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Ceramics electronic

Oxygen sensor Lean mixture sensor Knock sensor [Pg.308]

Piezoelectric buzzer LED laser Fluorescent tube EL display [Pg.308]

Automatic choke heater Early fuel evaporation heater [Pg.308]

Glow plug Fuel heater Swirl chamber Piston ring Turbo rotor [Pg.308]

Exhaust gas temperature sensor Catalytic substrate Heat insulator [Pg.308]


ADVANCEDCERAMICS - ELECTRONIC CERAMCS] (Vol 1) Electronic ceramic powders... [Pg.357]

ADVANCEDCERAMICS - ELECTRONIC CERAMICS] (Voll) Electronic chip production... [Pg.357]

Fabrication technologies for ah electronic ceramic materials have the same basic process steps, regardless of the appHcation powder preparation, powder processing, green forming, and densiftcation. [Pg.310]

Powder Preparation. The goal in powder preparation is to achieve a ceramic powder which yields a product satisfying specified performance standards. Examples of the most important powder preparation methods for electronic ceramics include mixing/calcination, coprecipitation from solvents, hydrothermal processing, and metal organic decomposition. The trend in powder synthesis is toward powders having particle sizes less than 1 p.m and Httie or no hard agglomerates for enhanced reactivity and uniformity. Examples of the four basic methods are presented in Table 2 for the preparation of BaTiO powder. Reviews of these synthesis techniques can be found in the Hterature (2,5). [Pg.310]

Table 2. Methods Used to Prepare BaTiO Electronic Ceramic Powders... Table 2. Methods Used to Prepare BaTiO Electronic Ceramic Powders...
Table 3. Green Forming Procedures for Electronic Ceramics... Table 3. Green Forming Procedures for Electronic Ceramics...
Presentiy, multilayer capacitors and packaging make up more than half the electronic ceramics market. For multilayer capacitors, more than 20 biUion units are manufactured a year, outnumbering by far any other electronic ceramic component. Multilayer ceramics and hybrid packages consist of alternating layers of dielectric and metal electrodes, as shown in Figures 5 and 6, respectively. The driving force for these compact configurations is miniaturization. [Pg.311]

L. M. Levinson, Electronic Ceramics, Marcel Dekker, Inc., New York, 1988, Chapt. 6. [Pg.316]

S. L. Swart2, "Topics iu Electronic Ceramics," IEEE Trans. Elect. Insul Digest on Dielectrics 25, 935—987 (Oct. 1990). [Pg.316]

Approximately 40% of the U.S. electronic ceramics industry is represented by ferroelectrics. Table 3 shows U.S. consumption of ceramic capacitors and piezoelectric materials (109). [Pg.209]

Japanese suppHers generally dominate the electronic ceramic business. Japanese production of ferroelectric devices in the first nine months of 1990 was valued at 711 x 10 for ceramic capacitors and 353 x 10 for piezoelectric devices, representing growths of 7 and 10.8%, respectively, over the previous year. [Pg.209]


See other pages where Ceramics electronic is mentioned: [Pg.2772]    [Pg.32]    [Pg.36]    [Pg.356]    [Pg.357]    [Pg.454]    [Pg.454]    [Pg.642]    [Pg.651]    [Pg.651]    [Pg.831]    [Pg.889]    [Pg.986]    [Pg.307]    [Pg.308]    [Pg.308]    [Pg.308]    [Pg.308]    [Pg.308]    [Pg.308]    [Pg.309]    [Pg.310]    [Pg.310]    [Pg.311]    [Pg.311]    [Pg.311]    [Pg.311]    [Pg.312]    [Pg.313]    [Pg.313]    [Pg.314]    [Pg.314]    [Pg.315]    [Pg.315]    [Pg.316]   
See also in sourсe #XX -- [ Pg.2 , Pg.2 , Pg.2 , Pg.2 , Pg.3 , Pg.17 , Pg.17 ]

See also in sourсe #XX -- [ Pg.2 , Pg.2 , Pg.2 , Pg.2 , Pg.3 , Pg.17 , Pg.17 , Pg.18 ]




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