Metal-oxide-semiconductor field-effect transistor development

Gate oxide dielectrics are a cmcial element in the down-scaling of n- and -channel metal-oxide semiconductor field-effect transistors (MOSEETs) in CMOS technology. Ultrathin dielectric films are required, and the 12.0-nm thick layers are expected to shrink to 6.0 nm by the year 2000 (2). Gate dielectrics have been made by growing thermal oxides, whereas development has turned to the use of oxide/nitride/oxide (ONO) sandwich stmctures, or to oxynitrides, SiO N. Oxynitrides are formed by growing thermal oxides in the presence of a nitrogen source such as ammonia or nitrous oxide, N2O. Oxidation and nitridation are also performed in rapid thermal processors (RTP), which reduce the temperature exposure of a substrate. 

A novel development of the use of ion-selective electrodes is the incorporation of a very thin ion-selective membrane (C) into a modified metal oxide semiconductor field effect transistor (A) which is encased in a non-conducting shield (B) (Fig. 15.4). When the membrane is placed in contact with a test solution containing an appropriate ion, a potential is developed, and this potential affects the current flowing through the transistor between terminals Tt and T2. 

Metal oxide semiconductor field-effect transistors (MOSFETs) are field effect transistors with a thin film of silicon dioxide between the gate electrode and the semiconductor. The charge on the silicon dioxide controls the size of the depletion zone in the polype semiconductor. MOSFETs are easier to mass produce and are used in integrated circuits and microprocessors for computers and in amplifiers for cassette players. Traditionally, transistors have been silicon based but a recent development is field-effect transistors based on organic materials. 

Ion-Selective Field Effect Transistors [22b,c,d] An ion-selective field effect transistor (ISFET) is a hybrid of an ion-selective electrode and a metal-oxide semiconductor field effect transistor (MOSFET), the metal gate of the MOSFET being replaced by or contacted with a thin film of a solid or liquid ion-sensitive material. The ISFET and a reference electrode are immersed in the solution containing ion i, to which the ISFET is sensitive, and electrically connected as in Fig. 5.37. A potential which varies with the activity of ion i, o(i), as in Eq. (5.38), is developed at the ion-sensitive film ... 

Nevertheless, the first functional working TFT was demonstrated by Weimer in 1962 (Ref 2). He used thin films of polycrystalline cadmium sulfide, similar to those ones developed for photodetectors. The simplified structure is shown in Fig. 1(b). Other TFT semiconductor materials like CdSe, Te, InSb and Ge were investigated, but in the mid-1960 s the emergence of the metal oxide semiconductor field effect transistor (MOSFET) based on the crystalline silicon technology and the possibility to perform integrated circuits, led to a decline in TFT development activity by the end of the 1960s. 

Metal oxide semiconductor field effect transistors (MOSFETs) constitute other materials with applicability in the development of biosensors. Usually, a MOSFET structure consists of a metal gate on top of an oxide layer, tyqjically Si02 [189]. The catalytic properties of these sensors depend upon the type of the gate metal as well as the temperature at which the MOSFET is operated. The most used catalytic metals used as gate materials are Pd (is a good... 

One of the most ambitious trends in ion-selective electrode design is the development of ion-selective membranes combined with a metal oxide semiconductor field-effect transistor (MOSFET) such as TSFETs in a single package. Rapid advances are being made with these devices which would facilitate miniaturization. 

For driving matrix liquid crystal display panels, the silicon metal-oxide semiconductor field effect transistor (MOSFET) fabricated on a silicon monolithic wafer has been investigated by several groups [134-150]. The MOS transistor circuit fabrication techniques are well developed and have been used to produce various LSI devices. A dynamic scattering mode, a planar type GH mode or a polymer dispersed (PD) mode are used in these displays because the silicon wafer is intrinsically opaque. The circuit configuration of the panel is essentially the same as that of the p-Si TFT switch matrix addressed liquid crystal display panel as shown its equivalent circuit in Fig. 18(a). 

Figure Bl.22.4. Differential IR absorption spectra from a metal-oxide silicon field-effect transistor (MOSFET) as a fiinction of gate voltage (or inversion layer density, n, which is the parameter reported in the figure). Clear peaks are seen in these spectra for the 0-1, 0-2 and 0-3 inter-electric-field subband transitions that develop for charge carriers when confined to a narrow (<100 A) region near the oxide-semiconductor interface. The inset shows a schematic representation of the attenuated total reflection (ATR) arrangement used in these experiments. These data provide an example of the use of ATR IR spectroscopy for the probing of electronic states in semiconductor surfaces [44]-...

The process of GaAs oxidation is so complex that even after many years of work there are important issues that are still a matter of controversy. Consequently, the GaAs metal insulator semiconductor field effect transistor (MISEET) technology did not develop very weU since the electronic passivation of GaAs is not fully resolved. The challenges in the fabrication of high quality oxide layers on GaAs stimulate researchers to find out the most suitable techniques and conditions to solve the interface-related problems. 

Different types of SiC Field Effect Transistors, Metal Oxide Semiconductor Transistors (MOSFETs), Metal Semiconductor Field Effect Transistors (MESFETs), and Junction Field Effect Transistors (JFETs) compete for future applications in high temperature and harsh environment electronics. This Datareview details these various types of FETs, the structures used and the performances obtained. Interesting recent developments and potential applications, such as FET integrated circuits, a hybrid operational amplifier and an inverter circuit are also outlined. 

Nanocrystals are receiving significant attention for nano-electronics application for the development of future nonvolatile, high density and low power memory devices [1-3]. In nanocrystal complementary metal oxide semiconductor (CMOS) memories, an isolated semiconductor island of nanometer size is coupled to the channel of a MOS field effect transistor (MOSFET) so that the charge trapped in the island modulates the threshold voltage of the transistor (Fig. 1). 

The metal-like property of these polymers is based on their chemical nature, which consists of chains of conjugated double bonds. If these polymers are oxidized, they become electrical conducting. In the neutral state they can have properties like an inorganic semiconductor. This has now become as important as the metal-like conductivity. One example is the development of an organic field effect transistor (OFET). 

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