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Resin polyimide

Miscellaneous Applications. Ben2otrifluoride derivatives have been incorporated into polymers for different appHcations. 2,4-Dichloroben2otrifluoride or 2,3,5,6-tetrafluoroben2otrifluoride [651-80-9] have been condensed with bisphenol A [80-05-7] to give ben2otrifluoride aryl ether semipermeable gas membranes (336,337). 3,5-Diaminoben2otrifluoride [368-53-6] and aromatic dianhydrides form polyimide resins for high temperature composites (qv) and adhesives (qv), as well as in the electronics industry (338,339). [Pg.333]

Printed circuit boards manufacture is aided by the use of KMnO. Alkaline permanganate solution is used to remove resin smeared on the interior hole wall of multilayered printed circuit boards. Additionally the hole wall is etched, resulting in a surface with excellent adhesion characteristics, for electrodeless copper (250). The alkaline permanganate etchback system containing >60 g/L KMnO and 40-80 g/L NaOH at 70—80°C, is effective for difunctional, tetrafiinctional, and polyimide resin substrates, where the level of etchback is direcdy proportional to the immersion time (10—20 min) (251). [Pg.528]

Uses. Pyromellitic dianhydride imparts heat stabUity in applications where it is used. Its relatively high price limits its use to these applications. The principal commercial use is as a raw material for polyimide resins (see POLYIMIDES). These polypyromellitimides are condensation polymers of the dianhydride and aromatic diamines such as 4, -oxydianifine ... [Pg.500]

Semicommercial production of 3,3/4,4 -biphenyltetracarboxyhc dianhydride [2420-87-3] in the United States has been announced by Occidental Chemical Corp. (74). This polyimide resin intermediate is prepared by dehalogenative dimerization of 4-chlorophthalate salts (75) or by oxidative coupling of phthalate esters (76). [Pg.119]

The polyimide shown is a tme thermosetting resin, but the general reaction procedure, coupling the dianhydride with the diamine, is extremely important throughout polyimide chemistry. The intermediate polyamic acid polymers form the basis for many of the polyimide resins used in advanced composites. [Pg.39]

D. A. Scola, "Polyimide Resins," in Engineered Materials Handbook, Vol. 1, Composites, ASM International, Metals Park, Ohio, 1987, p. 78. [Pg.42]

Lubricity of crystalline polymers is usually higher than that of amorphous polymers. Excellent machinery parts are made from crystalline nylon-6,6 resins, eg, gears, cams, wedges, and other components not requiring lubrication. Gears made of amorphous polyimide resin, on the other hand, do not exhibit this feature. [Pg.261]

Other Polyimide Resins. The polyimide category, which includes both the polyetherimide and the polyamide resins discussed eadier, can be broken down into three subdivisions. [Pg.276]

Laminates produced by impregnation of glass and carbon fibre with polyimide resins followed by subsequent pressing have found important uses in the aircraft industry, particularly in connection with supersonic airliners. Such laminates can be used continuously at temperatures up to 250°C and intermittently to 400°C. [Pg.518]

Methods of preparation of the laminates depend on the partieular grade of polyimide resin used but in one process the polyimide precursor is dissolved in acetone and this solution is used to impregnate the glass or carbon fibre and thus produce a pre-preg . The pre-preg is dried and then pre-cured at about 200°C for about 3 hours. This operation reduces the volatile content and also modifies the flow properties to make them more suitable for the subsequent... [Pg.519]

Polyimide resins Poly(phenylene oxide) lonomers Polysulfone... [Pg.743]

Experiments like those described above have been performed to evaluate sodium ion barrier properties of Hitachi PIQ and DuPont PI 2540 polyimide films. Also included in the comparison were silicon nitride coatings plasma deposited in both tensile and compressive stress modes. The structure of the samples is illustrated in Figure 9. N-type, (111) oriented silicon substrates were cleaned and oxidized in dry oxygen ambient at 1100°C to form a 1060 A Si02 film. Wafers intended for polyimide characterization were coated with an organic silane film (gamma glycidal amino propyl trimethoxysilane) to promote adhesion of the polyimide to the oxide surface. The polyimide resins were spun onto the wafers at speeds to produce final... [Pg.161]

It appears that both the Hitachi and DuPont polyimide films, when cured, significantly impede the drift of sodium ions at normal device operating temperatures. There is, however, evidence that underlying device oxides can be contaminated by sodium and/or moisture or other polar molecules during the application and curing of the polyimide films. Qeaner resins and adequate device stabilization may control this problem. Further work will be required to characterize contamination levels associated with specific aspects of the processing, such as the adhesion promoter and the polyimide resins themselves. [Pg.170]

A modified BMI-epoxy resin system has been introduced by Shell Chemical Company. The system is a highly reactive blend of a bismaleimide, COM-PIMIDE 1206 (55-60% by weight solution of BMI in DMF), and EPON Resin 1151, a polyfunctional epoxy resin (60). In contrast to many polyimide resins on the market, no free MDA is present in the product. This is an important feature, since MDA has been identified as an animal carcinogen and possibly a human carcinogen. This resin system has been fully evaluated for use in multilayer PCB boards (61). 2-Methylimidazole is recommended as a catalyst. However, if required, the processing window can be widened by using 2-phenylimidazole... [Pg.187]

Lindenmeyer PH, Sheppard CH (1984) Characterization of PMR Polyimide Resin and Prepreg NASA Report N84-20695... [Pg.219]

Fig. 37. Difference spectrum (a-b) obtained by subtraction of the uncured polyimide resin spectrum (with lines artifically broadened), b) from that of the cnred polyimide polymer (a). Small deviations in the difference spectrum should be ignored since line broadening across the cured polymer may not be uniform (reprinted from Ref.2141 with permission)... Fig. 37. Difference spectrum (a-b) obtained by subtraction of the uncured polyimide resin spectrum (with lines artifically broadened), b) from that of the cnred polyimide polymer (a). Small deviations in the difference spectrum should be ignored since line broadening across the cured polymer may not be uniform (reprinted from Ref.2141 with permission)...
USA grade syntactic foam from polyimide resin... [Pg.65]

From these results, it may be concluded that the aliphatic polyimides, especially the pyromellitic acid-based polyimides P-XPM with Tm values around 300 °C, are promising candidates as moldable high-temperature polyimide resins useful for industrial applications. [Pg.16]

Their chemistry is often complex with a general formula for polyimide resins represented by... [Pg.28]

BPA/DC was compounded with high-temperature resistant ladder and semi-ladder polymers. A composition, which contained BPA/DC, a polyimide resin, organic Zn salt and benzyldimethylamine in A -methylpyrrolidone solution was described. The binder was destined for the manufacture of copper clad laminates. Tg of the cross-linked material was 265 °C [50]. Another example is a binder obtained from BPA/DC and polyphenylquinoxaline in chloroform [51]. [Pg.48]

An electroinsulating coating was obtained by mixing a polyimide resin with BPA/ DC or BPA/DC-BMI prepolymer. The low-molecular-weight polyimide resin contained reactive end groups (—C = CH, COOH, —NH2 etc.) [140]. [Pg.57]

We report herein LPD titania films deposited on three kinds of polyimides two high-temperature polyimide resins (PMR-15 and Kapton ) and a bismaleimide glass fiber composite (BMI). We have examined different solution conditions and different surface priming strategies. We have also learned to minimize film cracking by carefully controlling the drying process. [Pg.61]

Adhesive Polyimide Resin, Film and Paste, High Temperature Resistant, 315°C or 600°F... [Pg.522]


See other pages where Resin polyimide is mentioned: [Pg.984]    [Pg.30]    [Pg.39]    [Pg.585]    [Pg.598]    [Pg.29]    [Pg.139]    [Pg.153]    [Pg.71]    [Pg.58]    [Pg.74]    [Pg.401]    [Pg.403]    [Pg.109]    [Pg.91]    [Pg.29]    [Pg.20]    [Pg.15]    [Pg.28]    [Pg.130]    [Pg.133]    [Pg.45]    [Pg.36]   
See also in sourсe #XX -- [ Pg.561 ]




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Application of Polyimide Resins

Monomer reactants - polyimide resin

Polyimidate resins

Polyimide Laminating resin

Polyimide matrix resins, synthesis

Polyimide resins Kerimid

Polyimide resins Vespel

Silicone polyimide resin

Thermoset polyimide resins

Thermosetting resins polyimide

Toughening of polyimide, bismaleimide and cyanate ester resins

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