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Transistors development

To achieve the lowest possible delay a bipolar switching transistor developed by IBM minimizes parasitic resistances and capacitances. It consists of self-aligned emitter and base contacts, a thin intrinsic base with an optimized collector doping profile, and deep-trench isolation (36). Devices must be isolated from each other to prevent unwanted interactions in integrated circuits. While p—n junctions can be used for isolation, IBM s approach etches deep trenches in the siUcon wafer which are filled with Si02 to provide electrical insulation. [Pg.352]

Neutron activation analysis is an attractive method in many trace element problems, or where the total amount of sample is limited. Many geochemical studies of trace constituents and semi-conductor (transistor) developments have used the technique, whilst in recent years pollution investigations have provided a new focus. Interest in the forensic potentialities is also growing. Small flakes of paint, single hairs and a variety of other small samples have been analysed and identified by activation analysis. In recent years activation analysis has lost further ground to ICP-MS which provides more comprehensive information and is more readily operated. Sensitivity is also comparable in many cases. [Pg.472]

First transistor built (point-contact form) by Bardeen, Brattain, and Shockley of Bell Telephone Labs Junction transistor developed to avoid reliability problems with point-contact transistor... [Pg.1616]

This chapter reviews the current status of the fibrous transistor development and textile electronic circuit. It covers semiconducting materials, fibrous transistors, and textile electronic circuits. Section 25.2 will discuss the materials employed in semiconductor manufacturing, especially in fibrous transistors. Section 25.3 will present traditional and fibrous transistors. Textile electronic circuits are discussed in Section 25.4. The different methodologies of use will be compared. And finally, the conclusion and perspectives will be discussed. [Pg.570]

Figure Bl.22.4. Differential IR absorption spectra from a metal-oxide silicon field-effect transistor (MOSFET) as a fiinction of gate voltage (or inversion layer density, n, which is the parameter reported in the figure). Clear peaks are seen in these spectra for the 0-1, 0-2 and 0-3 inter-electric-field subband transitions that develop for charge carriers when confined to a narrow (<100 A) region near the oxide-semiconductor interface. The inset shows a schematic representation of the attenuated total reflection (ATR) arrangement used in these experiments. These data provide an example of the use of ATR IR spectroscopy for the probing of electronic states in semiconductor surfaces [44]-... Figure Bl.22.4. Differential IR absorption spectra from a metal-oxide silicon field-effect transistor (MOSFET) as a fiinction of gate voltage (or inversion layer density, n, which is the parameter reported in the figure). Clear peaks are seen in these spectra for the 0-1, 0-2 and 0-3 inter-electric-field subband transitions that develop for charge carriers when confined to a narrow (<100 A) region near the oxide-semiconductor interface. The inset shows a schematic representation of the attenuated total reflection (ATR) arrangement used in these experiments. These data provide an example of the use of ATR IR spectroscopy for the probing of electronic states in semiconductor surfaces [44]-...
L First manufacturing use of chemically amplified resists Plasma-developed resist first described X-ray proximity lithography demonstrated Bis-azide rubber resists introduced DNO-novolac resist for microelectronics introduced Photoresist technology first applied to transistor fabrication DNO-novolac resist patented by Kalle... [Pg.114]

Gate oxide dielectrics are a cmcial element in the down-scaling of n- and -channel metal-oxide semiconductor field-effect transistors (MOSEETs) in CMOS technology. Ultrathin dielectric films are required, and the 12.0-nm thick layers are expected to shrink to 6.0 nm by the year 2000 (2). Gate dielectrics have been made by growing thermal oxides, whereas development has turned to the use of oxide/nitride/oxide (ONO) sandwich stmctures, or to oxynitrides, SiO N. Oxynitrides are formed by growing thermal oxides in the presence of a nitrogen source such as ammonia or nitrous oxide, N2O. Oxidation and nitridation are also performed in rapid thermal processors (RTP), which reduce the temperature exposure of a substrate. [Pg.348]

The remaining class depicted in Figure 2 is that of soHd-state devices, ie, transistors, various types of semiconductor diode amplifiers, etc. At frequencies below 1 GHz, generation of hundreds or even at the lower frequencies, kilowatts, is feasible by soHd state. Above 1 GHz power capabiHty of soHd-state sources drops. Development of efficient (- 50%) sources at about the 50 W level at S-band (2 GHz) has been demonstrated. It is reasonable to expect soHd-state sources to replace tubes for low frequency and low (<100 W) power appHcations (52). For high power or high frequency, however, tube sources should continue to prevail. [Pg.341]

Phthalocyanines have been used to incorporate semiconductor properties in polymers (182) or to develop a thin-film transistor (183). Phthalocyanines and their derivatives can act as dyes in color photography (qv) (184) or electrophotography (185). Light-sensitive compositions for use on Hthographic plates are comprised in part of copper phthalocyanine blue (186). Dichlorosilicon phthalocyanine [19333-10-9] has been used in the... [Pg.506]

Interface states played a key role in the development of transistors. The initial experiments at Bell Laboratories were on metal/insulator/semiconductor (MIS) stmctures in which the intent was to modulate the conductance of a germanium layer by applying a voltage to the metal plate. However, only - 10% of the induced charges were effective in charging the conductance (3). It was proposed (2) that the ineffective induced charges were trapped in surface states. Subsequent experiments on surface states led to the discovery of the point-contact transistor in 1948 (4). [Pg.348]

Novel glycerol and formaldehyde selective sensors based on pEI-Sensitive Field Effect Transistors as transducers and Glycerol Dehydrogenase and Formaldehyde Dehydrogenase as biorecognition elements have been developed. The main analytical parameters of the sensors have been investigated and will be discussed. [Pg.303]

The development of this hybrid combination in a bipolar transistor has greatly enhanced the application of power transistors in the field of power conversion and variable-speed drives. It possesses the qualities of both the power bipolar transistor (BJT) and the power MOSFET. Like a power MOSFET, it is a voltagc-eontrollcd switching device... [Pg.113]

Today, dynamic random-access memories (DRAMs) are transistor/capacitor-based semiconductor devices, with access times measured in nanoseconds and very low costs. Core memories were made of magnetic rings not less than a millimetre in diameter, so that a megabyte of memory would have occupied square metres, while a corresponding DRAM would occupy a few square millimetres. Another version of a DRAM is the read-only memory (ROM), essential for the operation of any computer, and unalterable from the day it is manufactured. We see that developments in magnetic memories involved dramatic reductions in cost and... [Pg.286]


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See also in sourсe #XX -- [ Pg.2 , Pg.45 ]




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Metal-oxide-semiconductor field-effect transistor development

Organic field-effect transistor development

Other Notable Developments in Transistor Technology

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