Printed circuit board industry

The preparation of flame-retardant epoxy resins is accompanied by inclusion of tetrabromobisphenol A [79-94-7] in the advancement process (see Flame retardants). Products containing ca 20 wt % Br are extensively employed in the printed circuit board industry. [Pg.367]

Cal-Tech Management Associates, SCADA Systems, Inc., and Davis, G. A., Piasecki, B., and Mueller, M. J. October 1987. Waste Reduction Strategies for the Printed Circuit Board Industry. California Department of Health Services, Alternative Technology Section, Toxic Substances Control Division. Contract No. 85-00173. [Pg.73]

USEPA. 1989. Guide to Waste Minimization in the Printed Circuit Board Industry. Prepared by Jacobs Engineering Group, Inc., Pasadena, CA for the U.S. Environmental Protection Agency (In Process). [Pg.120]

F006 Sludges are the inevitable by-products of the plating and printed circuit board industries. Hydranetallurgy can provide an envirormentally acceptable, economically feasible means of recycling these by-products. [Pg.309]

Electricallelectronic market. Glass fibers are used extensively in printed circuit boards, industrial circuit breakers, conduits for power cables, etc. [Pg.209]

The ED24574 system does not pass the emerging Tg or pressure cooker requirements. However, an experimental resin does pass these requirements. It is anticipated that this higher Tg resin will allow laminates to be made which will pass the emerging requirements of the printed circuit board industry. [Pg.81]

Toxic Waste Minimization in the Printed Circuit Board Industry... [Pg.62]

Copper Etchant Baths. One of the most promising applications of coupled transport is the renovation of circuit board etchant solutions that contain copper.61 The printed circuit board industry produces more than ten million gal-lons/year of spent etchant solutions in which copper, other salts and etchant chemicals are concentrated. Coupled transport permits continuous on-site removal of copper from the etchant solutions and simultaneous regeneration of the etchant solution. This represents a considerable savings in the costs of manufacturing circuit boards. [Pg.545]

E-glass was originally developed for the construction of electrical laminates for use in the printed circuit board industry. Hence its name E-glass. It has however adapted itself well to the needs of the composite industry and today is the most commonly used reinforcing fibre. It comes in two distinct varieties ... [Pg.287]

Boulden, J. B., 1958. Fitting the sales forecast to your firm. Business Horizons, 1(1), 65-12. Chang, R, Liu, C. and Lai, R., 2008. A fuzzy case-based reasoning model for sales forecasting in print circuit board industries. Expert Systems with Applications, 34(3),... [Pg.194]

A new application, which might have the chance to become realized more in short term is in the area where Ormecon has successfully introduced a new nanotechnology on a worldwide basis the printed circuit board industry and here, more specifically, solderable surface finishes. The product is a new all-organic solderable surface nanofinish for printed circuit boards (which can be introduced into the markets within a relatively short time). The new products allow producing a solderable surface in a one-step process. [Pg.1116]

The company MDS-Prozesstechnik (Germany) manufactures plants with closed-loops of process water. It specialises in recycling units, with focus on membrane plants. MDS is aiming at the chemical industry, printed circuit-board industry, beverage industry, textile industry and laundries.(www.mds-pro.de)... [Pg.91]

SCADA Systems Inc. Cal-Tech Management Associates Waste Reduction Strategies for the Printed Circuit Board Industry. California Department of Health Services Contract 85-00173, Sacramento, CA., 1987. [Pg.577]

Manufacturing Electronics, information, and communication Optical fibers for telecommunications and computers, printed circuit boards, industrial filters and belts... [Pg.3812]

The silane-treated woven glass cloth is dried, carefully inspected for flaws, and then supplied to laminators in the printed circuit board industry where lamination and fabrication of printed circuit boards is carried out. [Pg.564]

CircuiTree (Information for the printed circuit board industry)... [Pg.182]

Surface Laminar Circuitry (SLC) developed by IBM is one of the earliest board build-up fabrication methods. This technology provided a solution to the high occurrence of broken drill bits and mis-drilled cores commonly encountered with drilled vias with fine dimensions by using blind and buried via structures. Neither construction method requires through holes, but only vias between layers that require interconnection. There are several categories of via structures being used in the printed circuit board industry which are discussed in the following sections. [Pg.557]

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