Copper plating, 6.35

Selective Carburi ng. In most components, it is desirable to carburize only parts of the surface. To prevent other regions from carburizing, they must be protected. For holes, simple plugs of copper may be used. In some cases, copper plating can be appHed, but diffusion into the steel must be considered, and the copper may have to be machined off later. Coatings (qv), which can be appHed as a paste and then removed after heat treatment, are also available and include copper plating, ceramic coatings, and copper and tin pastes. 

The most serious form of galvanic corrosion occurs in cooling systems that contain both copper and steel alloys. It results when dissolved copper plates onto a steel surface and induces rapid galvanic attack of the steel. The amount of dissolved copper required to produce this effect is small and the increased corrosion is difficult to inhibit once it occurs. A copper corrosion inhibitor is needed to prevent copper dissolution. 

Zn) penny with a less expensive copper-plated penny made from zinc strip (Zn—0.8% Cu alloy) (133,134). Zinc blanks stamped from the Hazelett-cast roUed zinc are barrel-plated with copper prior to coining to produce the finished penny. In 1992, about 22,000 Mt of special high grade zinc were used to make 9.1 biUion pennies. 

Treatment of Industrial Wastes. The alkaline nature and inexpensive price of lime make it ideal for treatment of acid waste Hquors (6), including waste pickle Hquids from steel plants, wastes from metal plating operations, eg, chrome and copper plating, acid wastes from chemical and explosives plants, and acid mine wastewaters. 

Electroplating. Aluminum can be electroplated by the electrolytic reduction of cryoHte, which is trisodium aluminum hexafluoride [13775-53-6] Na AlE, containing alumina. Brass (see COPPERALLOYS) can be electroplated from aqueous cyanide solutions which contain cyano complexes of zinc(II) and copper(I). The soft CN stabilizes the copper as copper(I) and the two cyano complexes have comparable potentials. Without CN the potentials of aqueous zinc(II) and copper(I), as weU as those of zinc(II) and copper(II), are over one volt apart thus only the copper plates out. Careful control of concentration and pH also enables brass to be deposited from solutions of citrate and tartrate. The noble metals are often plated from solutions in which coordination compounds help provide fine, even deposits (see Electroplating). 

Copper-plating bath compositions of various types have been used. A typical bath formulation consists of 200 g copper sulfate crystals, 30 mL cone, sulfuric acid, 2 mL phenylsulfonic acid, and 1000 mL distUled water. A pure copper anode may be used a copper anode containing a trace of phosphoms reduces sludge accumulation in the plating bath. 

Electroless copper solutions underwent similar development during the same period (10). Early printed circuit boards used mechanically attached eyelets to provide electrical conductivity between the copper sheathing laminated on two sides of a plastic board. Electroless copper plating provided a less expensive, better conductive path, allowing much greater numbers and smaller sizes of holes. Later, electroless coppers even replaced the laminated bulk copper sheathing in the semiadditive and additive processes (see Copper). 

The ideal electroless solution deposits metal only on an immersed article, never as a film on the sides of the tank or as a fine powder. Room temperature electroless nickel baths closely approach this ideal electroless copper plating is beginning to approach this stabiHty when carefully controUed. Any metal that can be electroplated can theoretically also be deposited by electroless plating. Only a few metals, ie, nickel, copper, gold, palladium, and silver, are used on any significant commercial scale. 

Electroless nickel or nickel—lead alloys can improve the solderabiUty and braisabiUty of aluminum even when a continuous film is not present. Electroless nickel systems based on dimethylaminehorane reduciag agents are used to coat aluminum contacts and semiconductors (qv) ia the electronics iadustry. Newer uses iaclude corrosion-resistant electroless nickel topcoatings on electroless copper plating for radio frequency... 

The cost of the chemicals used in electroless copper plating is very low, rarely exceeding 2.78/m, except for fully additive processes. The principal costs of printed circuit board production arise mainly from handling steps and other operations. 

SemiadditiveMethod. The semiadditive method was developed to reduce copper waste. Thin 5.0 lm (4.5 mg/cm ) copper foil laminates are used, or the whole surface may be plated with a thin layer of electroless copper. Hole forming, catalysis, and electroless copper plating are done as for subtractive circuitry. A strippable reverse—resist coating is then appHed. Copper is electroplated to 35 p.m or more, followed by tin or tin—lead plating to serve as an etch resist. The resist is removed, and the whole board is etched. The original thin copper layer is quickly removed to leave the desired circuit. This method wastes less than 10% of the copper. 

Other decoratively plated coatings produced in quantity are copper and copper alloys. Copper-plated hardware for cabinetry, lighting fixtures, household trim, and other uses is protected using a top coat of clear lacquer. Copper plating finishes are available with a variety of post-treatments to simulate antique or mstic appearances. 

Copper anodes for use in acid copper plating solutions preferably contain a small amount of phosphoms [7723-14-0] usually 0.03—0.04 wt %, which retards chemical dissolution of the copper and thus the subsequent copper build-up. Typically, acid copper plating solutions increase in copper and require periodic dilution. Additionally, additives for brightening acid copper baths tend to last longer in plating tanks using phosphorized copper anodes. In cyanide copper solutions, phosphorized copper anodes should not be used. 

Copper. Copper plating, used as a final finish in some appHcations, is primarily employed as an undercoat for other deposits. Of the several types of copper baths, the two most popular in the United States are the acid sulfate and the cyanide baths. Acid copper caimot be used directly over... 

Acid Copper. Bath compositions are shown in Table 8. The acid sulfate bath is by far the most widely used copper plating bath, both for plating and for electroforming and electrowinning. The fiuoborate baths have been Htde used in spite of the high current densities possible. Additional information can be found in the Hterature (98,99). 

J. Horner, "A Study of the Effects of Some Variables on the Speed and Distribution of Deposits from Cyanide Copper Plating Solutions," 51 st... 

I Sometimes used for copper plate and for steel plate 12 gauge and heavier and for steel tubes. 

Area effects in galvanic corrosion are very important. An unfavorable area ratio is a large cathode and a small anode. Corrosion of the anode may be 100 to 1,000 times greater than if the two areas were the same. This is the reason why stainless steels are susceptible to rapid pitting in some environments. Steel rivets in a copper plate will corrode much more severely than a steel plate with copper rivets. 

The metal film is then electroplated with copper, and the metal part brazed to the copper plating. Adhesives, usually epoxy resins, are used to join parts at low temperatures. Finally, ceramic parts can be clamped together, provided the clamps avoid stress concentrations, and are provided with soft (e.g. rubber) packing to avoid contact stresses. 

Power packages not mounted on a suitable heatsink can expect to dissipate less than five percent of the maximum specified power capability of the package. So 100 W devices will only dissipate 1 to 2W when they are free standing. This also includes using the PC board copper plating as a heatsink. Thus, great discretion should be used when cost is the most important issue. 

Kupfer-oxydverbindung, /. cupric compound, copper(II) compound. -pecherz,n. = Kupferbraun. -platte, /. copper plate, copperplate. 

In 1909 one company began selling solar water heaters with separate collectors and insulated storage tanks. The collectors were made of copper tubing soldered to a copper plate in a glass covered box. The hot water was transferred to the storage tank by thermosyphon action, so the insulated tank had to be installed above the collector, typically in the attic or on the roof It was often connected to an auxiliary heater on the stove or furnace to supplement solar... 

Soldering Conventional soft solders can be used, but it is first essential to nickel- or copper-plate the molybdenum. 

The rate of corrosion and damage caused to the more negative metal will depend upon the relative sizes of the anodic (corroding metal) and cathodic areas. A small anode and a large cathode will result in intensive corrosion of the anodic area. On the other hand, if the anode is large compared with the cathode, the corrosion of the anodic area will be more general and less likely to result in rapid failure. For example, a steel rivet in a copper plate will be rapidly attacked in sea-water, whereas a copper rivet in a steel plate may lead only to slightly accelerated corrosion of the steel in the area adjacent to the rivet. Prediction of the rate of corrosion of the less noble metal... 

Magnetite Anodes of cast magnetite are now available. The anodes are produced as a hollow cylinder closed at one end (typically 60 mm diameter X 720 mm length). The method of cable connection is relatively difficult and requires the inner surface of the casting to be copper plated. At a current density of 75 Am consumption rates in seawater of less than 1 -5g/Ay are claimed. 

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