Printed-circuit-board manufacturing

Printed circuit boards manufacture is aided by the use of KMnO. Alkaline permanganate solution is used to remove resin smeared on the interior hole wall of multilayered printed circuit boards. Additionally the hole wall is etched, resulting in a surface with excellent adhesion characteristics, for electrodeless copper (250). The alkaline permanganate etchback system containing >60 g/L KMnO and 40-80 g/L NaOH at 70—80°C, is effective for difunctional, tetrafiinctional, and polyimide resin substrates, where the level of etchback is direcdy proportional to the immersion time (10—20 min) (251). 

The 40 CFR part 433 does not apply to (a) metallic platemaking and gravure cylinder preparation conducted within or for printing and publishing facilities and (b) existing indirect discharging job shops and independent printed circuit board manufacturers which are covered by 40 CFR part 413. 

U.S. PSES for All Metal Finishing Plants Except Job Shops and Independent Printed Circuit Board Manufacturers... 

The term independent printed circuit board manufacturer shall mean a facility that manufactures printed circuit boards principally for sale to other companies. 

Printed circuit board materials, 17 843 Printed circuit board manufacture,... 

Maryland Supeifund Site Natural attenuation enabled new development at 70-acre Superfund site approximately 20 miles northwest of Baltimore, Maryland. This property had been contaminated by a printed circuit board manufacturing company. According to a manager, the pump-and-treat remediation system failed to meet groundwater treatment goals, though it cost over 1 million to construct and more than 200,000 a year to operate. It was estimated that this approach could cost as much as 5 million over 10 years and would still not achieve the cleanup objectives of the Maryland Department of Environment (D17452R). 

MSA and other lower alkanesulfonic acids are useful for plating of lead, nickel, cadmium, silver, and zinc (409). MSA also finds use in plating of tin, copper, lead, and other metals. It is also used in printed circuit board manufacture. In metal finishing the metal coating can be stripped chemically or electrolytically with MSA. MSA also finds use in polymers and as a polymer solvent and as a catalyst for polymerization of monomers such as acrylonitrile. MSA also finds use in ion-exchange resin regeneration because of the high solubility of many metal salts in aqueous solutions. 

WASTE MANAGEMENT FOR PRINTED CIRCUIT BOARD MANUFACTURE... 

DHS. June 1987. Waste Audit Study Printed Circuit Board Manufacturers. California Department of Health Services, Toxic Substances Control Division, Alternative Technology Section. Prepared by Planning Research Corporation, San Jose, CA. 

Sellers, Veronica R. 19B6. "Waste Management Alternatives for Electroplating and Printed Circuit Board Manufacturing Operations." 4th Massachusetts Hazardous Waste Source Reduction Conference Proceedings. Massachusetts Department of Environmental Management, Boston, Massachusetts. 

Electronics Industry Electronics-grade nitric acid (70%) is used by semiconductor and printed circuit board manufacturers. Nitric acid cleans contaminants from the wafer s surface during several steps in semiconductor manufacture. Acetic and hydrofluoric acids may be blended with nitric acid to etch away metal. Nitric acid is also used for cleaning in the manufacture of printed circuit boards. 

A poly(ester-imide) powder is coated on an electrolytic copper foil of 35 my thickness by an electrostatic spray coating machine and baked at 200 °C for 30 min. The substrata obtained is useful for printed circuit board manufacturing [268]. 

Guidelines for Waste Reduction and Recycling Metal Finishing, Electroplating, Printed Circuit Board Manufacturing... 

Guides to Pollution Prevention The Printed Circuit Board Manufacturing Industry... 

Modifications to Reduce Drag Out at a Printed Circuit Board Manufacturer... 

Removal of Heavy Metals. Federal, state and local regulations place strict limits on the quantities of heavy metals which may be released to the environment. The controlled metals include Ag, As, Cd, Cr, Cu, Pb, Hg, Ni, Sb and Zn. U.S. electroplaters, metal finishers, and printed-circuit-board manufacturers are under mounting pressure to clean up their waste waters. 

Crosslinked cyanate ester systems typically exhibit higher glass transition temperatures (T S 250°C), lower moisture absorption and lower dielectric constants than conventional epoxy thermosets. Hence by mixing dicyanates or their corresponding prepolymers with epoxy resins, and then co-curing, the desired level of property improvements can be achieved. Such hybrid thermosets have been used in printed circuit board manufacture. 

Nickel deposits are most widely used as a base for chromium plating the thicker the deposit (typically 20 xm), the greater the corrosion resistance. Nickel plating is used in engineering where wear resistance, hardness and corrosion resistance are required, e.g. oil valves, rotors, drive shafts and in printed circuit board manufacturer. It is also used for its decorative properties, e.g. doorknobs. 

Among the newer uses of phosphoric acid are as a metal cleaner in printed circuit board manufacture, and as a metal etchant in the production of semiconductor materials. A 1% solution of hexafluorophosphoric acid, HPFg, can be used to clean aluminium, prior to anodising [23]. 

Nitrile rubber/phenolic resin produces one of the most durable and toughest elastomeric materials developed in the adhesive industry. Further, its resistance to water as to organic solvents is excellent. For these reasons, the nitrile rubber/phenolic resin laminates are used in printed circuit board manufacturing, to bond metallic substrates between themselves (aluminium, steel) and to bond rubber to magnesium. Films of nitrile rubber/phenolic blends have also been used in the aircraft industry for bonding metal-to-metal surfaces in both plain and honeycomb sandwich constructions. 

This makes the polymer very suitable for printed circuit board manufacture. However, the incorporation of 30% glass fibre into the PEEK formulation produces a pronounced improvement in tensile properties and flexural properties with some deviation in elongation properties as shown in Table 4.5. 

They are generally used to bond metals, rubbers, and plastics to themselves or to each other. A major application of vinyl phenolic adhesive is the bonding of copper sheet to plastic laminate in printed circuit board manufacture. 

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