Multilayer ceramic circuit board

Y. Imanaka et al., Fujitsu Ltd., Kawasaki, Japan, Process for Producing Multilayer Ceramic Circuit Board with Copper, U.S. Patent 4,679,320, Jul. 14,1987. 

Figure 1.1 (a) Multilayered ceramic circuit board for mainframe computers produced by... 

N. Kamehaia, Y. Imanaka, and K. Niwa, Multilayer Ceramic Circuit Board with Copper Conductor , Denshi Tokyo, No. 26 (1987), pp. 143-148. 

Y. ImanakaandN. Kamehara, Influence of Shrinkage Mismatch between Copper and Ceramics on Dimensional Control ofthe Multilayer Ceramic Circuit Board, J. Ceram. Soc. Jpn.,Vol. 100, No. 4, (1992), pp. 560-564. 

Y. Imanaka, A. Tanaka, and K. Yamanaka, Multilayer Ceramic Circuit Board -Wiring Material From Copper To Superconductor-, FUJITSU, Vol. 39, No. 3, June (1988), pp. 137-143. 

Figure 7-13 The conductor pattern in a multilayer ceramic circuit board for use in a mainframe computer (Ref. [8]).

K. Niwa, N. Kamehara, K. Yokouchi, and Y. Imanaka, Multilayer Ceramic Circuit Board with a Copper Conductor, Advanced Cerannic Materials, Vol. 2, No. 4, Oct. (1987) pp. 832-835. 

Figure 9-1 Three dimensional copper wiring of multilayer ceramic circuit board for mainframe computer (part of the ceramic was etched away with HF).

Y. Imanaka, K. Hashimoto, W. Yamagishi, H. Suzuki, N. Kamehara, K. Niwa, and K. Kurosawa, Reliability ofCopper Vias for Multilayer Glass/Ceramic Circuit Boards, Proc. Electric Ceramic Conference, Shonan Institute Technology (1991). 

Silver Thick Films. About half of the silver consumed in the United States for its electrical properties is used by the electronics industry. Of this amount some 40% is used for the preparation of thick-film pastes in circuit paths and capacitors. These are silk-screened onto ceramic or plastic circuit boards for multilayer circuit sandwich components. 

Exemplary developments of microsystems as pre-integration platform in smart structure technology are described in the present paragraph. There are two promising approaches seen allowing for the integration of piezoceramic units and electronic circuits, flexible circuits boards and active ceramic multilayer devices. 

H. Tsuneno, Multilayer technology of circuit board Research and Development of Ceramic Devices and Material for Electronics (CMC, Tokyo, 2(XX)), pp. 128-139. 

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