Circuit packaging

Ceramics. Calcined aluminas are used in both electronic and stmctural ceramics (see Advanced ceramics). Electronic appHcations are dominant in the United States and Japan whereas mechanical appHcations are predominant in Europe (1). Specialty electronic integrated circuit packages generally use the low soda and thermally reactive aluminas. 

The 10 volumes in the Series on characterization of particular materials classes include volumes on silicon processir, metals and alloys, catalytic materials, integrated circuit packaging, etc. Characterization is approached from the materials user s point of view. Thus, in general, the format is based on properties, processing steps, materials classification, etc., rather than on a technique. The emphasis of all volumes is on surfaces, interfaces, and thin films, but the emphasis varies depending on the relative importance of these areas for the materials class concerned. Appendixes in each volume reproduce the relevant one-page summaries from the Encyclopedia and provide longer summaries for any techniques referred to that are not covered in the Encyclopedia. 

Hakim, E. B., Ninth International Electronic Circuit Packaging Symp. (1968)... 

Integrated circuit packaging (hard disk drive HDD) trays... 

Additive processes ion implantation, 361 metal layer deposition, 361 resist requirement, 361 vapor dopant diffusion, 361 Additives for F scavenging, 415 Advanced very-large-scale integrated-circuit package, 490, 492 Aluminum... 

Senturia, S. D. Huberman, M. G. Van der Eloot, R. Proc. ARPA/fBS Workshop on Moisture Measurement in Integrated Circuit Packages, (1978) MIS Special Publication 400-69, p. 108. 

Alumina ceramics are widely used for thick-film circuit substrates and for integrated circuit packaging. This aspect is discussed in Section 5.5.5. 

Processing PCTFE is by the conventional methods (extrusion, injection, etc.) processing temperatures are high, and any degradation of PCTFE can cause severe corrosion and environmental problems. Applications include wire and cable insulation, electronic flexible printed circuits, packaging material (transparent film and sheet), pharmaceutical industry in particular strip and blister packs for tablets and capsules, etc. In the chemical industry, used as gaskets, 0-rings, valve seats, chemical tank liners, etc. 

Some of the present industrial uses of diamond coatings include cutting tools, optical windows, heat spreaders, acoustic wave filters, flat-panel displays, photomultiplier and microwave power tubes, night vision devices, and sensors. Because its thermal conductivity and electrical insulation qualities are high, diamond is used for heat sinks in x- ray windows, circuit packaging, and high-power electroific devices. Moreover, the high chemical stability and inertness of diamond make it ideal for use in corrosive environments and in prosthetic devices that require biocompatibility. 

Silicone Gels and Coatings for Integrated-Circuit Packaging... 

Solid state lasers have become ubiquitous in our society. Pulsed YAG Nd lasers are used for welding of metals and plastics. Among the applications are medical apparatus catheters where the weld size must be very small fiber optics communication systems and hermetic sealing of integrated circuit packages. 

Uner J, Theriault M, Carsac C, Sindzingre T. The Application of atmosphere pressure plasma to various steps in integrated circuit packaging, Proc. 3rd Annual Semiconductor Packaging Symp SEMICON West 2000. 

Figure 2 Cross section of a plastic-molded integrated circuit package.

Electronic circuits must be protected from the harsh environment of the human body. The packaging of implantable electronics uses various materials, including polymers, metals, and ceramics. The encapsulation method depends somewhat on the electronic circuit technology. Older devices may still use discrete components in a classical form, such as leaded transistors and resistors. The newer designs, depending on the sophistication of the implanted device, may employ application-specific integrated circuits (ASICs) and thick film hybrid circuitry for their implementation. Such circuits place considerable requirements for hermeticity and protection on the implanted circuit packaging. 

FIGURE 27.5 The steps in the production of an integrated-circuit package. 

Computer Architecture Epitaxial technology FOR Integrated Circuit Manufacturing Field-Effect Transistors Image Processing Integrated Circuit Packaging Liquid Crystals Optical Rber Communications... 

Uner, J., Theriault, M., Carsac, C., and Sindzingre, T., The Application of Atmosphere Pressure Plasma to Various Steps in Integrated Circuit Packaging, Proc. 3 Annual Semiconductor Packaging Symp., SEMICON West (2000)... 

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