Aspen Institute

At the 2005 Aspen Institute Roundtable on Information Technology, 25 thought leaders discussed the broad implications of push vs. pull economies, generating the... 

Bollier, D. (1996). In The future of electronic commerce a report of the fourth annual Aspen Institute roundtable on information technology, Washington, DC. The Aspen Institute. 

Weiss, C. H. (1995). Nothing as practical as good theory Exploring theory-based evaluation for comprehensive community initiatives for children and families. In J. P. Connell, A. C. Kubisch, L. B. Schorr, C. H. Weiss (Eds.), New approaches to evaluating community initiatives Concepts, methods, and contexts. New York Aspen Institute. 

Now claiming a broad coalition of MBA students, graduates and advisors, representing over 250 schools from around the world, the organization partners with the Aspen Institute and the World Economic Forum. 

Sample 2 is run with a steam-exploded, solvent-extracted, aspen lignin. This backbone, provide by the Solar Energy Research Institute of Golden, Colorado as DJLX13, is an I-O-TECH process,... 

Pate-Comell E (1996a) Different levels of treatment of uncertainty in risk analysis and aggregation of expert opinions. Presented at Elements of Change Conference, Aspen Global Change Institute, Aspen, CO, 31 July - 8 August 1996. 

ASPEN (Advanced System for Process ENgineering) was funded at that time to provide this technical and economic analysis for the specialized requirements of fossil energy conversion processes. The project was established at the Massachusetts Institute of Technology for 3,285,000 over three years. 

ASPEN Technical Reference Manual, Meesachueetts Institute of Technology, May... 

SOURCE Adapted from Functional Specifications for ASPEN, Department of Chemical Engineering, Massachusetts Institute of Technology, December 1977. 

The design support software tools employed in the case study are of a completely different nature. They include commercial as well as legacy tools. Examples are Microsoft Excel, various process simulators such as Polymers Plus from Aspen Technology, gPROMS from PSE, MOREX, BEMFlow and BEMView from Institut filr Kunststoffverarbeitung at RWTH Aachen University, the project database Comos PT from innotec, the document manage-... 

Among other hardwoods indigenous to the North Central United States are maple, birch and aspen. These species have little commercial value but are found in areas close to major markets. Mobay sponsored a study, conducted by the Institute of Wood Research at Michigan Technological University, to determine the effects of processing variables on isocyanate-bound flakeboard prepared from a mixture of these species and to compare resultant panel properties with those of a standard panel prepared with a commercial aqueous phenolic resin under typical processing conditions for that type of resin. 

We wish to thank Dr. Darrell D. Nicholas, Mr. Roy D. Adams and Ms. Susan Mateer of the Institute of Wood Research at Michigan Technological University for their work in conducting the mixed hardwood flakeboard experimental program. We also wish to thank Dr. Michael 0. Hunt of Purdue University and Dr. William F. Lehmann of Weyerhaeuser Corporation for their help in the red oak flake-board work and Mr. Otto G. Udvardy of Borden Chemical for the aspen waferboard study. Finally, we would like to thank Dr. Ronald Taylor of Mobay Chemical Corporation for his considerable advice and help with the multiple correlation analysis. 

Air-dried com stover provided by the Agricultural Utilization Research Institute was milled and then screened, and only the fraction less than 2-mm sieve was used in this research. Aspen pulping wood chips (Populus tremuloides) with a pretreatment, which were the intermediates of a biorefinery process, were provided by the Department of Bioproducts and Biosystems Engineering, University of Minnesota, St. Paul, Minnesota. Aspen wood chips that passed through a 1 -in. sieve but not through a 0.5-inch sieve were used. Aspen wood chips were pretreated with dilute sulfuric acid to remove partial hemicellulose. 

ASPEN Techniasl Reference Manual, Massachusetts Institute of Tedinology, May 1982. 

The fouling factor has to be determined from actual heat exchanger performance based on online measurements taken from a process unit test run. Heat exchanger clean performance is obtained from process flowsheet simulation software (e.g., Hysys by Aspen Tech or Unisim by Honeywell), while dirty performance from exchanger rating software (e.g., HTRI by Heat Transfer Research Institute). 

One way to input molecular structure of the new component is to enter individual atoms and bonds. However, a simpler way is to import the molecular structure from other component databanks. A very useful resource is the NIST (National Institute of Standards and Technology) Chemistry WebBook. The information for this new component is shown in Figure 3.66. Click the molecular structure file, 2d Mol file, and save in a known directory with a given file name. The next step is to go to Molecular Structure of EMC under Properties and Click Import Structure to import this file into Aspen Plus (see Fig. 3.67). After this step, ask Aspen Plus to calculate bonds by clicking Calculate Bonds. The graphical structure of EMC is successfully imported into Aspen Plus as shown in Figure 3.68. 

Some of the work described here has been supported by the National Science Foundation under grant nos. DMR-0339147 and PHY99-07949, by Research Corporation and by the University of Missouri Research Board. Parts of this work have been performed at the Aspen Center for Physics and the Kavli Institute for Theoretical Physics, Santa Barbara. 

Schneid, Thomas D. and Schuman, Michael S. Legal liability, Aspen Publishers, 1997. Marcum, Everett C. Modem safety management practice. Worldwide Safety Institute, 1978. Anton, Thomas J. Occupational safety and health management, Irwin-McGraw Hill, 1989. 

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