Component count

Lower component count with a smaller footprint... 

Inversion of stereochemistry counts like antarafacial and two antarafacial components count like suprafacial. 

Reduced component count over metallic equivalents... 

The rationahzation potential comes from reduced part and component counts and shortened process chains. In several apphcations, it was possible to replace more than 10 parts of a conventional design solution with a single MID, thus reducing assembly steps and material use. Further potential lies in the increased reliability. 

In order to rninitnise the component count (and therefore the number of components that contribute to the device failure rate) there are a few constraints to the schematic design ... 

From the example in Figure 7, it may be seen that this filter design is effective at removing imwanted harmonics from the ultrasonic signals. This allows the filter function for each channel to be completely implemented within the FPGA and again reduces the component count for the system. 

Although wires between chips on the MCM are inexpensive, off-MCM pins are expensive. The MCM should contain as much of the wiring as is feasible. On the other hand, an overly complex MCM with a high component count wiU have a poor final yield. 

In Reference 1, it is stated that the ratio between passive and active components is about 9 1 for a mobile phone. Furtirermore, the passives occupy 80% of the space and account for 70% of the cost. Three hxmdred components is tire average passive component count in cellular phones. Road maps for these applications show a clear trend toward higher integration on tire chip side. From six ICs necessary for the phone fimction in 1998, it decreased to one for the third generation of cell phones in 2004 [2]. According to a study by Prismark [3], the need for the embedded component density will grow to about 30 passives/cm in the year 2010. 

In the area of heat engines, Brayton cycles are under study. The MARS (27) high temperature concept proposes an open cycle air-turbine. The STAR concepts (24, 25, 29) consider a supercritical CO2 Brayton cycle, which can theoretically reach conversion efficiencies of about 43% at core outlet temperatures of 500-530°C, traditional for sodium and lead-bismuth cooled reactors. Since the Brayton cycle rotating machinery is smaller and the component count is smaller than for the Rankine cycle, the targeted result would be higher conversion efficiency at lower capital cost as well as smaller required operating crew and skill level to achieve reduced operation and maintenance costs. 

Topologies often vary based on control scheme, switch rating, component count, and circuit complexity. While various topologies have been compared and presented in the literature, the robust buck-boost (half-bridge) DC-DC converter remains the most popular for use in hybrid battery-supercapacitor systems as a result of its simplicity and efficiency. 

Profile Dependencies. The solder paste composition, circuit board lay-up (number of layers, board material), component types, component count, and the nnmber of components per unit area on the board will dictate or influence reflow profile characteristics. Oven performance such as heating characteristics (number of heater zones and responsiveness of each module) will dominate the process and profile. Althongh the reqnirements of the in use determine each profile, how well the profile is maintained depends on the materials to be reflowed, the heating characteristics, repeatability health of process eqnipment, and the attention to detail by the process engineer. 

For many years, processing units in electrotechnical control systems were implemented using electromechanical devices such as relays, switches, push buttons and so on. This discrete component technology remains in widespread use today. One of the disadvantages of this type of technology, particularly in more complex applications, is that as the component count increases so does the amount of cabling needed to interconnect them all, with concomitant increases in cost and unreliabihty, and problems with maintainability. 

Moreover, the new SoC facilitates the development of modules and platforms for displays that can be incorporated into multiple models, rather than one-off developments for each car model as in the past. This, in turn, enables a significant reduction in component counts for display systems, while also making it easy to reuse products in different car models. 

Clearly, maintenance activities inherit the hazards of the system on which they are performed and such hazards are usually independent of whether the system is or is not safety-critical however, certain aspects of maintainability can induce additional hazards. For example, if Built-In Test Equipment (BITE) is used, it must be remembered that a failure of the BITE can induce a system failure. Similarly, external Special Test Equipment (STE) and Maintenance Assist Modules (MAMs) must not only be designed so that their failure does nor bring down the system but also so that their use does not introduce sneak conditions [11], leading to transient operational failures. It is thus vitally important that the design of such ancillary systems be co-ordinated with that of the main system and that they are also included witliin the scope of the system safety analysis. Finally, it must be remembered that the inclusion of BITE will adversely affect the system s reliability because the component-count will be increased thus, BITE should always be examined in an availability analysis, to ensure that the improvement in maintainability offsets the loss of reliability. 

Companies like Poly Fuel, Neah Power Systems, Medis Technologies, MTI MicroFuel Cells, Alberta Research Council, Toshiba, Hitachi, NEC, CASIO, AIST and Honda Technical Research Laboratory are exploring innovative ways for reduction in component count, elimination of auxiliaries such as pumps and valves, alternatives to membranes and packaging technologies to realize an elegant, simpler micro fuel cell product. Hitachi, Toshiba, NEC and NTT DoCoMo have all announced plans to sell methanol-powered devices (Bostaph et al., 2002, Dillon et al., 2004). 

Component count 33 SMD per card, single-sided application... 

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