Embedded components

On a larger scale, self-contained application programs can be driven by each other object linking and embedding/Component Object Model (OLE/COM), UNIX pipes and signals, and Apple events allow this to happen. Communicating components can be written in different languages, and each can execute in its own space. 

ABC transporters are involved in both uptake and excretion of a variety of substrates from ions to macromolecules. Whereas export systems of this type are present in all kingdoms of life, import systems are exclusively found in prokaryotes. ABC transporters are minimally composed of two hydrophobic membrane embedded components and two ATPase units. 

When ox does have non-generic associated points, their closures are called the embedded components of X. The simplest case is in Example P, Ch. II ... 

Thus, there is a canonical dualizing pair (/, / R/ / — 1) when / is smooth and there are explicit descriptions of its basic properties in terms of differential forms. But it is not at all clear that there is a canonical such pair for all /, let alone one which restricts to the preceding one on smooth maps. At the (homology) level of dualizing sheaves the case of varieties over a fixed perfect field is dealt with in [Lp, 10], and this treatment is generalized in [HS, 4] to generically smooth equidimensional maps of noetherian schemes without embedded components. 

In Reference 1, it is stated that the ratio between passive and active components is about 9 1 for a mobile phone. Furtirermore, the passives occupy 80% of the space and account for 70% of the cost. Three hxmdred components is tire average passive component count in cellular phones. Road maps for these applications show a clear trend toward higher integration on tire chip side. From six ICs necessary for the phone fimction in 1998, it decreased to one for the third generation of cell phones in 2004 [2]. According to a study by Prismark [3], the need for the embedded component density will grow to about 30 passives/cm in the year 2010. 

Integration of passives in LTCC is also used to build components. Several elements can be combined in a multilayer structure to achieve a specific electrical function (e.g., a band-pass filter). These small-sized components have terminations allowing surface-moimt assembly operations (land grid, castellation, or ball grid array [BGA]). Depending on the nature of diese passive multicomponent devices, they are referred as monolithic (only LTCC elements) or hybrid [58] (mixture of embedded components and additional surface-mounted elements). Reasons for not implementing all passives in the hybrid type are ... 

Next, the schematic is divided into components to be and not to be realized in LTCC. This step is not necessary in the design of monolithic LTCC devices. After partitioning, the fine design of embedded components is done. There are many parameters that can be adversely varied, such as plate area vs. 

Finally, a module simulation including electrical models of the SMDs, embedded components, wiring, and the module interface (e.g., solder bumps) helps to find out possible problems due to parasitic cross-coupling effects [63]. The internal elements can be modified to compensate these effects. It might be even necessary to increase the distance between components or to change their physical dimension. Process or material tolerances are used to assess repeatability and manufacturability (Figure 9.68). 

Prismark Partners LLC, Pushing the Shrinking Envelope — A Status Report on Embedded Passives in PCBs, Cold Spring Harbor, NY, December 2000. Thust, H., Thelemarm, T., Ehrhardt W, Driie, K.-H, Muller, J., Embedded components and functions in LTCC - review and prospect. Proceedings of Ceramic Interconnect Technology The Next Generation, Denver, CO, April 2003, invited paper. 

Embedded components Components formed or inserted inside the primary interconnect substrate are said to be embedded. Embedded components can be either passives or actives (see the preceding definitions). 

Placed embedded components In contrast to formed components, components (both discrete passives and small actives) can also be placed inside the board using conventional placement machines and technologies. This manufactming technique integrates very well with the any layer via type of contruction. 

See Fig. 21.1 for a cross section of a multilayer board with all types of embedded components. 

Module with embedded components Embedded active component... 

FIGURE 21.1 Cross section of a multilayer board showing the use of all types of embedded components, both passive and active. (Courtesy of Jisso International Council [JICJ.)... 

Advantages from embedding components inside the board include ... 

Piontek, H.-M. Self-description mechanisms for embedded components in cooperative systems. Der Andere Verlag (2007)... 

MSDS (material safety data sheet) for embedded components... 

---