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Resin medium-density

Medium-density fiberboard (MDF) a flat pressed wood composite panel composed of randomly oriented wood fibers obtained by thermomechanical wood pulping and bonded by hot-pre.ssing by using thermosetting adhesive resins. The panel has generally a density of approximately 850 kg/m- and the average amount of resin solids in the board core section is between 11 % and 14% on dry wood. [Pg.1045]

Adhesives based on isocyanate (especially PMDl, polymethylene diisocyanate, more exactly polymeric 4,4 -diphenylmethane diisocyanate) have been used for more than 25 years in the wood-based panel industry [88], but still have a low market value in the wood-working industry compared to systems based on UF-, MUF- or PF-resins. The main application is the production of waterproof panels, but also the production of panels from raw materials that are difficult to glue, like straw, bagasse, rice shells or sugar cane bagasse. They can be used as adhesives for wood-based products like particleboard, oriented strandboard (OSB), laminated strand lumber (LSL), medium-density fiberboard (MDF) or... [Pg.1065]

Property ASTM Test Phenolics Foamedin Syntactic Place Castable Polyvinyl Chloride Rigid Closed Cell Phenylene Oxide Foamable Resin Polycarbonate Polystyrene Medium-Density Foam Polystyrene Molded Extruded Polyurethane Rigid Closed Cell... [Pg.497]

Approximately one million metric tons of urea-formaldehyde resin are produced annually all over the world. More than 70% of this urea-formaldehyde resin is consumed by the forest products industry. The resin is used in the production of an adhesive for bonding particleboard (61% of the urea-formaldehyde used in the industry), medium-density fiberboard (27%), hardwood plywood (5%), and as a laminating adhesive (7%) for bonding furniture case goods, overlays to panels, and interior flush doors, for example. [Pg.759]

Medium color carbon blacks, 4 798t Medium density polyethylene (MDPE) resins, 77 700, 701... [Pg.559]

Foamed PP is a new alternative material for processors of PP or PS thermoformed items for packaging applications. The joint R D programme of Italproducts, Reedy International and PP resin suppliers has made it possible for everybody involved in the packaging industry to install and run an extrusion and thermoforming line capable of producing medium density EPP items. The features of the equipment required are described. ITALPRODUCTS SRL REEDY INTERNATIONAL CORP. [Pg.59]

MDF Medium-density fiberboard. A composite panel product manufactured from wood fibers and s)mthetic resin binders bonded together under heat and pressure the fibers and resin form a homogeneous board with consistent properties in each direction. [Pg.256]

Fiberboard -for food packaging [FOOD PACKAGING] (Vol 11) -medium-density [WOOD-BASED COMPOSITES AND LAMINATES] (Supplement) -phenolic adhesive [PHENOLIC RESINS] (Vol 18) -sampling standards for [SAMPLING] (Vol 21) -structural [WOOD-BASED COMPOSITES AND LAMINATES] (Supplement)... [Pg.399]

The manufacture of MDF, with a few exceptions, duplicates the manufacture methods for dry-process hardboard, described at length herein. One exception to it is that most MDF is made in the medium-density range, 640—800 kg/m3 although small amounts are made at lower or higher densities. Second, the vast majority of MDF is made with UF resin adhesives with resin requirements in the 7—11% range, and wax is usually added at the 0.50—0.75% level. A small amount of exterior-grade MDF is made with isocyanate resin. [Pg.394]

Properties of the HDA boards prepared from the activated substrate may be compared to the phenol-formaldehyde (PF) boards prepared using 6 resin solids. Comparison may also be made to the property requirements from commercial standard CS 236-66, type 2 medium density (below 0.8 g/cc), Class 1 particleboard fabricated using durable and highly moisture resistant and heat resistant binders suitable for interior and certain exterior applications. Specifications of this class of particleboard, generally prepared from PF resins, are MOR, minimum = 2,500 psi M0E, minimum =... [Pg.182]

PB PBI PBMA PBO PBT(H) PBTP PC PCHMA PCTFE PDAP PDMS PE PEHD PELD PEMD PEC PEEK PEG PEI PEK PEN PEO PES PET PF PI PIB PMA PMMA PMI PMP POB POM PP PPE PPP PPPE PPQ PPS PPSU PS PSU PTFE PTMT PU PUR Poly(n.butylene) Poly(benzimidazole) Poly(n.butyl methacrylate) Poly(benzoxazole) Poly(benzthiazole) Poly(butylene glycol terephthalate) Polycarbonate Poly(cyclohexyl methacrylate) Poly(chloro-trifluoro ethylene) Poly(diallyl phthalate) Poly(dimethyl siloxane) Polyethylene High density polyethylene Low density polyethylene Medium density polyethylene Chlorinated polyethylene Poly-ether-ether ketone poly(ethylene glycol) Poly-ether-imide Poly-ether ketone Poly(ethylene-2,6-naphthalene dicarboxylate) Poly(ethylene oxide) Poly-ether sulfone Poly(ethylene terephthalate) Phenol formaldehyde resin Polyimide Polyisobutylene Poly(methyl acrylate) Poly(methyl methacrylate) Poly(methacryl imide) Poly(methylpentene) Poly(hydroxy-benzoate) Polyoxymethylene = polyacetal = polyformaldehyde Polypropylene Poly (2,6-dimethyl-l,4-phenylene ether) = Poly(phenylene oxide) Polyp araphenylene Poly(2,6-diphenyl-l,4-phenylene ether) Poly(phenyl quinoxaline) Polyphenylene sulfide, polysulfide Polyphenylene sulfone Polystyrene Polysulfone Poly(tetrafluoroethylene) Poly(tetramethylene terephthalate) Polyurethane Polyurethane rubber... [Pg.939]

Blend Preparations. Blends were made from Uie E/ABP sensitizers and several polyethylenes (E). We used a branched polyethylene, Alathpolyethylene resin, a medium density polyethylene designated Super C, and two hi -denslty polyethylenes, Alathon 7030 and TOHo, GBie E to E/ABP volume ratios ranged from 4A to 22A and laie overall ABP concentrations from... [Pg.77]

Early fibreboards were developed by taking fibre from a wet-process fibre line, drying this, mixing it with resin, and pressing it as had been done for particleboard. However, in the last three decades medium density fibreboard (MDF), a UF bonded and dry formed panel, has largely replaced the early fibreboard products. [Pg.435]

The major difference between the fibres used to make medium density fibreboard and the particles used to make particleboard is the greater slenderness ratio of the fibres. This is the reason why mechanical blenders designed for particleboard were not satisfactory for MDF. It is also the reason why the bulk density of fibre is low, particularly with fibres prepared from a chipped material. The fibres form networks that are quite strong, with fibres able to span considerable distances. The mats formed from such fibres hold together so that formed or even trimmed edges hold their shape. There is no requirement for tack from the resin to hold the fibre mat together. [Pg.454]

The most widely used wood panel products are particleboard, softwood plywood, hardwood plywood, medium density fiberboard (MDF) and waferboard. The most common adhesive is urea-formaldehyde resin (UFR). Phenol-formaldehyde resins (PFR) are second in volume and melamine-formaldehyde resins (MFR) are a distant third. Recently,... [Pg.1]

If we consider as an example a relative air humidity of 50% and a temperature of 25 l, the wood moisture content would be 9.2 wt% (3. If we further consider that the product manufacturing process leaves about 1 wt% of the formaldehyde content of the UF resin as unreacted formaldehyde, we obtain for particleboard or medium density fiberboard (MDF), where UF-resin makes up 6-10 wt%, an approximate formaldehyde concentration of 0.2 M in the S-2 cell of the wood. [Pg.73]

The first three chapters deal with particleboard, medium density fiberboard, hardwood plywood, and softwood plywood, the four most widely used wood panel products. Chapter four compares these products with other consumer products. Chapters five through seven explain the basic chemistry of formaldehyde with cellulose and wood components and provide a current understanding of the nature of liquid urea-formaldehyde adhesive resins. The next two chapters present new analytical methods that might become useful in the future. Chapters eight and eleven through sixteen explain the complex nature of the latent formaldehyde present in the products and its correlation to formaldehyde emission from wood products. Chapters fifteen and sixteen describe currently popular formaldehyde reduction methods. The last two chapters discuss the problems involved in reducing formaldehyde emission by regulating air levels or source emissions. [Pg.245]

The typical resin densities may range from 0.6 g/cc to 1.3 g/cc for organic polymers. Silicate materials may be more dense up to 6 g/cc. Since the fermentation broth or other biochemical fluid may be more dense than water, the slow flow rates that are usually involved may require resins that have a greater density than water. A minimum flow rate may be necessary to maintain a packed bed when a fluid denser than water is being processed by a medium density resin. If this is not possible, an up-flow operation or batch process may be necessary. This is discussed in more detail in Sec. 6. [Pg.418]

Figure 14 Contact angle of resin to alumina substrate (A) APP, 10,000, 20,000 molecular weight (B) APP, 6000 molecular weight (C) low-density polyethylene (D) EVA (30% vinyl acetate) (E), (F) medium-density polyethylene (G) polystyrene. (After Ref. 17.)... Figure 14 Contact angle of resin to alumina substrate (A) APP, 10,000, 20,000 molecular weight (B) APP, 6000 molecular weight (C) low-density polyethylene (D) EVA (30% vinyl acetate) (E), (F) medium-density polyethylene (G) polystyrene. (After Ref. 17.)...
The moisture content of glued furnish chips is 7 to 8% for the board core and 10 to 12% for the surface. The resin contents used (i.e., solids) are 6 to 8% for board core and 10 to 11% for board surfaces, but such proportions might be higher for the weaker low emission adhesives used today and depending for the application envisaged [i.e., particleboard or medium density fiberboard (MDF)]. [Pg.635]

Another noteworthy application of pMDI binders is in the manufacture of Ag-Fiber composites, particularly straw-based panels that compete in particleboard and some medium density fiberboard markets [48 50]. The hydrophobic straw cuticle is difficult to wet, and so the low surface tension of pMDI is a clear advantage. The higher surface tension UF resins do not wet the straw surface as well. Furthermore, straw buffering properties may also complicate the application of UF resins to straw-based... [Pg.683]

Monofunctional hydroxyl terminated polyethylene oxide chains with degree of polymerization from 5 to 20 are reacted with pMDI, or simply with MDI, to provide surface active agents. The resulting surface active agent is then mixed with pMDI to provide a resin which is dispersible in water, resulting in an oil-in-water emulsion [51]. Such emulsions are stable for brief periods, 1 to 2 hours, before the water reaetion eauses gelation. Emulsifiable pMDI could be used where dispersion in water offers some benefit. For example, neat emulsifiable pMDI could be added directly to the blow line for medium density fiberboard production. Water emulsified pMDI has been used for improving resin distribution in particleboard or OSB manufacture however, this is not common industrial practice. [Pg.684]

The various aminoplastic resins are the most important class of adhesives in the wood-based panels industry, especially for the production of particleboards and medium density fibreboard (MDF), and partly also for oriented strandboard (OSB), plywood, block-boards, and some other types of wood panels. They are also used in the furniture industry as well as in carpenters shops. [Pg.876]


See other pages where Resin medium-density is mentioned: [Pg.160]    [Pg.160]    [Pg.399]    [Pg.390]    [Pg.319]    [Pg.298]    [Pg.856]    [Pg.190]    [Pg.319]    [Pg.390]    [Pg.394]    [Pg.21]    [Pg.259]    [Pg.166]    [Pg.109]    [Pg.10]    [Pg.390]    [Pg.234]    [Pg.487]    [Pg.247]    [Pg.557]    [Pg.251]    [Pg.681]    [Pg.159]    [Pg.558]   


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MEDIUM-DENSITY

Resin densities

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