Application-specific integrated circuits

Most microhotplate-based chemical sensors have been realized as multi-chip solutions with separate transducer and electronics chips. One example includes a gas sensor based on a thin metal film [16]. Another example is a hybrid sensor system comprising a tin-oxide-coated microhotplate, an alcohol sensor, a humidity sensor and a corresponding ASIC chip (Application Specific Integrated Circuit) [17]. More recent developments include an interface-circuit chip for metal oxide gas sensors and the conccept for an on-chip driving circuitry architecture of a gas sensor array [18,19]. 

The BBIC is an optical application-specific integrated circuit (OASIC) transducer that couples directly to bioreporter matrices to provide a complete, standalone detection system (Fig. In a single, small footprint, low power package, the BBIC provides for the detection of the bioreporter optical signal, the distinguishing... 

Fig. 6.2.14 Digital signal processing application-specific integrated circuit...

Because the 02 signal is derived from the interaction of pumping and Nernst cells, this sensor requires a special electronic controller circuit. This ASIC (application-specific integrated circuit) includes the basic pumping current control, internal resistance measurement, and extended hardware diagnostics for the sensor. 

Availability of multi-amplifier Application Specific Integrated Circuits (ASICs) with low powers of -1 mW per channel. 

Electronic circuits must be protected from the harsh environment of the human body. The packaging of implantable electronics uses various materials, including polymers, metals, and ceramics. The encapsulation method depends somewhat on the electronic circuit technology. Older devices may still use discrete components in a classical form, such as leaded transistors and resistors. The newer designs, depending on the sophistication of the implanted device, may employ application-specific integrated circuits (ASICs) and thick film hybrid circuitry for their implementation. Such circuits place considerable requirements for hermeticity and protection on the implanted circuit packaging. 

Abbreviations OE, optoelectronic DRAM, dynamic random access memory I/O, input/output ATM, asynchronous transfer mode VLSI, v y large scale integration ASIC, application-specific integrated circuit. [From Pinkston, T. M., and Kuznia, C. (1997). Smart-Pixel-Based Netwa-k Interface Chip, App/. Optics 36(20), 4871-4880.]... 

Level 5 (genius) pixels (thousands of transistors) have complexities, in general, above a thousand active devices, a level of complexity sufficient for implementing application-specific integrated circuits (ASICs) and microprocessors. But this functionality level has problems not faced by the lower levels. First, for free-space optical interconnection, optical I/Os should be arranged in a structured two-dimensional pattern in order to effectively use the two-dimensional nature of imaging optics. On the other hand, computer-aided design (CAD) tools for elec-... 

Chip stacks. A recent approach to increasing component densities is to connect the die or chip devices vertically as a chip stack instead of assembling them horizontally on a substrate. The silicon chips are first thinned to several mils (2-4 mils), then bonded together. Where the chips are of different sizes, such as an application-specific integrated-circuit (ASIC)... 

CEHW [such as Field-Programmable Gate Arrays (FPGAs), Application Specific Integrated Circuits (ASICs), and other custom micro-coded devices] are often just as complex as S/W-controlled microprocessor-based systems (CAST-27 paragraph 2a). 

Airborne Electronic Hardware Electronic airborne hardware includes fine replaceable units, circuit board assemblies, application-specific integrated circuits, programmable logic devices, etc. [RTCA/DO-254]. 

Very large-scale integration application-specific integrated circuits. 

ASIC ASIC Application-specific integrated circuit... 

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