Printed circuit board technology

The microstructure was realized by a dry-film photoresist technique and based on established techniques from printed circuit board technology [142], Dry resists are available as thin films, e.g. of thickness 50 or 100 pm. The resist films are encased in other polymer materials which are later removed. The resist films can be deposited on various base materials such as silicon or polymers giving mechanical stability. Lamination is carried out with a roller laminator. Then, exposure is made and spray development without any solvents follows. The process steps can be repeated at multi-laminated structures. Closed structures can be made in this way. 

Cramer, K., Furstenau, F., Meyer, H., Mass production of microreactors on the basis of printed circuit board technology and electrochemistry, in Proceedings of the VDE World Microtechnologies Congress, MICRO.tec 2000 (25-27 Sept. 2000),... 

Since these devices are made from two components produced by means of well-established mass production technologies (thin film and printed circuit board technology) and assembling of the parts is compatible to IC packaging techniques, cost effective mass fabrication of this device seems realistic. 

The main motivation for the realisation of micro fuel cells in printed circuit board technology is to achieve low costs by using mass production processes. These technologies make a reel-to-reel processing possible. 

Toshio Yanaki, Researcher, Shiseido Printed Circuit Board Technology Research Center... 

Schmitz, A., Wagner, S., Hahn, R., Uzun, H. and Hebling, C. (2004) Stability of plemar PEMFC in printed circuit board technology. J. Power Sources 127,197-205 Schulze, M. and Christenn, C. (2005) XPS investigation of the PTEE induced hydrophobic properties of electrodes for low temperature fuel cells. Appl. Surf. Sd. 252, 148-153 Schulze, M., Gtilzow, E. and Steinlulber, G. (2001) Activation of nickel-anodes for eilkaline fuel cells. Appl. Surf. Sd. 179, 251-256... 

Molding compounds based on epoxy or phenolic resins mixed with fillers are used for the conventional printed-circuit board technologies widely employed in electronics production. These molding compounds belong to the group of thermoset plastics. They consist of tightly crosslinked macromolecules, as reflected in their extremely hard and brittle material behavior at room temperature. 

To a very large extent, procedures from printed-circuit board technology can be applied for characterizing the electrical properties of assembled MID. An overview of the mainstream analog and digital methods of measurement is given in [25], for example. Once again, however, provision has to be made for some specifics of practical application of these methods to MID. 

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