Molded printed circuit board

Newer resins include polysulfone, polyethersulfone, polyetherimide, and polyetherketone. Some of these newer materials are high temperature thermoplastic, not thermoset, resins. They are being promoted for the design of injection-molded printed circuit boards in three-dimensional shapes for functional appHcations as an alternative to standard flat printed circuit boards. Only semiadditive or fully additive processing can be used with these devices. 

MPCP molded printed circuit board MTQ management for total quality... 

Typical processing methods bulk molding, casting, compression molding, encapsulation, injection molding, printed circuit board, pultrusion, resin transfer molding, sheet molding ... 

Pig. 2. (a) The cell mount design of the integrated PV array of Pigure 1, which uses laminated conductive and insulating layers on top of an aluminium substrate in a printed circuit board-type panel (7). The array produces 20 kW at 20°C ambient and 850 W/m direct sunlight, and measures 155 m. The lens is a molded acryUc Presnel lens parquet mounted on the front of the array stmcture. The PV panel is mounted on the back of the array stmcture and is... 

BISMALEIMIDE POLYMERS. These relatively new polymeric materials were developed to serve the increasing requirements for materials of high strength in high-temperature applications. Currently, a high percentage of the bismaleimides produced are used for printed circuit boards (PCBs). The materials usually are cured with aromatic amines and then compression molded into the PCBs. Future uses include aircraft structural components where bismaleimides may prove superior for high-temperature skin surface applications as compared with present epoxy composites. 

The manufacture of a three-dimensional circuit device from a molded plastic such as the demonstration part shown in Figure 1 differs from the traditional printed circuit board. Different imaging techniques are required due to the three-dimensional features of the devices. In addition, the metal comprising the traces on the surface of the substrate are now deposited rather than formed from the laminated copper foil. 

The single largest use for the phenol-formaldehyde resins is in adhesive applications for the production of plywood, chipboard, and particle board. The resin can comprise as much as one-third of the weight of the board, particularly of particle boards, which contributes to a total demand for phenolics in the U.S.A. of over half a million metric tonnes per year. They are also used as the matrix adhesives for the production of several types of grindstones. In combination with paper, woven cotton, glass fiber, etc., components, phenolics contribute to the production of engineering and decorative laminates in the form of rods, tubes, and sheets. The sheet products Arborite and Formica are familiar as the finished surfaces of furniture, bathroom, and kitchen counter tops and other areas where attractive patterns and water resistance are important characteristics. Molded products from phenolics are also important where heat or electrical resistance is required, such as saucepan and toaster handles, switches, and the printed circuit boards used in computers. Recent phenolics production in the U.S.A. has totaled over 500,000 metric tonnes per year, not including fillers [38]. 

When molded or premolded packages cannot be used for whatever reason, for example, a need for hermetic sealing, modules using ceramic substrates (or PCB-printed circuit board) offer almost unlimited flexibility. They can be used for simple multichip modules containing two or more elements (e.g., a sensing element and an evaluation circuit), may include external components, or may be used to construct complete systems. Stress-optimized package configurations for sensitive microsystems and sensors are no problem (Fig. 5.8.4). 

AI3-50034 EINECS 211-581-7 Imidazole, 2-phenyl- IH-lmidazole, 2-phenyl- NSC 255226 Phenylimidazole 2-Phenylimidazole 2-Phenyl-IH-imidazole. Epoxy curing agent for printed circuit boards, molding compounds, potting accelerator for dicyandiamide and anhydrides. Leaflets mp = 1469.3° bp = 340° insoluble in H2O, very soluble in EtOH. BASF Cap. Janssen Chimica Lancaster Synthesis Co. 

DSC and DTA have been widely used to study a wide variety of polymer substances. Among them are rubber (212) molding resins (213) printed circuit boards (214,215) fiber systems (216) polymer films (217) engineering thermoplastics (218) and others. 

The use of thermoplastics and their selective metal plating opens a new dimension in circuit carrier design to the electronics industry 3D molded interconnect devices (3D MIDs). MIDs are injection-molded thermoplastic parts with integrated circuit traces. They provide enormous technical and economic potential and offer remarkably improved ecological behavior in comparison to conventional printed circuit boards which they wiU, however, complement, not replace. 

Silicone laminates are used principally in electrical applications such as printed circuit boards, transformers, and slot wedges in electric motors, particularly class H motors. Compression-molding powders based on silicone resins are available and have been used in the molding of switch parts, brush ring holders, and other electrical applications that need to withstand high temperatures. 

A long-established application of TSs is for printed circuit boards (PCBs), and the trend towards 3-D molded PCBs also are TPs. High performance PCBs use glass fiber constructions where the others use paper, wood fibers, etc. 

MAJOR APPLICATIONS A wide variety of injection-molded automotive parts such as housings, connectors, switches, relays, thrust washers, sphne liners, valve seats, bushings, piston rings and seals, wear rings, ball bearings, rollers, thermal insulators, etc. laminated parts such as printed circuit boards, honeycomb core, radomes, etc. 

Aromatic Polyesters Engineering thermoplastics prepared by polymerization of aromatic polyol with aromatic dicarboxylic anhydride. They are tough with somewhat low chemical resistance. Processed by injection and blow-molding, extrusion, andftiermoforming. Drying is required. Used in automotive housings and trim, electrical wire j acketing, printed circuit boards, and appliance enclosures. 

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