Film deposition techniques

Epitaxial crystal growth methods such as molecular beam epitaxy (MBE) and metalorganic chemical vapor deposition (MOCVD) have advanced to the point that active regions of essentially arbitrary thicknesses can be prepared (see Thin films, film deposition techniques). Most semiconductors used for lasers are cubic crystals where the lattice constant, the dimension of the cube, is equal to two atomic plane distances. When the thickness of this layer is reduced to dimensions on the order of 0.01 )J.m, between 20 and 30 atomic plane distances, quantum mechanics is needed for an accurate description of the confined carrier energies (11). Such layers are called quantum wells and the lasers containing such layers in their active regions are known as quantum well lasers (12). 

Thin vitreous sHica films are usually formed by vapor depositioa or r-f sputteriag (see Thin films, film-DEPOSITION techniques). Vapor depositioa is geaerally effected by the pyrolytic decompositioa of tetraethoxysHane or another alkoxysHane. SHica has been most extensively used ia r-f sputteriag of... 

Carbon Composites. In this class of materials, carbon or graphite fibers are embedded in a carbon or graphite matrix. The matrix can be formed by two methods chemical vapor deposition (CVD) and coking. In the case of chemical vapor deposition (see Film deposition techniques) a hydrocarbon gas is introduced into a reaction chamber in which carbon formed from the decomposition of the gas condenses on the surface of carbon fibers. An alternative method is to mold a carbon fiber—resin mixture into shape and coke the resin precursor at high temperatures and then foUow with CVD. In both methods the process has to be repeated until a desired density is obtained. 

Many researchers have found that differences in film deposition techniques and deposition parameters profoundly influence the oxidation and stability of MO layers. For example, increases of Ar pressure and bias voltage, leading to more porous structures, result in easier oxidation and quicker changes in aging tests [168-172], Such films are particularly corrosion-prone. 

The success of this research is guiding our materials efforts into increasing chain packing density and orientation to increase, including a variety of new thin film deposition techniques. 

Menard, E. Bilhaut, L. Zaumseil, J. Rogers, J. A. 2004. Improved surface chemistries, thin film deposition techniques, and stamp designs for nanotransfer printing. Langmuir 20 6871-6878. 

Films for the DCC approach can be deposited by any conventional film deposition technique including CVD, evaporation, PVD, sol-gel, etc. By monitoring the rates and the deposition time for each of the constituents in a given sample, approximate compositions of the various samples can be tracked. However, in any thin-film sample the direct structural and compositional evaluation is problematic. 

The synthesis of intermediary inorganic sols or polymers in solution whose rheological properties may be attractive for the film deposition techniques such as spin coating or the spinning of fibers. 

Thin semiconductor films (and other nanostructured materials) are widely used in many applications and, especially, in microelectronics. Current technological trends toward ultimate miniaturization of microelectronic devices require films as thin as less than 5 nm, that is, containing only several atomic layers [1]. Experimental deposition methods have been described in detail in recent reviews [2-7]. Common thin-film deposition techniques are subdivided into two main categories physical deposition and chemical deposition. Physical deposition techniques, such as evaporation, molecular beam epitaxy, or sputtering, involve no chemical surface reactions. In chemical deposition techniques, such as chemical vapor deposition (CVD) and its most important version, atomic layer deposition (ALD), chemical precursors are used to obtain chemical substances or their components deposited on the surface. 

E. Menard, L. Bilbaut, J. Zaumseil, and J. A. Rogers, Improved chemistries, thin film deposition techniques and stamp design for nanotransfer printing , Langmuir 20, 6871 (2004). 

FePt-based hard nanostructures have been obtained by film deposition techniques and severe cold deformation. 

This book is devoted to the properties, preparation and applications of zinc oxide (ZnO) as an transparent electrode material. It focuses on ZnO for thin film solar cell applications and hopefully inspires also readers from related fields. The book is structured into three parts to serve both as an overview as well as a data collection for students, engineers and scientists. The first part, Chaps. 1-4, provide an overview of the application and fundamental material properties of ZnO films and their surface and interfaces properties. Chaps. 5-7 review thin film deposition techniques applied for ZnO preparation on lab scale but also for large area production. Finally, Chaps. 8 and 9 are devoted to applications of ZnO in silicon- and chalcopyrite-based thin film solar cells, respectively. One should note that the application of CVD grown ZnO in silicon thin film cells is discussed earlier in Chap. 6. 

The potential benefits of CVD over other film deposition techniques are that CVD-derived films can be deposited under conditions that give conformal coverage, they can be deposited at low temperatures, there can be a high level of compositional control, thin layers can be deposited, the technique can be scaled to coat large areas uniformly, and there is also the possibility for area-selective deposition13 as a result of the chemical nature of this process. The details of CVD and related chemical deposition processes such as atomic layer epitaxy (ALE), organometallic vapor-phase epitaxy (OMVPE), and others have been described elsewhere.6... 

Refs. [i] Hassel AW, Diesingb D (2002) Thin Solid Films 414 296 [ii] Strehblow HH (2003) Passivity of metals. In AlkireRC and Kolb DM (eds) Advances in electrochemical science and engineering, vol. 8. Wiley-VCH, Weinheim, pp 271-374 [iii] Kern W, Schuegraf KK (2002) Deposition technologies and applications introduction and overview. In Seshan K (ed) Handbook of thin film deposition techniques principles, methods, equipment and applications. William Andrew, Noyes, p 19... 

Glow-discharge polymerization is a third film-deposition technique 1185—... 

Seshan K, editor. Handbook of Thin Film Deposition Techniques Principles, Methods, Equipment and Applications. 2nd ed. William Andrew Inc. 2002. p 553. 

MOCVD techniques for BST capacitor technology for next-generation ULSI DRAMs were reviewed. Although it has been proven that the material properties of BST films are good enough for DRAM applications, integration of the BST film into the devices requires further research, especially in terms of BST film deposition techniques and electrode fabrication technologies. 

The modern microelectronics and semiconductor industries have imposed severe demands on the quality of films produced by the silicon epitaxy process and the epitaxial film deposition techniques need to fulfill several general... 

Research on nano- and micro-fabrications based on anodizing treatments combined with chemical/mechanical processes such as laser irradiation, atomic force micro-probe processing and thin film deposition techniques... 

PLD is a thin film deposition technique akin to physical vapour deposition (PVD) whereby a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material to be deposited (Figure 5.47). 

Hunt, A.T., Carter, W.B., and Cochran, J.K. (1993) Combustion chemical vapour deposition a novel thin-film deposition technique. Appl. Phys. Lett., 63 (2), 266. 

Demonstrate feasibility of reducing Pt-Ru catalyst loading to 0.5 mg/cm using thin film deposition techniques. 

---