Integrated circuit package

LCD driver CSR (Courtesy of Iwaki Electronics Co. DuPont Application Note Reference H-67770.) 

High-frequency mixer package. (Courtesy of Merrimac Industries Inc.) 

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Ceramics. Calcined aluminas are used in both electronic and stmctural ceramics (see Advanced ceramics). Electronic appHcations are dominant in the United States and Japan whereas mechanical appHcations are predominant in Europe (1). Specialty electronic integrated circuit packages generally use the low soda and thermally reactive aluminas. 

The 10 volumes in the Series on characterization of particular materials classes include volumes on silicon processir, metals and alloys, catalytic materials, integrated circuit packaging, etc. Characterization is approached from the materials user s point of view. Thus, in general, the format is based on properties, processing steps, materials classification, etc., rather than on a technique. The emphasis of all volumes is on surfaces, interfaces, and thin films, but the emphasis varies depending on the relative importance of these areas for the materials class concerned. Appendixes in each volume reproduce the relevant one-page summaries from the Encyclopedia and provide longer summaries for any techniques referred to that are not covered in the Encyclopedia. 

Integrated circuit packaging (hard disk drive HDD) trays... 

Additive processes ion implantation, 361 metal layer deposition, 361 resist requirement, 361 vapor dopant diffusion, 361 Additives for F scavenging, 415 Advanced very-large-scale integrated-circuit package, 490, 492 Aluminum... 

Senturia, S. D. Huberman, M. G. Van der Eloot, R. Proc. ARPA/fBS Workshop on Moisture Measurement in Integrated Circuit Packages, (1978) MIS Special Publication 400-69, p. 108. 

Alumina ceramics are widely used for thick-film circuit substrates and for integrated circuit packaging. This aspect is discussed in Section 5.5.5. 

Silicone Gels and Coatings for Integrated-Circuit Packaging... 

Solid state lasers have become ubiquitous in our society. Pulsed YAG Nd lasers are used for welding of metals and plastics. Among the applications are medical apparatus catheters where the weld size must be very small fiber optics communication systems and hermetic sealing of integrated circuit packages. 

Uner J, Theriault M, Carsac C, Sindzingre T. The Application of atmosphere pressure plasma to various steps in integrated circuit packaging, Proc. 3rd Annual Semiconductor Packaging Symp SEMICON West 2000. 

Figure 2 Cross section of a plastic-molded integrated circuit package.

FIGURE 27.5 The steps in the production of an integrated-circuit package. 

Computer Architecture Epitaxial technology FOR Integrated Circuit Manufacturing Field-Effect Transistors Image Processing Integrated Circuit Packaging Liquid Crystals Optical Rber Communications... 

Uner, J., Theriault, M., Carsac, C., and Sindzingre, T., The Application of Atmosphere Pressure Plasma to Various Steps in Integrated Circuit Packaging, Proc. 3 Annual Semiconductor Packaging Symp., SEMICON West (2000)... 

Two different MMC families have been studied for integrated circuit packaging, namely SiC/AI and UHM carbon fiber/Cu composites. PI 20 UHM carbon fibers are unsurpassed in terms of thermal conductivity. They have a 50% higher thermal conductivity than copper and a negative CTE), but they are expensive, whereas poorer performers are inexpensive [51-52]. 

Diffractive Optical Components Integrated Circuit Packaging Multiplexing Optical Fiber Communications... 

Ceramic quad flatpack (CQFP), an aluminum ceramic integrated circuit package with four sets of leads extending from the sides and parallel to the base of the IC. 

Buller and Kilburn (1981) performed experiments determining the heat transfer coefficients for laminar flow forced air cooling for integrated circuit packages mounted on printed wiring boards (thus for conditions differing from that of a flat plate), and correlated he with the air speed through use of the Colburn J factor, a dimensionless number, in the form of... 

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