Flexible circuit manufacturing Packaging

Furthermore, ultra high-density flexible circuits have been considered recently as the necessary substrate materials for the next generation electronics packaging. Their circuit densities will be under 20 micron pitches with 20 micron diameter via holes. They need completely new manufacturing technologies, such as an additive process instead of traditional subtractive process. Ultra high-density flexible circuits will be considered separately. [Pg.1504]

Electrical insulation, wires and cables, flexible printed circuits, ultrapure components for semiconductor manufacture, condensers, batteries, barrier films for packaging of sensitive electronic parts, films for photovoltaic modules... [Pg.57]

Z. Lai and J. Liu, Anisotropically Conductive Adhesive Rip-Chip Bonding on Rigid and Flexible Printed Circuit Substrates, IEEE Transactions on Components Packaging and Manufacturing Technology, Part B, Vol 19, 1996, p 644-660... [Pg.275]