Packaging electronic circuits

MetalFoilforPrinted WiringApplications, IPC-MF-150, Institute for Interconnecting and Packaging Electronic Circuits, Liucolnwood, IU., 1991. 

The ability of a solder mask to protect conductors from physical and chemical deterioration and to insulate adjacent circuitry is a major consideration of PCB manufacturers. The Institute for Interconnecting and Packaging Electronic Circuits (IPC) has defined the requirements for the qualification and performance of solder masks in the Standard Specification IPC-SM-840 (A). The specification defines classes (1, 2, and 3) to reflect progressive increases in sophistication, functional performance, and testing methods. These classes try to provide PCB manufacturers with assurances of reliability. For example, Class 1 requirements provide the reliability needed by commercial boards used in radios, televisions, and small appliances. Class 2 is for computers and Class 3 for military and life-dependent products. 

Institute for Interconnecting tmd Packaging Electronic Circuits (IPC), 423, 445 Institute of Industrial Engineers, 2446, 2461, 2466... 

Guidelines for Multichip Module Technology Utilization, IPC-MC-790. Lincolnwood, IL Institute of Interconnecting and Packaging Electronic Circuits Aug. 1992. 

Ionizing Radiation (Total Dose) Test Procedure, MIL-STD-883F, Method 1019.6 Mar. 2003. Test Methods Manual, IPC-TM-650, Institute for Intercormecting and Packaging Electronic Circuits. 

International Society for Hybrid Microelectronics (also known as the Microelectronics Society) (ISHM), Reston, VA 800-535-4746, 703-758-1060, http //www.ishm.ee.vt.edu. This technical society was founded in 1967 and covers various microelectronic issues such as MCMs and advanced packaging. The Institute for Interconnecting and Packaging Electronic Circuits (IPC). This organization issues standards on packaging and printed circuitry. 

Guidelines for Electrically Conductive Surface Mount Adhesives, Institute for Intercoimecting and Packaging Electronic Circuits, IPC 3406 (Jul. 1996)... 

To have the proper perspective on where PWBs fit into electronic systems, it will be helpful to describe briefly the packaging hierarchy of electronic systems. Some time ago, the Institute for Interconnecting and Packaging Electronic Circuits (IPC) proposed eight categories of... 

The range of choices for packaging electronic circuits is quite broad. Some of the parameters that influence the choices are weight, size, cost, speed, ease of manufacture, repairability, and function of the circuit. The more common types are listed as follows with a brief description of their characteristics. 

IPC-2581, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology IPC-258x and sectional requirements thereof, Institute for Interconnecting and Packaging Electronic Circuits, 3000 Lakeside Drive, Bannockburn, IL, USA. 

Many standards cover printed circuit board assemblies. Most major electronics manufacturers have their own internally developed workmanship standards. Several industry and military standards also exist. However, the joint industry standard IPC-A-610D, Acceptability of Electronic Assemblies, is the standard most often referenced for criteria defining reliable solder connections. This standard was developed by the Institute for Interconnecting and Packaging Electronic Circuits (IPC) (www.ipc.org). 

IPC-TR-579, Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards, Institute of Interconnecting and Packaging Electronic Circuits, Lincoln-wood, 111. The IPC recently initiated a second round robin study, the results of which should be available in about 1996. 

INTERNAL LAYER A conductive pattern contained entirely within a mnltUayer board. IPC Institute for Interconnecting and Packaging Electronic Circuits. A leading printed wiring industry association that develops and distribntes standards as well as other information of value to printed wiring designers, users, suppliers, and fabricators. IR Infrared heating for solder-reflow operation. 

Institute for Interconnecting and Packaging Electronic Circuits International... 

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