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Oxidation base metal

Pt(IV) than Pd(n) [49], An interesting system, with asymmetric inorganic membranes, was used for selective metal ion separation. The membrane phase was a self-assembled monolayer of alkyl thiols as a hydrophobic phase for a trialkyl phosphate and phosphine oxide-based metal ion carrier. This organic mixture was attached on alumina porous supports with thin layers of gold. The thin membrane layer gave high fluxes and high selectivity, while metal ions transport was carrier limited [50]. [Pg.98]

Copperhead. A fault (reddish-brown spots) liable to appear in the ground-coat during vitreous enamelling the spots are exposed areas of oxidized base metal. Causes include boiling from the base-metal, inadequate metal preparation, very thin application of enamel, and the presence of acid salts in the enamel slip. [Pg.73]

Phosphorus pentoxide Formic acid, HF, inorganic bases, metals, oxidants, water... [Pg.1211]

In addition to oxidation itself, gas diffusion into the base metal can be more damaging than the actual loss of metal from the surface. Thus the loss in mechanical properties owing to diffusion of oxygen into niobium makes it more difficult to protect niobium against oxidation damage than molybdenum, even though molybdenum has less resistance to normal oxidation effects than niobium. [Pg.127]

Metal Cleaning. About 204 thousand metric tons of HCl (100% basis) was consumed in 1993 for steel pickling, wherein the hydrochloric acid readily dissolves all of the various oxides present in the scale formed during the hot rolling process. Using suitable inhibitors such as alkyl pyridines, HCl reacts very slowly with the base metal rendering the surface so clean that it must be passivated with a mild alkaline rinse. [Pg.451]

Under severe conditions and at high temperatures, noble metal films may fail by oxidation of the substrate base metal through pores in the film. Improved life may be achieved by first imposing a harder noble metal film, eg, rhodium or platinum—iridium, on the substrate metal. For maximum adhesion, the metal of the intermediate film should ahoy both with the substrate metal and the soft noble-metal lubricating film. This sometimes requires more than one intermediate layer. For example, silver does not ahoy to steel and tends to lack adhesion. A flash of hard nickel bonds weh to the steel but the nickel tends to oxidize and should be coated with rhodium before applying shver of 1—5 p.m thickness. This triplex film then provides better adhesion and gready increased corrosion protection. [Pg.251]

N. Singh, "VOC Destmetion at Low Temperatures Using a Novel Thermally Stable Transition-Metal Oxide-Based Catalyst," presented at the First North American Conference on Emerging Clean Air Technologies and Business Opportunities, Toronto, Canada, Sept. 1994. [Pg.531]

Skiving is a variant in which the base metal surface oxides are mechanically removed foUowed immediately by pressure rolling of a precious metal or alloy strip. This is commonly used for inlays for electrical contacts and for jewelry fabrication. The common inlay materials include gold, silver, copper, brass, and solder. No heat is needed, and the coating is appHed only to designated areas so there is Htde waste (3,50). [Pg.138]

Hard plating is noted for its excellent hardness, wear resistance, and low coefficient of friction. Decorative plating retains its brilliance because air exposure immediately forms a thin, invisible protective oxide film. The chromium is not appHed directiy to the surface of the base metal but rather over a nickel (see Nickel and nickel alloys) plate, which in turn is laid over a copper (qv) plate. Because the chromium plate is not free of cracks, pores, and similar imperfections, the intermediate nickel layer must provide the basic protection. Indeed, optimum performance is obtained when a controlled but high density (40—80 microcrack intersections per linear millimeter) of microcracks is achieved in the chromium lea ding to reduced local galvanic current density at the imperfections and increased cathode polarization. A duplex nickel layer containing small amounts of sulfur is generally used. In addition to... [Pg.119]

Fretting corrosion (36,37) can lead to high contact resistance of base metal contacts, such as tin plate in electronic connectors. Small cycHcal displacements of the connector halves occur because of external vibration or differential thermal expansion and contraction of the mating contacts. The wear debris that is formed remains in the contact zone. The accumulation of oxide debris in the contact region leads to increased contact resistance. Solutions to this problem are stmctures that do not permit movement of contact surfaces with respect to one another, the use of gold as a contact finish, and the appHcation of thick coatings of contact lubricants and greases, which reduce the rate of wear and restrict access of air to the contact surfaces. [Pg.32]

Each precious metal or base metal oxide has unique characteristics, and the correct metal or combination of metals must be selected for each exhaust control appHcation. The metal loading of the supported metal oxide catalysts is typically much greater than for nobel metals, because of the lower inherent activity pet exposed atom of catalyst. This higher overall metal loading, however, can make the system more tolerant of catalyst poisons. Some compounds can quickly poison the limited sites available on the noble metal catalysts (19). [Pg.503]

The most popular SCR catalyst formulations are those that were developed in Japan in the late 1970s comprised of base metal oxides such as vanadium pentoxide [1314-62-1J, V20, supported on titanium dioxide [13463-67-7] Ti02 (1). As for low temperature catalysts, NO conversion rises with increasing temperatures to a plateau and then falls as ammonia oxidation begins to dominate the SCR reaction. However, peak conversion occurs in the temperature range between 300 and 450°C, and the fah-off in NO conversion is more gradual than for low temperature catalysis (44). [Pg.511]

Critical factors. The basic cause of incomplete fusion is failure to elevate the temperature of the base metal, or of the previously deposited weld metal, to the melting point. In addition, failure to flux metal oxides or other foreign substances adhering to metal surfaces properly may interfere with proper fusion. [Pg.333]

The two types of hot eorrosion eause different types of attaek. High-temperature eorrosion features intergranular attaek, sulfide partieles and a denuded zone of base metal. Metal oxidation oeeurs when oxygen atoms eombine with metal atoms to form oxide seales. The higher the temperature, the more rapidly this proeess takes plaee, ereating the potential for failure of the eomponent if too mueh of the substrate material is eon-sumed in the formation of these oxides. [Pg.420]

Metallographic examination of other areas revealed similar degrees of corrosion on the two blades. At no point on the coated blade had the corrosion penetrated to the base metal, although in the two areas on the coated blade about 0.002 inch of the original 0.003 inch coating had been oxidized. [Pg.430]


See other pages where Oxidation base metal is mentioned: [Pg.2725]    [Pg.17]    [Pg.20]    [Pg.341]    [Pg.350]    [Pg.36]    [Pg.47]    [Pg.379]    [Pg.550]    [Pg.115]    [Pg.116]    [Pg.127]    [Pg.298]    [Pg.332]    [Pg.107]    [Pg.120]    [Pg.129]    [Pg.130]    [Pg.136]    [Pg.226]    [Pg.226]    [Pg.226]    [Pg.512]    [Pg.42]    [Pg.43]    [Pg.41]    [Pg.392]    [Pg.82]    [Pg.241]    [Pg.69]    [Pg.30]    [Pg.30]    [Pg.489]    [Pg.514]    [Pg.2417]    [Pg.258]   
See also in sourсe #XX -- [ Pg.72 ]




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Amorphous metal oxides, acid-base

Base catalysis metal oxides

Base metal catalyst, oxidation

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Base metal oxidation catalysts, comparison

Binary metal oxides acid-base properties

Complementary metal oxide semiconductor-based sensors

Composite polymer electrolytes based on metal oxides

Composites metal oxide-based nanocomposites

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Interface between Transition Metal Oxides-Based Electrodes and Lithium Salts Electrolytes A Physicochemical Approach

Metal Oxide-Based Materials

Metal Oxide-Based Nanocomposites

Metal Oxide-Based Nanocomposites for Conductometric Gas Sensors

Metal Oxide-Based Thin-Film Transistors

Metal oxide Lewis acid-base reactions

Metal oxide semiconductor based film

Metal oxide-based compounds

Metal oxide-based compounds carbon

Metal oxide-based compounds cathode

Metal oxide-based compounds electron transfer reaction

Metal oxide-based compounds lengths

Metal oxide-based compounds method

Metal oxide-based compounds partial oxidation

Metal oxide-based compounds particle size

Metal oxide-based compounds porous structure

Metal oxide-based compounds surface defects

Metal oxide-based compounds surface modifications

Metal oxide-based compounds thermal stability

Metal oxide-based compounds titanium nitride

Metal oxide-based nanostructures

Metal oxide-based nanostructures chemical methods

Metal oxide-based nanostructures nanoparticles

Metal oxide-based nanostructures nanostructure synthesis

Metal oxide-based nanostructures self-assembly

Metal oxide-based networks

Metal oxide-based phases

Metal oxides acid-base properties

Metal-based oxidant

Metal-based oxidant

Metal-catalyzed water oxidation acid—base mechanism

Other Metal Oxide Based ETLs

Oxide solubilities in melts based on alkali- and alkaline-earth metal halides

Regularities of oxide solubilities in melts based on alkali and alkaline-earth metal halides

Single-base metal oxides

Stationary phases metal oxide-based

Thick-film-based metal-oxide sensors

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