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Integrated-circuit packaging surface-mounted packages

Abbot, D., et al. Palladium as a Lead Finish for Surface Mount Integrated Circuit Packages. IEEE Trans. Components, Hybrids, Manuf. Technol. Sept. 1991, 14 (3), 567. [Pg.463]

Caution Integrated circuits in through-hole packages are becoming difficult to find as they are displaced by surface-mount equivalents and should be avoided in new designs unless a secure supply of components is available for the production life of the design. [Pg.293]

Figure 30 Main applications of adhesives in electronic and semiconductor industries (a) polyimide interlayer dielectric films in the fabrication of integrated circuits (b) die attachment in plastic packages (c) die attachment in ceramic packages (d) multichip module with flip chip and surface-mounted devices (e) flexible circuitry (f) tape automated bonding (g) liquid crystal display panels. Figure 30 Main applications of adhesives in electronic and semiconductor industries (a) polyimide interlayer dielectric films in the fabrication of integrated circuits (b) die attachment in plastic packages (c) die attachment in ceramic packages (d) multichip module with flip chip and surface-mounted devices (e) flexible circuitry (f) tape automated bonding (g) liquid crystal display panels.
See other pages where Integrated-circuit packaging surface-mounted packages is mentioned: [Pg.1003]    [Pg.243]    [Pg.433]    [Pg.335]    [Pg.57]    [Pg.1259]    [Pg.1260]    [Pg.1339]    [Pg.53]    [Pg.1013]    [Pg.1014]    [Pg.1617]    [Pg.38]    [Pg.161]    [Pg.413]    [Pg.13]    [Pg.170]    [Pg.19]    [Pg.8]    [Pg.9]   
See also in sourсe #XX -- [ Pg.445 ]



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