Electroless copper plating EQCM

Similarly, partial reaction currents in electroless copper-plating solution can be extracted using electrochemical quartz crystal microgravimetry (EQCM) to in situ monitor the rate of copper deposition under open-circuit conditions and as a function of the electrode potential... 

FIGURE 19.9 Extraction of the partial reaction rates for formaldehyde oxidation (o) ((A) measured by DEMS, Figure 19.6A) and copper Cu(II) ion reduction (dotted line) ((B) measured by EQCM, Figure 19.8A) as the difference with the net current (solid line) in the positive-going scan in electroless copper-plating solution (for details see captions of Figures 19.6A and 19.8A). (From Pauliukaite, R. et al., J. Appl. Electrochem., 36, 1261, 2006.)... 

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