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Fabrication area

Practical application of fabric filters requires the use of a large fabric area in order to avoid an unacceptable pressure drop across the fabric. Baghouse size for a... [Pg.408]

It is also common practice to classify filter media by their materials of construction. Examples are cotton, wool, linen, glass fiber, porosmooth surface caused by carrying the warp (or the weft) on the fabric surface over many weft (or warp) yarns. Intersections between warp and weft are kept to a minimum, just sufficient to hold the fabric firmly together and still provide a smooth fabric surface. The percentage of open area in a textile filter indicates the proportion of total fabric area that is open, and can be determined by the following relationship ... [Pg.124]

Net fabric The gros.s fabric area less the area of fabric being continuously or periodically cleaned. [Pg.1234]

Air-to-cloth ratio The unit capacity of a fabric filter, i.e., the total volume of gas in actual m Vs divided by the gross or net fabric area in m. ... [Pg.1234]

Microfilters are used in the electronics industry, principally as final point-of-use filters for ultrapure water. The water is already very pure and almost completely particle- and salt-free, so the only potential problem is contamination in the piping from the central water treatment plant to the device fabrication area. Although fine filters with 0.1 pm pore diameter or less may be used, lifetimes are relatively long. [Pg.298]

Pig B Above 30 cm No discernible loss 60-90% loss of fabric area Total loss Up to 60% loss of fabric area... [Pg.188]

Fiber Properties Fabric Area Flame Spread, Time to Mark (s) ... [Pg.755]

In Sections 24.3 and 24.5 the flammability and fire resistance of individual fiber/fabric type are discussed. However, as also discussed before, the fire resistance of a fabric not only depends upon the nature of components and the FR treatments applied, but also on fabric area density, construction, air permeability, and moisture content. Nonwovens, for example, will have superior properties to woven or knitted structure, even if all other variables are kept the same.93 The air entrapped within the interstices of any fabric structure and between layers of fabrics within a garment assembly provides the real thermal insulation. For effective thermal and fire resistance in a fabric structure, these insulating air domains need to be maintained.22 In general, for protective clothing and fire-block materials, for best performance multilayered fabric structures are employed. The assembly structures can be engineered to maximize their performance. It is beyond the scope of this chapter to go into details of these composite structures hence the reader is referred to the literature on specified applications and products available. [Pg.757]

Are the polyethylene softeners particularly effective and useful in the narrow fabric area. These products differing only in concentration, are excellent emulsions, compatible with most finishing baths and supply good softening. [Pg.286]

In contrast with the applications for LDPE, about two-thirds of high-density polyethylene is used in molding applications, split about 40% into blow molding of bottles and containers, and 25% into injection-molded products. A further 10% of the total HOPE resin output is consumed in each of the pipe and electrical conduit fabrication areas, and for film and sheet products. [Pg.743]

Dusty operations are contained. Use of unit or portable dust collectors are avoided in fabrication areas especially in dispensing, unless the effectiveness of their exhaust filtration is demonstrated and the units are regularly maintained as per written approved procedures. [Pg.316]

Some of the limitations as highlighted in this chapter may restrain the scope of applications for microfabiication of various microcomponents as well as 3-D high-aspect-ratio sfructures for applications of microelectromechanical systems. These limitations offer new challenges to EMM for widening its scope of application not only in microdomain but also to nano fabrication areas. [Pg.183]

Other types of woven fabrics used as filter media are the twill and satin weaves. In the twiU weave, yam is woven over two and under one for a 2/1 twill and over three and under one for a 3/1 twill weave. The twill weave fabrics allow good flow rates and do not retain particles as well as the plain weave as a result, the filters do not blind as fast as the plain weave fabric filters. In the satin weave fabrics, the yams are woven over one and under four in both directions. These types of fabrics are not very effective in retaining particles but have the best cake release characteristics therefore, the filters can be cleaned with comparative ease. Woven fabric area densities are typically in the range of 200-500 gm" ... [Pg.69]

For most filtration applications involving monofilaments, the majority of diameters used are in the range 0.15-0.35 mm, yielding fabric area densities between 180 and 450 gm. Heavy duty filter belt applications, on the other hand, usually employ diameters from 0.3 to 1.0 mm resulting in area densities from 500 to... [Pg.89]

Whichever technique is used, it is important to remember that, although permeability results are a useful pointer in characterising the efficiency of a fabric, they must not be viewed in isolation but rather in conjunction with other fabric parameters, such as the thickness (nonwoven fabrics), area density, and the threads per unit area (fabric sett). [Pg.106]

As a part of this programme, composite yams were developed and the results showed that the properties of the yams greatly influence the slash resistant properties. Further work could be conducted by concentrating solely on the yams and in studying the cut resistant properties of the yams. The combination of fibres used in the composite yams could be altered to further reduce the fabric area density and also to enhance the comfort of the fabric. [Pg.231]

For micro- and nanofluidic devices, sputtering is usually performed after channel fabrication. Areas that do not require sputter coating are masked off using a lift-off layer. This could be a specially fabricated photoresist layer, or it could just be the chromium mask leftover from the channel etching step. The structured substrate is placed into the sputtering chamber where it is sputtered with the desired material. Then it is removed and the lift-off layer dissolves, leaving... [Pg.3072]

If A is the fabric area under load, then the percentage energy loss is... [Pg.287]

Reynolds group has made extensive contributions to the device fabrication area using these thiophene-based polymers by obtaining ECDs with high contrast ratios and fast response times by two different approaches materials development and designing dual-type devices [3a, 12, 19]. [Pg.776]

Figure 4.11 demonstrates three different fabrics. Below the flat fabric on top a one-axis bulging or draped fabric is presented in the middle. At the bottom, a multiaxis bulging fabric encircled by flat fabric areas represents a fabric type that will have... [Pg.114]

Wang, X.Y., Gong, R.H., 2006b. Thermally bonded nonwoven filters prepared using bicomponent PP/PET fibre II. Relationships between fabric area density, air permeability and pore size distribution. J. Appl. Polym. Sci. 102 (3), 2264-2274. [Pg.206]

All sensor yams used do not reach the fabric area with the same level of degradation. The metallic connection wires attached to the sensor yams can break under high and dynamic stress values of the weaving reed and weft yam beat-up at the fabric-forming line. Sensor yams successfully inserted into the fabric and not completely degraded have an increase of their initial strength value by a multiplicative factor of two to five. [Pg.394]

The wafer is processed through a series of machines, where it is ground smooth and chemically polished to a mirrorlike finish (i.e., luster). The wafers are then ready to be sent to the wafer-fabrication area, where they are used as the starting material for manufacturing integrated circuits. The heart of semiconductor manufacturing is the wafer-fabrication facility where the integrated circuit is formed in and on the wafer. The fabrication process, which takes place in a clean room, involves a series of steps described below. Typically it takes from 10 to 30 d to complete the fabrication process. [Pg.473]


See other pages where Fabrication area is mentioned: [Pg.460]    [Pg.351]    [Pg.409]    [Pg.1234]    [Pg.1241]    [Pg.83]    [Pg.190]    [Pg.460]    [Pg.442]    [Pg.361]    [Pg.174]    [Pg.731]    [Pg.731]    [Pg.738]    [Pg.751]    [Pg.351]    [Pg.173]    [Pg.91]    [Pg.173]    [Pg.21]    [Pg.233]    [Pg.268]    [Pg.13]    [Pg.26]    [Pg.108]    [Pg.114]    [Pg.118]   
See also in sourсe #XX -- [ Pg.448 ]




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