Hybrid circuits

Hyamine ld22 Hybrid bearings Hybrid circuit coating Hybrid circuits Hybrid glass Hybridoma cells Hybridomas Hycar... 

Hybrid Circuits. The use of parylenes as a hybrid circuit coating is based on much the same rationale as its use in circuit boards. A significant distinction Hes in obtaining adhesion to the ceramic substrate material, the success of which determines the eventual performance of the coated part. Adhesion to the ceramic must be achieved using adhesion promoters, such as the organosilanes. 

C. C. Shiflett, D. B. BuchhoF, and C. C. Faudskar, "High-Density Multilayer Hybrid Circuits Made with Polymer Insulating Layers (Polyhic s)," Society of Hybrid Microelectronics Proceedings, 1980, pp. 481—486. 

Numerous protective conformal coatings are also used ia the hybrid circuit iadustry. Most of the criteria that pertain to use ia ptinted wiring also apply here (4). 

The hybrid circuit in Fig. 20-26 has proven most versatile, and can increase capacity of an existing ball-mill circuit by 30 to 100 percent. Recycling the rock as in the hybrid flow sheet reduces the need for coarse-b milhng. 

To remove this unwanted heat (also known as thermal management), it is often necessary to use hybrid circuits and bulky heat-dissipation devices or complicated and expensive refrigeration. Metals with good thermal conductivity, such as copper or aluminum, are presently used as heat sink materials but, since being metals they also have high electrical conductivity, they require an electrical-insulation barrier. 

TaN resistive films for hybrid circuits deposited by planar magnetron sputtering. 

Solid-solid interfaces are a key element in many areas of materials technology. In electronics, hybrid circuits and power devices require an increasing variety of... 

A laser-induced ToF mass spectrometer (LIMA-2A) was manufactured by Cambridge Mass Spectrometry Ltd., Cambridge, UK, for micro local analysis and was used to analyze thin sections of biological samples in the transmission mode or bulk material in the reflection mode.150,151 Typical LIMA applications in microelectronics include identification of impurities in dielectrics, microlocal analysis, depth profiling, thick film analysis and investigations on hybrid circuits. 

Hybrid circuit coating -parylenes as [XYLYLENE POLYMERS] (Supplement)... 

Hybrid circuits -electronics coatings for [ELECTRONICS, COATINGS] (Vol 9)... 

Thick-Film Multilayer. Thick-film multilayer technology has been used for many years to fabricate hybrid circuits that interconnect small-scale ICs or discrete components on a ceramic or metal substrate (67-70). This technology has also been used for multichip packaging of more highly integrated ICs for large computer applications. 

Aluminum oxide sols are successfully used for application of films [1794, 1793], such as high area films for hybrid circuits [1236]. The same technique was used for the preparation of J-A1203 (NaAlnO,7) in this case alcoholic solutions of NaOR were added to aluminum alkoxide solutions [1795, 1038]. To increase the stability of sols, aluminum alkoxides are frequently modified with acetic acid [1570] or (3-diketones [1659]. Alumina sheets are commercially produced by the sintering of high-purity fine A1203 powders prepared by hydrolysis of modified Al(OPr )3 [1236]. To prepare powders with spherical species from dilute solutions, hydroxopropylcellulose was added to prevent... 

The hybrid circuit 10 comprises a buffer structure 16 which is comprised of a material which accommodates the difference in thermal expansion coefficients of the HgCdTe detector array 12 and the silicon read-out chip 14. The buffer layer is made of sapphire which also has good thermal conductivity properties. The buffer structure has laser drilled vias 18 which are formed in registration with unit cells of the detector array and the read-out circuit. Each of the vias is provided with indium bumps 20 at opposing ends thereof. The buffer structure is interposed between the detector array and the read-out chip. Cold weld indium bump technology is employed to couple the bumps 20 to the buffer structure. The buffer structure is further... 

Figure 9.12. A correlation radiometer where the chopper is replaced by a hybrid circuit. Separate amplifier chains amplify the sum and difference signals which are then multiplied.

A practical microwave radiometer that has the same sensibvity as the system shown in Figure 9.11 is the correlation radiometer shown in Figure 9.12. A hybrid circuit at the input forms the sum and difference voltages (Va+Vb) / Fl and (Va Vb)/ s/2. These are separately amplihed and then mulbplied, giving and output proportional to V — Uj which is the desired difference in the powers arriving at the two horns. 

The matching of expansion behavior is of the utmost importance to manufacturers of, for example, multi-layer capacitors, porcelain enameled cast iron sinks, fiber reinforced composites, light bulbs, etc. In all cases, various materials in rigid contact must have their expansion characteristics carefully matched. Inattention to this runs the risk of cracking and shattering of a light bulb at its seal to aluminum, delamination of metallic conductive leads from the ceramic substrate in a hybrid circuit, etc. By changing the composition of a constituent material, its... 

Polymer Insulating Layers for Multilayer Hybrid Circuits... 

Table I shows that the silver-palladium alloys do indeed perform better than the co-precipitates. Silver ions are obviously extracted more rapidly from the physical mixture of silver and palladium in the co-precipitate than from the alloy, but that this improvement is still not enough for a high level of security in critical hybrid circuits.

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