposition include chemical vapor deposition (CVD), sputtering, and spin-on films. In a CVD system thermal or plasma energy is used to decompose source molecules on the semiconductor surface (189). In plasma-enhanced CVD (PECVD), typical source gases include silane, SiH, and nitrous oxide, N2O, for deposition of siUcon nitride. The most common CVD films used are siUcon dioxide, siUcon nitride, and siUcon oxynitrides. 

In chemical vapor deposition processing, the principal source of residual stress is from a coefficient of expansion mismatch. One of the principal criteria for CVD processing is the matching of the coefficient of expansions of the film and substrate, which limits the possible film—substrate combinations that can be used. 

Titanium carbide may also be made by the reaction at high temperature of titanium with carbon titanium tetrachloride with organic compounds such as methane, chloroform, or poly(vinyl chloride) titanium disulfide [12039-13-3] with carbon organotitanates with carbon precursor polymers (31) and titanium tetrachloride with hydrogen and carbon monoxide. Much of this work is directed toward the production of ultrafine (<1 jim) powders. The reaction of titanium tetrachloride with a hydrocarbon-hydrogen mixture at ca 1000°C is used for the chemical vapor deposition (CVD) of thin carbide films used in wear-resistant coatings. 

Carbon Composites. In this class of materials, carbon or graphite fibers are embedded in a carbon or graphite matrix. The matrix can be formed by two methods chemical vapor deposition (CVD) and coking. In the case of chemical vapor deposition (see Film deposition techniques) a hydrocarbon gas is introduced into a reaction chamber in which carbon formed from the decomposition of the gas condenses on the surface of carbon fibers. An alternative method is to mold a carbon fiber—resin mixture into shape and coke the resin precursor at high temperatures and then foUow with CVD. In both methods the process has to be repeated until a desired density is obtained. 

Dimethylcadmium has found use as a volatile source of Cd for metal organic chemical vapor deposition (MOCVD) production of cadmium-containing semiconductor thin films (qv) such as CdS, Cdi 2 Hg -Te, or Cdi 2 Mn -Te, as multiple quantum weU species (32). Semiconductor-grade material seUs for... 

Alternative Thin-Film Fabrication Approaches. Thin films of electronic ceramic materials have also been prepared by sputtering, electron beam evaporation, laser ablation, chemical beam deposition, and chemical vapor deposition (CVD). In the sputtering process, targets may be metal... 

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