Printed circuit boards plastics used

Electroless copper solutions underwent similar development during the same period (10). Early printed circuit boards used mechanically attached eyelets to provide electrical conductivity between the copper sheathing laminated on two sides of a plastic board. Electroless copper plating provided a less expensive, better conductive path, allowing much greater numbers and smaller sizes of holes. Later, electroless coppers even replaced the laminated bulk copper sheathing in the semiadditive and additive processes (see Copper). 

Elastomers, plastics, fabrics, wood and metals can be joined with themselves and with each other using nitrile rubber/epoxy resin blends cured with amines and/or acidic agents. Ethylene-propylene vulcanizates can also be joined using blends of carboxylated nitrile rubber, epoxy resin and a reactive metal filler (copper, nickel, cobalt). However, one of the largest areas of use of nitrile rubber modified epoxy systems is in the printed circuit board area [12]. 

The PBDEs (decaBDE, octaBDE, and pentaBDE) and are used as flame retardants in plastics, electronic equipment, printed circuit boards, vehicles, furniture, textiles, carpets, and building materials. Global demand has increased rapidly since the 1970s with 70,000 tonnes produced in 2001. Their flame retardant activity relies on decomposition at high temperatures, leading to the release of bromine atoms. This slows the chemical reactions that drive 02-dependent fires. HBCDs are a flame retardant added to extruded and expanded polystyrene that is used as thermal insulation in buildings. 

Nitto Denko Corporation primarily manufactures industrial adhesive tapes for the electronics, automotive, health care, packaging and construction industries. The company produces industrial, electronic and functional products. Industrial products include double-coated adhesive tapes, masking tapes surface protective materials, sealing materials and label printing systems. Electronics products include LCD-related items general and advanced device resins printed circuit boards and semiconductor package adhesive sheets. Functional products include medical items such as transdermal therapeutic patches polymer separation membranes used for water purification and treatment and plastic engineering products such as information equipment and porous film materials used in cars, electronics, and home appliances. Nitto Denko America, Inc., an optoelectronics subsidiary, manufactures semiconductor... 

DIP (Dual Inline Package) A standard housing constructed of hard plastic commonly used to hold an integrated circuit. The circuit s leads are connected to two parallel rows of pins designed to fit snugly into a socket these pins may also be soldered directly to a printed-circuit board. If you try to install or remove dual inline packages, be careful not to bend or damage their pins. 

It can be used to deposit metal on nonconduc-tive surfaces, such as plastics, glass, or ceramics. Some proper pretreatment steps are needed to activate these surfaces. The metallizing of printed circuit board is one such example. 

The templates for the oxygen and hydrogen flow fields/electrodes in this book (see page 248) are intended to be printed on plastic transfer film and then transferred to copper circuit board for etching. This method is commonly used to transfer printed circuit board designs to the copper surface of the boards. We used Press-n-Peel , which is a plastic film that has an emulsion on one side and comes in sheets of 8V2"x 11" size. The plastic sheet is loaded into the printer just as any other 8 /2"x 11" paper would be. 

First-level packages provide interconnection between the printed circuit board and the chip. These packages must have the desired number of wiring layers, provide thermal expansion compatibility with the chip, provide a thermal path for heat dissipation from the chip, and keep electrical noise and transmission delay to the minimum. The two types of packages used are plastic packages and ceramic packages. 

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