Printed circuit boards silicone-glass

Microfluidic Boards Microfluidic board interconnection technologies seek to mimic the electronic printed circuit board for ease of use, reliability, and versatility. In microfluidic board technologies, the substrate contains the passive microfluidic channels and reservoirs, with active components (e.g., sensors, valves) mounted on top (e.g.. Ref. [2]) (see Fig. 1) similarly to electronic components mounted on a printed circuit board (PCB) or multichip modules (MCM) in surface-mount technologies (SMT). Electronic coimections between components are provided on top of the board, while fluidic interconnection is usually provided in the board material itself. Microfluidic circuit boards can be made from a variety of materials, including silicon, glass, and polymers, e.g., polydimethylsiloxane (PDMS), epoxy, or polymethyl methacrylate (PMMA). Microfluidic boards can be as simple... 

Fig. 3.2. Ferrite memory cores locked in place on silicone rubber coated glass-cloth with an elastomeric silicone adhesive. The coated glass-cloth forms the top layer of a rigid epoxy-glass printed circuit board, acting as a further buffer against relative expansion and mechanical shocks (Ampex Corp.).

Silicone PSAs find application almost exclusively in tape form. Polyester film is widely used as backing particularly for masked printed circuit boards during plating operations, for electrical insulation and paper splicing tapes. Glass cloth-backed tapes are preferred for... 

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