Resin substrate

Donoi—acceptoi chromogens in solution are often strongly affected by the nature of the solvent or the resinous substrate in which they are dissolved. The more polar the solvent or resin, the longer the wavelength of the fluorescent light emitted. Progressing from less polar to more polar solvents, the bathochromic, or reddening, effect of the solvents on the dye increases in the order of aUphatics < aromatics < esters < alcohols < amides. 

Printed circuit boards manufacture is aided by the use of KMnO. Alkaline permanganate solution is used to remove resin smeared on the interior hole wall of multilayered printed circuit boards. Additionally the hole wall is etched, resulting in a surface with excellent adhesion characteristics, for electrodeless copper (250). The alkaline permanganate etchback system containing >60 g/L KMnO and 40-80 g/L NaOH at 70—80°C, is effective for difunctional, tetrafiinctional, and polyimide resin substrates, where the level of etchback is direcdy proportional to the immersion time (10—20 min) (251). 

Alkaline solutions consisting of approximately 160 g/L NaAlnO and 60 g/L NaOH at 75°C and contact times in the range of 15 minutes, exhibit high etch rates for printed circuit boards (252,253). The resulting manganese residues can readily be removed by acid neutrali2ation. Addition of K", Rb", and Cs" as co-ions to an alkaline NaAlnO solution maintains etch rates of resin substrates comparable to solutions of higher NaAlnO concentrations (254). 

In an alternative process, frozen cells of S. paucimobilis SC 16113 were used with resin adsorbed (XAD-16 resin) substrate at 5- and 10-g/liter substrate concentrations. In this process, an average reaction yield of 85% and an e.e. of >99% were obtained for product (7). At the end of the biotransformation, the reaction mixture was filtered on a 100-mesh (150-m) stainless steel screen, and the resin retained by the screen was washed with 2 liters of water. The product was then desorbed from the resin and crystallized in an overall 75 M% yield with 91% homogeneity and 99.8% e.e. 

The resin substrate studied most often in anion chromatography is XAD-1. The substrate has the lowest surface area (100 m /g) and the largest average pore diameter (205 A) of the XAD series. The physical stability is excellent. XAD-1 can be converted to an anion exchanger very easily by chloromethylation, followed by amination with a tertiary amine. 

Figure 7. Relationship between volume fraction of resin (Vf) to CTE in PBZT/resin substrate.

Figure 4.30 shows a stmcture of decorative floor covering which contains two PVC layers whose formulations are given in the above table. The cross-sectional view illustrates stmcture of material, in which a polyvinyl chloride resin substrate layer (10) is disposed on a decorative floor covering, and a surface layer... 

In-mold decoration. With the broadening use of polycarbonate-based resins in consumer items such as mobile phone handsets and external automotive panels, the need for rapid, paint-free part decoration is beginning to be met via in-mold decorating solutions. In tbis process, a decorative film is placed in the cavity side of an injection-molding tool, the tool closes, and a resin substrate is injected behind the film for rigidity. Due to the broad performance capabilities represented by the various copolymers and blends of polycarbonate, the choices of film and substrate can meet a variety of unique product requirements while still providing the adhesion needed between the two materials. Typically, choices for the decorative film are driven by color, texture, and weatherabihty requirements, while the substrate resin is chosen primarily for processability in order to adequately fill the part without damaging the film. 

Figure 12-11. The interior of GE Plastics Living Environments Concept House features a GE Gecet TP resin substrate as part of a distribution floor developed by Infill Systems B.V. of the Netherlands, through which wiring and piping can be routed.

A schematic of the sample assembly is shown in the inset in Figure 7.4a. The resin is sandwiched between two microscope cover slips. The thickness of the film is determined by the thickness of the spacer. If microfabrication starts at the resin/substrate interface furthest from the laser entrance, it is necessary to use a spacer thin enough to account for the limitation of the working distance of the objective lens. 

Figure 10-6 (a) is a cross sectional photograph of the BaTi03 composition of AD film formed on a resin substrate. A dense structure packed with ceramic particles of several dozen nm can be observed. The dielectric characteristics ( 100 kHz) that can currently be obtained are dielectric constant 400, tan 8 2% or so (dielectric constant of bulk BaTiO. around 3,000). Figure 10-6 (b) is the microstructure of the microwave dielectric structure of Ba(Zni/3Ta2/3)03-Al203 AD film. This exhibits a microstructure of alumina particles distributed uniformly in a BZT matrix. The Q value (1/tan 8) of the film is 500 (Q value of bulk Ba(Zni/3Ta2/3)03 around 5,000). 

Resin substrate for poly- Japan 32,988 1973 Mitsubishi Chemical... 

Other products in the Versollan line include OM 1262 and OM 1255. These products are ideal for long, thin, complex mold geometries. They were formulated specifically for overmolding onto various engineering resin substrates and are characterized by a tactile, rubbery feel, dull, matte finish, exceptional oil resistance, excellent adhesion to PC, ABS, and PC/ABS blends, very good abrasion resistance, improved flexibility (low flexural modulus), fast set-up rates during processing, i.e., reduced cycle times, and spiral flow similar to styrenic TPE. 

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