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Printed circuit boards issues with

Flame retardants in printed circuit boards partnership. Circuit boards are commonly used in electronics in consumer and industrial products, including computers and cell phones. In order to ensure fire safety, manufacturers commonly produce circuit boards with flame-retardant chemicals. While serving an important performance function, some flame-retardant chemicals can be harmful if released into the environment. To better understand the issues and the full range of options for flame-retarding circuit boards, DfE is engaging with the electronics industry and other stakeholders in a partnership. [Pg.301]

The large number of patents issued in recent years testifies to the current interest in high-temperature polymers for various applications in the electronics industry. Printed circuit boards for engine control panels on the Mirage 2000 aircraft withstand service temperatures of 260°C. To achieve this the boards are prepared from multilayer woven glass laminates impregnated with a polyimide resin. ... [Pg.341]

In an ideal world, the transition from SnPb to Pb-free could happen overnight. However, in reality, the transition is not likely to happen instantly instead, this is expected to occur over a period of at least 6 to 12 months. During this time, SnPb and lead-free alloys are likely to coexist on the same printed circuit board assembly (PCBA), which poses potential issues with component soldering and reliabiUty. [Pg.98]

A number of assembly-related issues must be addressed with odd-form components. First, it is necessary that correct pad dimensions be designed on the circuit board. Also, the stencil must have the correct aperture size to print an adequate quantity of solder paste. The pick-and-place machine may require custom tooling in order to handle these components. Lastly, odd-form parts are typically larger and heavier. Therefore, it is possible that they wiU not readily self-align while the solder is molten during the reflow process. [Pg.925]

HDI and microvias place a new bnrden on printed circuit design. The various IPC types impose significant changes in the multilayer stack-up from a conventional board. But additionally, microvias can be implemented in many different ways and with different design rules. This section presents just a few of the design issues. [Pg.479]


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See also in sourсe #XX -- [ Pg.461 , Pg.462 ]




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Circuit board

PRINTED CIRCUIT

Printed circuit boards

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