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Electronic devices transistors

Use Solid-state electronic devices (transistors, diodes), semiconducting applications, brazing alloys, phosphors, gold and beryllium alloys, infrared-transmitting glass. [Pg.603]

Basic Electronic Devices. Transistor-based digital technology has replaced older vacuum tube technology, except in rare instances in which a transistorized device cannot perform the same function. Electronic circuits based on vacuum tubes could carry out essentially the same individual operations as transistors, but they were severely limited by physical size, heat production, energy consumption, and mechanical failure. Nevertheless, vacuum tube technology was the basic technology that produced radio. [Pg.625]

Eig. 3. Cross sections of electronics devices used in ICs. (a) NMOS transistor (b) a twin-tub CMOS device on an n-ty e substrate. [Pg.345]

Fig. 4. Some electronic device applications using amorphous silicon (a) solar cell, (b) thin-fiLm transistor, (c) image sensor, and (d) nuclear particle detector. Fig. 4. Some electronic device applications using amorphous silicon (a) solar cell, (b) thin-fiLm transistor, (c) image sensor, and (d) nuclear particle detector.
These are unidirectional and uncontrollablet static electronic devices and used as static switches and shown in Figure 6.14. A diode turns ON at the instant it becomes forward biased and OFF when it becomes reverse biased. By connecting them in series parallel combinations, they can be made suitable for any desired voltage and current ratings. Whether it is a transistor scheme or a thyristor scheme, they are used extensively where a forward conduction alone is necessary and the scheme calls for only a simple switching, without any control over the switching operation. They are used extensively in a rectifier circuit to convert a fixed a.c. supply to a fixed d.c. supply. [Pg.112]

Very recently, it has been reported that SWCNT can be synthesized by decomposition of benzene with Fe catalyst [27]. It would be of most importance to establish the controllability of the diameter and the helical pitch in this kind of synthesis of SWCNT toward the development of novel kinds of electronic devices such as single molecule transistor [41]. It can be said that this field is full of dream. [Pg.10]

Silicon shows a rich variety of chemical properties and it lies at the heart of much modern technology/ Indeed, it ranges from such bulk commodities as concrete, clays and ceramics, through more chemically modified systems such as soluble silicates, glasses and glazes to the recent industries based on silicone polymers and solid-state electronics devices. The refined technology of ultrapure silicon itself is perhaps the most elegant example of the close relation between chemistry and solid-state physics and has led to numerous developments such as the transistor, printed circuits and microelectronics (p. 332). [Pg.328]

Contacts are the elementary building blocks for all electronic devices. These include interfaces between semiconductors of different doping type (homojunctions) or of different composition (heterojunctions), and junctions between a metal and a semiconductor, which can be either rectifying (Schotlky junction) or ohmic. Because of their primary importance, the physics of semiconductor junctions is largely dealt with in numerous textbooks [11, 12]. We shall concentrate here on basic aspects of the metal-semiconductor (MS) and, above all, metal-insulator-semiconductor (MIS) junctions, which arc involved in the oiganic field-effect transistors. [Pg.245]

OFETs constructed on a silicon wafer do not lake advantage of one of the main interest of organic materials, namely the possibility of building electronic devices on plastic substrates. A second important drawback of the silicon-based structure is the difficulty to individually address the gale of transistors built on the same wafer, which would prevent the achievement of integrated circuits. [Pg.258]

Solid-state electronic devices such as diodes, transistors, and integrated circuits contain p-n junctions in which a p-type semiconductor is in contact with an n-type semiconductor (Fig. 3.47). The structure of a p-n junction allows an electric current to flow in only one direction. When the electrode attached to the p-type semiconductor has a negative charge, the holes in the p-type semiconductor are attracted to it, the electrons in the n-type semiconductor are attracted to the other (positive) electrode, and current does not flow. When the polarity is reversed, with the negative electrode attached to the n-type semiconductor, electrons flow from the n-type semiconductor through the p-type semiconductor toward the positive electrode. [Pg.251]

In recent years further concepts have been developed for the construction of polymer-based diodes, requiring either two conjugated polymers (PA and poly(A-methyl-pyrrole) 2 > or poly(A-methylpyrrole in a p-type silicon wafer solid-state field-effect transistor By modifying the transistor switching, these electronic devices can also be employed as pH-sensitive chemical sensors or as hydrogen or oxygen sensors 221) in aqueous solutions. Recently a PPy alcohol sensor has also been reported 222). [Pg.34]

Many active electronic devices can be operated at cryogenic temperatures [45], They are generally of the field-effect transistor (FET) type and are based on silicon (working down to 100K) or gallium arsenide (working even below 4K). [Pg.319]

Manipulating surface states of semiconductors for energy conversion applications is one problem area common to electronic devices as well. The problem of Fermi level pinning by surface states with GaAs, for example, raises difficulties in the development of field effect transistors that depend on the... [Pg.69]

Kane, M. G. Goodman, L. Firester, A. H. van der Wilt, P. C. Limanov, A. B. Im, J. S. 2005.100MHz CMOS circuits using sequential laterally solidified silicon thin-film transistors on plastic. IEEE International Electron Devices Meeting Tech. Digest 2005 1087-1089. [Pg.29]

J.H. Kim, Y. Hong, and J. Kanicki, Amorphous silicon thin-film transistors-based organic polymer light-emitting displays, IEEE Electron Device Lett., 24, 451-453, 2003. [Pg.616]

M. Graf, S.K. Muller, D. Barrettino, and A. Hierlemann. Transistor heater for microhotplate-based metal-oxide microsensors , JEEE Electron Device Letters 26 (2005), 295-297. [Pg.119]

The idea of exploiting these new conducting polymers for the development of flexible diodes and junction transistors, as well as for selective field effect transistor sensors, has been proposed and experimentally confirmed, and thus we may, perhaps optimistically, look forward to a time when popular electronic devices can be based on low cost, flexible and modular polymer components. [Pg.229]

A small amount of boron is added as a dope to silicon transistor chips to facilitate or impede the flow of current over the chip. Boron has just three valence electrons sihcon atoms have four. This dearth of one electron in boron s outer shell allows it to act as a positive hole in the silicon chip that can be filled or left vacant, thus acting as a type of switch in transistors. Many of today s electronic devices depend on these types of doped-sihcon semiconductors and transistors. [Pg.177]

Silicon s tetravalent pyramid crystalline structure, similar to tetravalent carbon, results in a great variety of compounds with many practical uses. Crystals of sihcon that have been contaminated with impurities (arsenic or boron) are used as semiconductors in the computer and electronics industries. Silicon semiconductors made possible the invention of transistors at the Bell Labs in 1947. Transistors use layers of crystals that regulate the flow of electric current. Over the past half-century, transistors have replaced the vacuum tubes in radios, TVs, and other electronic equipment that reduces both the devices size and the heat produced by the electronic devices. [Pg.196]

Control of alignment of n-conjugated polymers on the substrate is important for excellent performance of the polymer in electronic devices (e.g., higher mobility of carrier in field-effect transistors [134,136]). Details of the molecular structure and molecular assembly of PAEs will be discussed in other chapters. [Pg.199]


See other pages where Electronic devices transistors is mentioned: [Pg.351]    [Pg.351]    [Pg.199]    [Pg.370]    [Pg.371]    [Pg.372]    [Pg.373]    [Pg.512]    [Pg.524]    [Pg.159]    [Pg.221]    [Pg.3]    [Pg.128]    [Pg.340]    [Pg.464]    [Pg.94]    [Pg.230]    [Pg.77]    [Pg.127]    [Pg.177]    [Pg.335]    [Pg.565]    [Pg.115]    [Pg.204]    [Pg.177]    [Pg.295]    [Pg.1]    [Pg.180]    [Pg.245]    [Pg.282]    [Pg.341]   
See also in sourсe #XX -- [ Pg.284 , Pg.285 ]




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