Semiconductor packages

J. Hirota and co-workers, "The Development of Copper Wire Bonding for Plastic Molded Semiconductor Packages," 35th Electronic Component Conference Proceedings,S3J2Lshm.g. on,E).Q. 1985, pp. 116—121. 

Corrosion. Copper and selected copper aHoys perform admirably in many hostile environments. Copper aHoys with the appropriate corrosion resistance characteristics are recommended for atmospheric exposure (architectural and builder s hardware), for use in fresh water supply (plumbing lines and fittings), in marine appHcations (desalination equipment and biofouling avoidance), for industrial and chemical plant equipment (heat exchangers and condensers), and for electrical/electronic appHcations (coimectors and semiconductor package lead-frames) (30) (see Packaging). 

Nitto Denko Corporation primarily manufactures industrial adhesive tapes for the electronics, automotive, health care, packaging and construction industries. The company produces industrial, electronic and functional products. Industrial products include double-coated adhesive tapes, masking tapes surface protective materials, sealing materials and label printing systems. Electronics products include LCD-related items general and advanced device resins printed circuit boards and semiconductor package adhesive sheets. Functional products include medical items such as transdermal therapeutic patches polymer separation membranes used for water purification and treatment and plastic engineering products such as information equipment and porous film materials used in cars, electronics, and home appliances. Nitto Denko America, Inc., an optoelectronics subsidiary, manufactures semiconductor... 

Polvimide-Metal Interfaces. Several technological applications including semiconductor packaging and metallization demand a reliable and durable adhesion properties of the metal films. In the development of multilayer devices consist of alternating layers of metal and polyimides several reliable techniques are needed to study both thin films and their interfaces. The usefulness of the nuclear scattering techniques to study the metallization and the associated interfacial elemental diffusion processes under the effects of various temperature and humidity treatments on the metal-polyimide systems, such as Al, Cu, N, and Au on Du Pont Kapton type H have already been reported (21., 22.). Only a couple of examples are presented here to illustrate the ERD application. 

Ceramic and plastic semiconductor packaging material None NAA with fission track counting 0.02 ppb No data Riley 1982... 

Riley JE, Jr. 1982. Ultrahigh sensitivity uranium analyses using fission track counting Further analyses of semiconductor packaging materials. J Radioanalytical Chem 72(l-2) 89-99. 

Single Inline Package (SIP) A type of semiconductor package where the package has a single row of connector pins on one side only. 

Semiconductor Packaging Cu Metallization and Flip-Chip Technology... 

In 1962, polymer encapsulated transistors were produced and directed primarily at the consumer market. The major advantage of polymers was the economics of production where many parts could be packaged simultaneously with a relatively low cost material. Polymer packages were used on semiconductor devices when the cost of semiconductor packages became significant... 

Flip chip and CSP underfills, die-attach adhesives for advanced electronics and semiconductor packaging... 

Uner J, Theriault M, Carsac C, Sindzingre T. The Application of atmosphere pressure plasma to various steps in integrated circuit packaging, Proc. 3rd Annual Semiconductor Packaging Symp SEMICON West 2000. 

Thermal Analysis Applications in the Semiconductor Packaging Industry, www. perkinelmer.com. 

This application of good science to improve our understanding of the material has given us a commercial product which meets the customer s requirements and can now replace alumina and beryllia in semiconductor packages. 

Microline High-volume, low-pressure in-line spray cleaning system for semiconductor packages and bumped wafers Water soluble, saponified, compatible with aqueous detergents and deionized water Compatible with most combustible semi-aqueous solvents, EC7-R typical N/A... 

XyFlexPro / Speedline Technologies (7100) 13 X 10 (7200) 19 X 22 1.0 Single-head dispenser/ 30,000-120,000 (application dependent) Semiconductor packaging or surface mount SMD adhesive Amic[Pg.234]

Uner, J., Theriault, M., Carsac, C., and Sindzingre, T., The Application of Atmosphere Pressure Plasma to Various Steps in Integrated Circuit Packaging, Proc. 3 Annual Semiconductor Packaging Symp., SEMICON West (2000)... 

Licari, J. J., Selection and Control of Plastics for Semiconductor Packaging, Information Microelectronics, Navy Equipment pNotes 25, U.S. Naval Ammunition Depot, Crane, IN (Aug. 1968)... 

Because of its high thermal conductivity, high mechanical strength, good insulation characteristics, moderate dielectric properties and high chemical durability, alumina (HTCC high-temperature co-fired ceramics) is the most popular ceramics material for semiconductor packages. 

MEPTEC (Microelectronics Packaging and Test Engineering Council) is a trade association of semiconductor suppliers and manufacturers, committed to enhancing the competitiveness of the back-end portion of the semiconductor business. This organization provides a forum for semiconductor packaging and test professionals to learn and exchange ideas that relate to assembly, test, and handling. It was founded over 25 years ago. 

Packaging, Proc. Annual Semiconductor Packaging Symp., SEMICON... 

Prior to 1980, the semiconductor package predominately nsed was the dnal inline package (DIP). The package is rectangular in shape with leads on a 0.100-in pitch along the long sides of the package. 

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