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Insulators defined

Fig. 2. Change in insulation value with time for insulation of various thicknesses. SHce thickness = 2.5-6 mm and R ate defined as thermal resistance at... Fig. 2. Change in insulation value with time for insulation of various thicknesses. SHce thickness = 2.5-6 mm and R ate defined as thermal resistance at...
Dielectric Film Deposition. Dielectric films are found in all VLSI circuits to provide insulation between conducting layers, as diffusion and ion implantation (qv) masks, for diffusion from doped oxides, to cap doped films to prevent outdiffusion, and for passivating devices as a measure of protection against external contamination, moisture, and scratches. Properties that define the nature and function of dielectric films are the dielectric constant, the process temperature, and specific fabrication characteristics such as step coverage, gap-filling capabihties, density stress, contamination, thickness uniformity, deposition rate, and moisture resistance (2). Several processes are used to deposit dielectric films including atmospheric pressure CVD (APCVD), low pressure CVD (LPCVD), or plasma-enhanced CVD (PECVD) (see Plasma technology). [Pg.347]

Deposition of Thin Films. Laser photochemical deposition has been extensively studied, especially with respect to fabrication of microelectronic stmctures (see Integrated circuits). This procedure could be used in integrated circuit fabrication for the direct generation of patterns. Laser-aided chemical vapor deposition, which can be used to deposit layers of semiconductors, metals, and insulators, could define the circuit features. The deposits can have dimensions in the micrometer regime and they can be produced in specific patterns. Laser chemical vapor deposition can use either of two approaches. [Pg.19]

Fig. 6. Band model for the charge mode detector biased to deep depletion. The charge, integrates in the potential well defined by the insulator and... Fig. 6. Band model for the charge mode detector biased to deep depletion. The charge, integrates in the potential well defined by the insulator and...
A guarded hot-plate method, ASTM D1518, is used to measure the rate of heat transfer over time from a warm metal plate. The fabric is placed on the constant temperature plate and covered by a second metal plate. After the temperature of the second plate has been allowed to equiUbrate, the thermal transmittance is calculated based on the temperature difference between the two plates and the energy required to maintain the temperature of the bottom plate. The units for thermal transmittance are W/m -K. Thermal resistance is the reciprocal of thermal conductivity (or transmittance). Thermal resistance is often reported as a do value, defined as the insulation required to keep a resting person comfortable at 21°C with air movement of 0.1 m/s. Thermal resistance in m -K/W can be converted to do by multiplying by 0.1548 (121). [Pg.461]

The covalent compounds of graphite differ markedly from the crystal compounds. They are white or lightly colored electrical insulators, have Hi-defined formulas and occur in but one form, unlike the series typical of the crystal compounds. In the covalent compounds, the carbon network is deformed and the carbon atoms rearrange tetrahedraHy as in diamond. Often they are formed with explosive violence. [Pg.572]

Explosion-proof enclosures are characterized by strong metal enclosures with special close-fitting access covers and breathers that contain an ignition to the inside of the enclosure. Field wiring in the hazardous environment is enclosed in a metal conduit of the mineral-insulated-cable type. All conduit and cable connections or cable terminations are threaded and explosion-proof. Conduit seals are put into the conduit or cable system at locations defined by the National Electric Code (Article 501) to prevent gas and vapor leakage and to prevent flames from passing from one part of the conduit system to the other. [Pg.786]

Prospective amplitude, V, (Figure 17.4), to define the insulation endurance of the current-carrying system. Only the first highest peak is of significance for this purpose, which will contain the maximum severity. The subsequent peaks are of moderate magnitudes and of little consequence for the system or the terminal equipment. [Pg.558]

Since the standard insulation level (BIL) of a machine, equipment or a system is already defined, according to Tables 11,6. 14.1, 32.1(A), 13.2 and 13.3. the mtichines are aecordingly designed for this btisic insulation (BIL) only. When the prospective surges are expected to be more severe than this, separate protection becomes imperative. This is particularly important for a rotating machine w hich, besides being a dry equipment, also has only a limited space within the stator slots and hence has the smallest BIL of all, as is evident from Table I 1.6. compared to Tables 14.1, 32.1(A) and 13.2. For its comprehensive protection it can be considered in two parts,... [Pg.579]

BIL is the basic insulation level of equipment. When the system TOV or voltage surges exceed this level, the equipment may yield. In the latest international and national standards it is defined as follows ... [Pg.593]

In order to see why, we need to look at our car in a bit more detail (Fig. 5.2). We start by assuming that it is surrounded by a large and thermally insulated environment kept at constant thermodynamic temperature Tq and absolute pressure po (assumptions that are valid for most structural changes in the earth s atmosphere). We define our system as (the automobile -1- the air needed for burning the fuel -1- the exhaust gases... [Pg.48]

Insulation systems were first classified according to the material used, and permissible temperatures were established based on the thermal aging characteristics of these materials. For example. Class B insulation was defined as inorganic materials such as mica and glass with organic binders 130°C was the allowable maximum operating temperature. The present definition of insulation system Class B stipulates that the system be proven. . by experience or accepted tests. .. to have adequate life expectancy at its rated temperature, such life expectancy to equal or... [Pg.261]

Scanning Auger Electron Spectroscopy (SAM) and SIMS (in microprobe or microscope modes). SAM is the most widespread technique, but generally is considered to be of lesser sensitivity than SIMS, at least for spatial resolutions (defined by primary beam diameter d) of approximately 0.1 im. However, with a field emission electron source, SAM can achieve sensitivities tanging from 0.3% at. to 3% at. for Pranging from 1000 A to 300 A, respectively, which is competitive with the best ion microprobes. Even with competitive sensitivity, though, SAM can be very problematic for insulators and electron-sensitive materials. [Pg.566]

Some of the other critical properties defined by the industry include volume resistivity, dielectric dissipation factor, insulative resistance and the like. [Pg.518]

The insulating property of any insulator will break down in a sufficiently strong electric field. The dielectric strength is defined as the electric strength (V/m) which an insulating material can withstand. For plastics the dielectric strength can vary from 1 to 1000 MV/m. Materials may be compared on the basis of their relative permittivity (or dielectric constant). This is the ratio of the permittivity of the material to the permittivity of a vacuum. The ability of a... [Pg.32]

Clothing affects heat and moisture loss. Increasing the thickness or number of layers of clothing increases its insulating capability and reduces body heat loss. Clothing insulation is usually described with the do unit. Originally, t do was defined as the thermal resistance necessary for comfort while sedentary in a uniform still air environment of 21 °C. In conventional SI nomenclature I do has a thermal resistance of 0.155 K m-/W. Some ensembles do values and associated comfort temperatures are shown in Fig. 5.4. [Pg.181]

We now want to study the consequences of such a model with respect to the optical properties of a composite medium. For such a purpose, we will consider the phenomenological Lorentz-Drude model, based on the classical dispersion theory, in order to describe qualitatively the various components [20]. Therefore, a Drude term defined by the plasma frequency and scattering rate, will describe the optical response of the bulk metal or will define the intrinsic metallic properties (i.e., Zm((a) in Eq.(6)) of the small particles, while a harmonic Lorentz oscillator, defined by the resonance frequency, the damping and the mode strength parameters, will describe the insulating host (i.e., /((0) in Eq.(6)). [Pg.97]

Fig. 11. The Bruggeman model (BM) lakes into account the modification of the effective medium by the adjunction of metal in the medium. The net effect is a broadening of the resonance peak. The parameters of the metallic spheres in these calculations are fuHp = I eV and fiV = 0.1 eV. The insulating host is defined by ftcOp i = 1 eV and ftf = 1 eV and fidiy = 20 eV. Note that the normal Drude curve is superimposed with the Bruggeman curve with/= 1. Fig. 11. The Bruggeman model (BM) lakes into account the modification of the effective medium by the adjunction of metal in the medium. The net effect is a broadening of the resonance peak. The parameters of the metallic spheres in these calculations are fuHp = I eV and fiV = 0.1 eV. The insulating host is defined by ftcOp i = 1 eV and ftf = 1 eV and fidiy = 20 eV. Note that the normal Drude curve is superimposed with the Bruggeman curve with/= 1.
The second part of the first law of thermodynamics arises when the requirement that the process be adiabatic is dropped recall that this means the system is not insulated, and processes can be caused by heating and cooling. In a general process (the only assumption is that matter is not added or removed from the system), if an amount of work W is done on the system and the energy changes by DE then the heat supplied to the system Q is defined by... [Pg.1127]

The insulation effectiveness of elements of building structures is represented by the //-value or thermal transmittance. As defined in Section 11.3.1, the //-value is the reciprocal of the sum of the thermal resistances and can be expressed as ... [Pg.113]

We have designed, manufactured and tested a prototype that may be applied in thermal control of electronic devices. It was fabricated from a silicon substrate and a Pyrex cover, serving as both an insulator and a window through which flow patterns and boiling phenomena could be observed. A number of parallel triangular micro-channels were etched in the substrate. The heat transferred from the device was simulated by different types of electrical heaters that provided uniform and non-uniform heat fluxes, defined here respectively as constant and non-constant values... [Pg.76]

An electric current can be defined as a flow of electrons. In conductors, such as metals, the attraction between the outer electrons and the nucleus of the atom is weak, the outer electrons can move readily and consequently metals are good conductors of electricity. In other materials, electrons are strongly bonded to the nucleus and are not free to move. Such materials are insulators (or dielectrics). In semiconductors, the conductivity falls between those of conductors and insulators. Table 13.1 lists the characteristics of all three groups. [Pg.347]

In the spectrum from classical intermetaUics to valence compounds to insulators, a smooth transition in their chemical bonding (metallic to ionic) is observed. At the border between Zind phases and metaUic phases, the typical properties of Zind phases diminish and metallic conductivity appears. However, it is inaccurate to impose and define a sharp boundary between classical Zind phases and the metallic phases (e.g.. Laves and Hume-Rothery phases), and it is in the overlapping regimes where much chemistry stiU remains to be discovered and understood. [Pg.161]


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