Aspen waferboard

Schmidt, E.L. (1983). Effects of a formaldehyde and sulphur dioxide treatment on decay and mechanical properties of aspen waferboard. International Research Group on Wood Preservation, Doc. No. IRGAVP 3242. 

We wish to thank Dr. Darrell D. Nicholas, Mr. Roy D. Adams and Ms. Susan Mateer of the Institute of Wood Research at Michigan Technological University for their work in conducting the mixed hardwood flakeboard experimental program. We also wish to thank Dr. Michael 0. Hunt of Purdue University and Dr. William F. Lehmann of Weyerhaeuser Corporation for their help in the red oak flake-board work and Mr. Otto G. Udvardy of Borden Chemical for the aspen waferboard study. Finally, we would like to thank Dr. Ronald Taylor of Mobay Chemical Corporation for his considerable advice and help with the multiple correlation analysis. 

Figure 9. Homogeneous aspen waferboard with Mondur E-441 binder.

Figure 10. Predicted modulus of rupture vs. nominal density-aspen waferboard.

Wood FIa.ke Boards. This category covers a range of products depending on the size and orientation of the wood flakes used. The earliest product was made in the 1950s using low density wood species, such as aspen and pine, with the flakes bonded together with phenoHc resins. Today there are two types of flake board, waferboard and oriented strand board (OSB). 

Waferboard is made almost exclusively from aspen wood and the flakes are roughly square in shape, up to 2 in. (5 cm) on a side. They are used for low end stmctural sheathing appHcations. 

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